Abstract: An optical transmitter according to one embodiment includes a housing with an emission end, a light emitting element mounted on a first mounting portion of the housing, and a light receiving element mounted on a second mounting portion of the housing to monitor output light from the light emitting element. The second mounting portion is provided with a carrier, a first resin located on an emission end side of a lower side of the carrier, and a second resin located on a light emitting element side of the lower side of the carrier. A coefficient of thermal expansion of the first resin is smaller than a coefficient of thermal expansion of the second resin.

Abstract: An optical device according to one embodiment includes: a light-emitting element; first and second lenses optically coupled with the light-emitting element; an optical component provided between the light-emitting element and the second lens, optically coupling each of the light-emitting element and the second lens, and multiplexing input lights; and a base having a lower plate having a plurality of convex mounting surfaces with each of the light-emitting element, the first lens, the second lens, and the optical component being mounted thereon and a side wall with a receptacle being connected thereto.

Abstract: An optical transmitter according to one embodiment includes a housing with an emission end, a light emitting element mounted on a first mounting portion of the housing, and a light receiving element mounted on a second mounting portion of the housing to monitor output light from the light emitting element. The second mounting portion is provided with a carrier, a first resin located on an emission end side of a lower side of the carrier, and a second resin located on a light emitting element side of the lower side of the carrier. A coefficient of thermal expansion of the first resin is smaller than a coefficient of thermal expansion of the second resin.

Abstract: An optical transceiver that includes an optical modulator of a Mach-Zehnder type and made of primarily semiconductor materials, and an Erbium Doped Fiber Amplifier (fiber amplifier) is disclosed. The fiber amplifier and the MZ modulator, in addition to a wavelength tunable laser diode, an intelligent coherent receiver, and a polarization maintaining splitter, are installed within a compact case following the standard of CFP2. The fiber amplifier provides a wavelength tunable filter that passes light amplified by the fiber amplifier but eliminates amplified spontaneous emission in regions out of the wavelength band of the light.

Abstract: An optical transceiver that installs an optical modulator with the Mach-Zehnder type and made of primarily semiconductor materials, and an Erbium Doped Fiber Amplifier (fiber amplifier) is disclosed. The fiber amplifier and the MZ modulator, in addition to a wavelength tunable laser diode, an intelligent coherent receiver, and a polarization maintaining splitter, are installed within a compact case following the standard of CFP2. The fiber amplifier provides a wavelength tunable filter that passes light amplified by the fiber amplifier but eliminates amplified stimulated emission in regions out of the wavelength band of the light.

Abstract: An optical transceiver for the coherent communication system is disclosed. The optical transceiver follows the standard of the CFP transceiver and installs a wavelength tunable laser diode (LD) as a light source for the optical transmission and a local light for the optical reception; an optical modulator of the Mach-Zehnder type made of dielectric material; and an optical receiver to recover the DP-QPSK optical signal. The housing of the optical transceiver provides a front auxiliary area and a rear auxiliary area to install a slender optical modulator and to bend an inner fiber with a large radius.

Abstract: An optical transceiver for the coherent communication system is disclosed. The optical transceiver follows the standard of the CFP transceiver and installs a wavelength tunable laser diode (LD) as a light source for the optical transmission and a local light for the optical reception; an optical modulator of the Mach-Zehnder type made of dielectric material; and an optical receiver to recover the DP-QPSK optical signal The housing of the optical transceiver provides a front auxiliary area and a rear auxiliary area to install a slender optical modulator and to bend an inner fiber with a large radius.

Abstract: The present invention provides an optical transmitting module, in which a laser diode and a termination resistor are provided without sizing up the package thereof and degrading the thermal characteristic due to heat generation by the termination resistor. The transmitting module of the present invention includes the semiconductor laser diode, and the resistor. The laser diode is mounted on the side surface of the block extruding from the base. The resistor is mounted on the flat side portion of the end of the lead. The lead is secured in the through hole provided in the base with seal glass being filled in the gap between the through hole and the lead. In the transmitting module thus configured, the laser diode is thermally isolated from the heat generated by the resistor due to the seal glass.

Abstract: The present invention relates to an optical transceiver that installs an optical transmitting assembly and an optical receiving assembly both are compact, inexpensive, and capable of operating at a high speed. The optical transmitting assembly of the present invention provides the metal bottom that installs the thermoelectric cooler thereon and the semiconductor optical device is mounted, via the insulating substrate, on the thermoelectric cooler. The first and second multi-layered ceramic substrates are provided to surround the thermoelectric cooler. The DC signal or the low-frequency signal for the thermoelectric cooler and the semiconductor optical device is supplied through the first ceramic substrate, while the high frequency signal for the semiconductor device, with the complementary signal having the opposite phase to the high frequency signal, is provided to the semiconductor device through the inner layer of the second ceramic substrate and the insulating substrate.

Abstract: The present invention provides an optical transmitting module capable of outputting a signal for precisely controlling bias and modulation current, and a transmitting optical sub-assembly using the same. The optical transmitting module of the invention builds a semiconductor laser diode 5 and a temperature sensor within a CAN type package. The CAN type package includes a base, a block provided on the base and mounting the laser diode on a side thereof, and a plurality of leads secured to the base. The laser diode is supplied current signal SDRV through one of leads, while the temperature sensor outputs a signal STEMP through the other of leads. The temperature sensor is mounted immediately close to the laser diode, accordingly, capable of monitoring the temperature of the laser diode.

Abstract: The present invention provides an optical transmitting module or optical transmitting sub-assembly in which an inductor for de-coupling the bias circuit of the semiconductor laser diode is built. The laser diode is mounted on the side surface of the block provided on the stem, while the inductor is installed on the lead, which is secured by the stem, such that one electrode of the inductor is in contact to the lead and the other electrode of the inductor is connected to an electrode of the laser diode. The electrode of the laser diode is also connected to the other lead. Thus, the electrode of the laser diode is connected to two leads, one of which is through the inductor.

Abstract: The present invention relates to an optical transceiver that installs an optical transmitting assembly and an optical receiving assembly both are compact, inexpensive, and capable of operating at a high speed. The optical transmitting assembly of the present invention provides the metal bottom that installs the thermoelectric cooler thereon and the semiconductor optical device is mounted, via the insulating substrate, on the thermoelectric cooler. The first and second multi-layered ceramic substrates are provided to surround the thermoelectric cooler. The DC signal or the low-frequency signal for the thermoelectric cooler and the semiconductor optical device is supplied through the first ceramic substrate, while the high frequency signal for the semiconductor device, with the complementary signal having the opposite phase to the high frequency signal, is provided to the semiconductor device through the inner layer of the second ceramic substrate and the insulating substrate.

Abstract: A light-transmitting module of the present invention includes a light-emitting device such as a laser diode (LD), a transistor for shunting-drive the LD and a CAN type package with a base and an electrically conductive block. The LD and the transistor are mounted on a side of the block in side-by-side arrangement such that the LD substantially positions a center of the package. One of the current terminals of the transistor and one electrode of the LD are connected via the conductive block. The other of the current terminal of the transistor and the other of the electrodes of the LD are connected to one lead, while the control terminal of the transistor is connected to the other lead. Since the present module includes the transistor within the CAN type package, the size thereof may be miniaturized, and the quality of the optical output can be enhanced.

Abstract: An optical link module comprises a transmitting optical sub-assembly (TOSA), a receiving optical subassembly (ROSA), a board and electronic parts. The electronic parts are necessary for wire-bonding to connect electronic thereto and mounted only on either the first surface or the second surface of the board.

Abstract: An optical device has a package enclosing an LD and a driver circuit for driving the LD. The package has a laminated ceramic wiring board fixed on the top surface of a bottom plate. A sleeve, which is able to receive a ferrule of an optical connector plug, is attached to the front surface of the package. A flexible heat-dissipating sheet is disposed on the bottom surface of the bottom plate. The sheet dissipates heat generated in the package to the body of the optical module.

Abstract: The present invention provides an optical transmitting module or optical transmitting sub-assembly in which an inductor for de-coupling the bias circuit of the semiconductor laser diode is built. The laser diode is mounted on the side surface of the block provided on the stem, while the inductor is installed on the lead, which is secured by the stem, such that one electrode of the inductor is in contact to the lead and the other electrode of the inductor is connected to an electrode of the laser diode. The electrode of the laser diode is also connected to the other lead. Thus, the electrode of the laser diode is connected to two leads, one of which is through the inductor.

Abstract: The present invention provides an optical transmitting module capable of outputting a signal for precisely controlling bias and modulation current, and a transmitting optical sub-assembly using the same. The optical transmitting module of the invention builds a semiconductor laser diode 5 and a temperature sensor within a CAN type package. The CAN type package includes a base, a block provided on the base and mounting the laser diode on a side thereof, and a plurality of leads secured to the base. The laser diode is supplied current signal SDRV through one of leads, while the temperature sensor outputs a signal STEMP through the other of leads. The temperature sensor is mounted immediately close to the laser diode, accordingly, capable of monitoring the temperature of the laser diode.

Abstract: The present invention provides an optical transmitting module, in which a laser diode and a termination resistor are provided without sizing up the package thereof and degrading the thermal characteristic due to heat generation by the termination resistor. The transmitting module of the present invention includes the semiconductor laser diode, and the resistor. The laser diode is mounted on the side surface of the block extruding from the base. The resistor is mounted on the flat side portion of the end of the lead. The lead is secured in the through hole provided in the base with seal glass being filled in the gap between the through hole and the lead. In the transmitting module thus configured, the laser diode is thermally isolated from the heat generated by the resistor due to the seal glass.

Abstract: A light-transmitting module of the present invention includes a light-emitting device such as a laser diode (LD), a transistor for shunting-drive the LD and a CAN type package with a base and an electrically conductive block. The LD and the transistor are mounted on a side of the block in side-by-side arrangement such that the LD substantially positions a center of the package. One of the current terminals of the transistor and one electrode of the LD are connected via the conductive block. The other of the current terminal of the transistor and the other of the electrodes of the LD are connected to one lead, while the control terminal of the transistor is connected to the other lead. Since the present module includes the transistor within the CAN type package, the size thereof may be miniaturized, and the quality of the optical output can be enhanced.

Abstract: A wiring pattern of a circuit board comprises two reference voltage lines holding a signal line therebetween, whereas the reference voltage lines on both ends are electrically connected to a conductive bracket. The bracket covers and electrically shields lead pins connecting a light-receiving device unit or light-emitting device unit to the circuit board.