Abstract: A suspended platform is provided which can prevent an article from overturning and falling even when a great quake such as an earthquake occurs. The suspended platform is intended for an overhead traveling carriage which transfers an article having an abutting surface facing upward in a transfer direction on a horizontal plane and mounts the article on the suspended platform, the suspended platform including a tilt regulating part positioned, in relation to a receiving part on which the article is mounted, such that the tilt regulating part (i) does not touch the article when the article is transferred and mounted on the suspended platform, (ii) is above the abutting surface of the article when the article is transferred and mounted on the suspended platform, (iii) and regulates, by abutting the mounted article at the abutting surface, the tilt range of the article.

Abstract: A manufacturing method of a semiconductor device comprising the steps of: affixing a die attach film and a dicing film to a back surface of a semiconductor wafer: thereafter dicing the semiconductor wafer and the die attach film to divide the semiconductor wafer into a plurality of semiconductor chips: thereafter pulling the dicing film from the center toward the outer periphery of the dicing film with a first tensile force to cut the die attach film chip by chip; and thereafter picking up the semiconductor chips together with the die attach film while pulling the dicing film from the center toward the outer periphery of the dicing film with a second tensile force smaller than the first tensile force.

Abstract: A manufacturing method of a semiconductor device comprising the steps of: affixing a die attach film and a dicing film to a back surface of a semiconductor wafer: thereafter dicing the semiconductor wafer and the die attach film to divide the semiconductor wafer into a plurality of semiconductor chips: thereafter pulling the dicing film from the center toward the outer periphery of the dicing film with a first tensile force to cut the die attach film chip by chip; and thereafter picking up the semiconductor chips together with the die attach film while pulling the dicing film from the center toward the outer periphery of the dicing film with a second tensile force smaller than the first tensile force.

Abstract: An engine balancer includes a pair of balancer shafts and a balancer housing for housing the balancer shafts, and is placed in an oil pan at the bottom of an engine. The balancer housing includes a pair of front and rear bearing walls respectively supporting the balancer shafts with rolling bearings interposed therebetween. The bearing walls of the balancer housing are attached to bearing walls for a crankshaft. The housing body has an aperture at the top thereof. The aperture of the housing body is covered with a plate-shaped cover member thinner than a member forming the housing body.

Abstract: An overhead traveling vehicle travels along a rail suspended from an upper position. Further, a buffer is suspended from an upper position. The buffer can be retracted from a storage space for an article, or the buffer is foldable compactly.

Abstract: A suspended platform is provided which can prevent an article from overturning and falling even when a great quake such as an earthquake occurs. The suspended platform according to the present invention is intended for an overhead traveling carriage which transfers an article having an abutting surface facing upward in a transfer direction on a horizontal plane and mounts the article on the suspended platform, the suspended platform including a tilt regulating part positioned, in relation to a receiving part on which the article is mounted, such that the tilt regulating part (i) does not touch the article when the article is transferred and mounted on the suspended platform, (ii) is above the abutting surface of the article when the article is transferred and mounted on the suspended platform, (iii) and regulates, by abutting the mounted article at the abutting surface, the tilt range of the article.

Abstract: A manufacturing method of a semiconductor device comprising the steps of: affixing a die attach film and a dicing film to a back surface of a semiconductor wafer: thereafter dicing the semiconductor wafer and the die attach film to divide the semiconductor wafer into a plurality of semiconductor chips: thereafter pulling the dicing film from the center toward the outer periphery of the dicing film with a first tensile force to cut the die attach film chip by chip; and thereafter picking up the semiconductor chips together with the die attach film while pulling the dicing film from the center toward the outer periphery of the dicing film with a second tensile force smaller than the first tensile force.

Abstract: A manufacturing method of a semiconductor device comprising the steps of: affixing a die attach film and a dicing film to a back surface of a semiconductor wafer: thereafter dicing the semiconductor wafer and the die attach film to divide the semiconductor wafer into a plurality of semiconductor chips: thereafter pulling the dicing film from the center toward the outer periphery of the dicing film with a first tensile force to cut the die attach film chip by chip; and thereafter picking up the semiconductor chips together with the die attach film while pulling the dicing film from the center toward the outer periphery of the dicing film with a second tensile force smaller than the first tensile force.

Abstract: An overhead traveling vehicle travels along a rail suspended from an upper position. Further, a buffer is suspended from an upper position. The buffer can be retracted from a storage space for an article, or the buffer is foldable compactly.

Abstract: A safety frame is provided to face a lid at a position where an article is held by an overhead traveling vehicle. A lower frame of the safety frame is movable upwardly relative to an upper frame of the safety frame. Further, an optical axis of a photoelectric sensor is provided between the lower frame and the upper frame.

Abstract: A manufacturing method of a semiconductor device comprising the steps of: affixing a die attach film and a dicing film to a back surface of a semiconductor wafer: thereafter dicing the semiconductor wafer and the die attach film to divide the semiconductor wafer into a plurality of semiconductor chips: thereafter pulling the dicing film from the center toward the outer periphery of the dicing film with a first tensile force to cut the die attach film chip by chip; and thereafter picking up the semiconductor chips together with the die attach film while pulling the dicing film from the center toward the outer periphery of the dicing film with a second tensile force smaller than the first tensile force.

Abstract: A method and a container for long-term storage in a state in which harmful insects do not propagate, in a case in which grains such as unpolished rice or the like are filled and stored. An inner bag (10) made of a flexible material is accommodated in an outer bag (12) which has high-strength. After grains are filled in the inner bag, the inner bag (10) is filled with carbon dioxide gas and is closed. The grains are stored in a state in which harmful insects are exterminated. It is preferable from the standpoint of the insecticidal effect that the inner portion of the inner bag (10) is able to maintain a carbon dioxide gas concentration of 40% or more for 7 days or more. Because the inner bag has the property of a CO.sub.2 permeation amount of less than or equal to 6300 cc/m.sup.2 .multidot.24 hr 1 atm, an oxygen-deficient state can be maintained.

Abstract: A process is provided for separation of an asbestos-containing material from a surface to which the asbestos-containing material is adhered, while preventing floating of dust of the removed asbestos-containing material, the process requiring jetting of pressurized water from a plurality of nozzles to the surface at a pressure of at least 80 kg/cm.sup.2 so as to wet and remove the asbestos-containing material therefrom by the energy possessed by the pressurized water.