Patents by Inventor Eijiro Aoyagi

Eijiro Aoyagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9101062
    Abstract: A highly heat conductive metal-clad laminate, which may be included in a highly heat conductive polyimide film, has a metal layer on one or both sides of an insulating layer which has a heat conductive filler-filled polyimide layer. The insulating layer of the highly heat conductive metal-clad laminate or the highly heat conductive polyimide film having the filler-filled polyimide layer is characterized in that the content of the heat conductive filler in the filler-filled polyimide layer is 20-80 wt %, the heat conductive filler contains a plate-like filler with an average length DL of 0.1-15 ?m and a spherical filler with an average particle diameter DR of 0.05-10 ?m, DL and DR satisfy the relationship DL>DR/2, no heat conductive filler of 30 ?m or more is contained, and the coefficient of thermal expansion is in the range of 10-30 ppm/K.
    Type: Grant
    Filed: September 7, 2009
    Date of Patent: August 4, 2015
    Assignee: NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
    Inventors: Eijiro Aoyagi, Hongyuan Wang, Noriyuki Kirikae, Katsufumi Hiraishi
  • Publication number: 20110165410
    Abstract: Provided is a highly heat conductive metal-clad laminate which shows heat resistance, dimensional stability, workability, and adhesiveness and excellent thermal conductivity properties. Also provided is a highly heat conductive polyimide film. The highly heat conductive metal-clad laminate has a metal layer on one or both sides of an insulating layer which has a heat conductive filler-filled polyimide layer. The insulating layer of the highly heat conductive metal-clad laminate or the highly heat conductive polyimide film having the filler-filled polyimide layer is characterized in that the content of the heat conductive filler in the filler-filled polyimide layer is 20-80 wt %, the heat conductive filler contains a plate-like filler with an average length DL of 0.1-15 ?m and a spherical filler with an average particle diameter DR of 0.
    Type: Application
    Filed: September 7, 2009
    Publication date: July 7, 2011
    Inventors: Eijiro Aoyagi, Hongyuan Wang, Noriyuki Kirikae, Katsufumi Hiraishi