Abstract: According to one embodiment, a substrate processing system includes a measuring unit, a data processing unit, and a processing unit. The measuring unit is configured to measure information relating to a thickness dimension of a substrate. The substrate includes a light emitting unit and a wavelength conversion unit. The wavelength conversion unit includes a phosphor. The data processing unit is configured to determine processing information relating to a thickness direction of the wavelength conversion unit based on the measured information relating to the thickness dimension of the substrate and based on information relating to a characteristic of light emitted from the light emitting unit. The processing unit is configured to perform processing of the wavelength conversion unit based on the determined processing information.

Abstract: According to one embodiment, a substrate processing system includes a measuring unit, a data processing unit, and a processing unit. The measuring unit is configured to measure information relating to a thickness dimension of a substrate. The substrate includes a light emitting unit and a wavelength conversion unit. The wavelength conversion unit includes a phosphor. The data processing unit is configured to determine processing information relating to a thickness direction of the wavelength conversion unit based on the measured information relating to the thickness dimension of the substrate and based on information relating to a characteristic of light emitted from the light emitting unit. The processing unit is configured to perform processing of the wavelength conversion unit based on the determined processing information.

Abstract: A diffraction optical element is provided to reduce harmful lights and also suppress deterioration in the optical characteristics of the element. The diffraction optical element 22 is formed with a plurality of diffraction gratings 17?, 18?, 19? and 20?. From these diffraction gratings, there are selected the diffraction gratings 18?, 19? and 20? whose groove apex angles are less than a predetermined angle. The diffraction gratings 18?, 19? and 20? has chamfer surfaces 18c?, 19c? and 20c? formed on the lower side of respective slanted surfaces 18a?, 19a? and 20a?. The chamfer surfaces 18c?, 19c? and 20c? are slanted to the slanted surfaces 18a?, 19a? and 20a?, respectively.

Abstract: A diffraction optical element is provided to reduce harmful lights and also suppress deterioration in the optical characteristics of the element. The diffraction optical element 22 is formed with a plurality of diffraction gratings 17?, 18?, 19? and 20?. From these diffraction gratings, there are selected the diffraction gratings 18?, 19? and 20? whose groove apex angles are less than a predetermined angle. The diffraction gratings 18?, 19? and 20? has chamfer surfaces 18c?, 19c? and 20c? formed on the lower side of respective slanted surfaces 18a?, 19a? and 20a?. The chamfer surfaces 18c?, 19c? and 20c? are slanted to the slanted surfaces 18a?, 19a? and 20a?, respectively.

Abstract: A polishing pad according to the invention comprises a pad body having a polishing surface and a support surface and a plurality of hole apertures extending from the polishing surface to the support surface, each of the plurality of apertures having a noncircular shaped opening oriented at a predetermined angle with respect to a radial direction of the polishing pad.

Abstract: A polishing apparatus comprise a lower surface plate rotatably provided and having a polishing surface for polishing an object, and an upper surface plate for pressing the object against the lower surface plate, wherein the polishing surface can be dressed by a dresser comprising a dressing member approachable to and separable from the polishing surface, the dressing member having a dressing surface to be brought into contact with the polishing surface, the dressing surface being shaped as a hollow oval.

Abstract: A polishing machine comprise a support unit for horizontally supporting a work piece at an outer peripheral edge thereof, to be freely rotatable with a central axis thereof serving as a center of the rotation, a rotation driving unit for driving rotation of the work piece with the central axis thereof serving as a center of the rotation, a polishing plate provided to be opposite to a surface of the work piece and reciprocate along a direction of a diameter of the work piece, and pressed onto the surface of the work piece at a predetermined force and polishing cloth provided between the polishing plate and the surface of the work piece.

Abstract: A method of polishing which includes rotatably supporting a workpiece, positioning polishing plates in such a manner that flat surfaces of the polishing plates oppose one another and are in contact with a surface of the workpiece, and polishing the workpiece by rotating the workpiece around a central axis thereof by use of a workpiece rotator. The method also includes reciprocating the polishing plates on the surface of the workpiece in a radial direction of the workpiece while pressing the workpiece between the flat surfaces of the polishing plates.