Patents by Inventor Eijirou Miyagawa

Eijirou Miyagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210153348
    Abstract: A flexible laminated sheet manufacturing method includes thermocompression-bonding an insulation film formed of a liquid crystal polymer onto a metal foil between endless belts to form a flexible laminated sheet. The thermocompression bonding includes heating the flexible laminated sheet so that the maximum temperature of the sheet is in the range from a temperature that is 45° C. lower than the melting point of the liquid crystal polymer to a temperature that is 5° C. lower than the melting point. The thermocompression bonding also includes slowly cooling the flexible laminated sheet so that an exit temperature, which is a temperature of the sheet when transferred out of the endless belts, is in the range from a temperature that is 235° C. lower than the melting point of the liquid crystal polymer to a temperature that is 100° C. lower than the melting point.
    Type: Application
    Filed: January 25, 2021
    Publication date: May 20, 2021
    Inventors: Eisuke TACHIBANA, Taro SUZUKI, Makoto TOTANI, Kouji KONDOH, Eijirou MIYAGAWA, Junya KASAHARA, Takao ARIMA
  • Patent number: 10220812
    Abstract: A heat flux sensor is installed in such a way that heat flux emanating from a biological object present at a predetermined position is detectable. It is determined whether or not a biological object is present at the predetermined position by comparing sensing results of the heat flux sensor with determination criteria. The determination criteria is preset according to heat flux that can be sensed when a biological object is present at the predetermined position. When the sensing results of the heat flux sensor satisfy the determination criteria, in other words, when the heat flux sensed by the heat flux sensor is the heat flux emanating from a biological object, it is determined that a biological object is present at the predetermined position. Consequently, it is possible to realize accurate detection of a biological object.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: March 5, 2019
    Assignee: DENSO CORPORATION
    Inventors: Keita Saitou, Yoshihiko Shiraishi, Yoshitaro Yazaki, Yasuhiro Tanaka, Eijirou Miyagawa, Motoki Shimizu, Toshikazu Harada, Atusi Sakaida, Toshihisa Taniguchi, Norio Gouko
  • Patent number: 10053052
    Abstract: A heat flux sensor is installed in such a way that heat flux emanating from a biological object present at a predetermined position is detectable. It is determined whether or not a biological object is present at the predetermined position by comparing sensing results of the heat flux sensor with determination criteria. The determination criteria is preset according to heat flux that can be sensed when a biological object is present at the predetermined position. When the sensing results of the heat flux sensor satisfy the determination criteria, in other words, when the heat flux sensed by the heat flux sensor is the heat flux emanating from a biological object, it is determined that a biological object is present at the predetermined position. Consequently, it is possible to realize accurate detection of a biological object.
    Type: Grant
    Filed: May 23, 2014
    Date of Patent: August 21, 2018
    Assignee: DENSO CORPORATION
    Inventors: Keita Saitou, Yoshihiko Shiraishi, Yoshitaro Yazaki, Yasuhiro Tanaka, Eijirou Miyagawa, Motoki Shimizu, Toshikazu Harada, Atusi Sakaida, Toshihisa Taniguchi, Norio Gouko
  • Patent number: 9923250
    Abstract: A heat quantity control device has a heat flux sensor arranged between first and second heating elements arranged adjacently to each other, and a control section for controlling a heat quantity of the first and second heating elements. The heat flux sensor has an insulation board made of thermoplastic resin, first and second via holes formed in the insulation board penetrating in a thickness direction thereof. First and second layer connection members are embedded in the first and second via holes, respectively. The first and second layer connection members are made of different metals and alternately connected in series. The control section controls a heat quantity generated in the first and second heating elements based on the electromotive force generated in the heat flux sensors so that a heat flux flowing between the first and second heating elements becomes not more than a predetermined value.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: March 20, 2018
    Assignee: DENSO CORPORATION
    Inventors: Yoshihiko Shiraishi, Atusi Sakaida, Toshihisa Taniguchi, Norio Gouko, Yoshitaro Yazaki, Motoki Shimizu, Eijirou Miyagawa, Yasuhiro Tanaka, Toshikazu Harada, Keita Saitou
  • Patent number: 9871181
    Abstract: As the first conductive paste, a paste is used which is made by adding an organic solvent to powder of alloy in which a plurality of atoms keep a given crystal structure constant. As the second conductive paste, a paste is used which is made by adding an organic solvent to powder of metal different in kind from the alloy. In a step of making the stack body, cavities are formed in the stack body. In a uniting step, the cavities work to facilitate flow of thermoplastic resin to absorb pressure acting in a direction different from a direction in which pressure exerted on the first conductive paste to unite the stack body, thereby resulting in an increase in pressure for the uniting to solid-state sinter the first conductive paste to make the first layer-to-layer connecting member.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: January 16, 2018
    Assignee: DENSO CORPORATION
    Inventors: Toshihisa Taniguchi, Yoshihiko Shiraishi, Atusi Sakaida, Keiji Okamoto, Eijirou Miyagawa
  • Publication number: 20170320463
    Abstract: A heat flux sensor is installed in such a way that heat flux emanating from a biological object present at a predetermined position is detectable. It is determined whether or not a biological object is present at the predetermined position by comparing sensing results of the heat flux sensor with determination criteria. The determination criteria is preset according to heat flux that can be sensed when a biological object is present at the predetermined position. When the sensing results of the heat flux sensor satisfy the determination criteria, in other words, when the heat flux sensed by the heat flux sensor is the heat flux emanating from a biological object, it is determined that a biological object is present at the predetermined position. Consequently, it is possible to realize accurate detection of a biological object.
    Type: Application
    Filed: July 24, 2017
    Publication date: November 9, 2017
    Inventors: Keita SAITOU, Yoshihiko SHIRAISHI, Yoshitaro YAZAKI, Yasuhiro TANAKA, Eijirou MIYAGAWA, Motoki SHIMIZU, Toshikazu HARADA, Atusi SAKAIDA, Toshihisa TANIGUCHI, Norio GOUKO
  • Publication number: 20170318670
    Abstract: A flexible laminated sheet manufacturing method includes thermocompression-bonding an insulation film formed of a liquid crystal polymer onto a metal foil between endless belts to form a flexible laminated sheet. The thermocompression bonding includes heating the flexible laminated sheet so that the maximum temperature of the sheet is in the range from a temperature that is 45° C. lower than the melting point of the liquid crystal polymer to a temperature that is 5° C. lower than the melting point. The thermocompression bonding also includes slowly cooling the flexible laminated sheet so that an exit temperature, which is a temperature of the sheet when transferred out of the endless belts, is in the range from a temperature that is 235° C. lower than the melting point of the liquid crystal polymer to a temperature that is 100° C. lower than the melting point.
    Type: Application
    Filed: January 12, 2016
    Publication date: November 2, 2017
    Inventors: Eisuke TACHIBANA, Taro SUZUKI, Makoto TOTANI, Kouji KONDOH, Eijirou MIYAGAWA, Junya KASAHARA, Takao ARIMA
  • Publication number: 20170213953
    Abstract: As the first conductive paste, a paste is used which is made by adding an organic solvent to powder of alloy in which a plurality of atoms keep a given crystal structure constant. As the second conductive paste, a paste is used which is made by adding an organic solvent to powder of metal different in kind from the alloy. In a step of making the stack body, cavities are formed in the stack body. In a uniting step, the cavities work to facilitate flow of thermoplastic resin to absorb pressure acting in a direction different from a direction in which pressure exerted on the first conductive paste to unite the stack body, thereby resulting in an increase in pressure for the uniting to solid-state sinter the first conductive paste to make the first layer-to-layer connecting member.
    Type: Application
    Filed: March 21, 2017
    Publication date: July 27, 2017
    Applicant: DENSO CORPORATION
    Inventors: Toshihisa TANIGUCHI, Yoshihiko SHIRAISHI, Atusi SAKAIDA, Keiji OKAMOTO, Eijirou MIYAGAWA
  • Patent number: 9680079
    Abstract: As the first conductive paste, a paste is used which is made by adding an organic solvent to powder of alloy in which a plurality of atoms keep a given crystal structure constant. As the second conductive paste, a paste is used which is made by adding an organic solvent to powder of metal different in kind from the alloy. In a step of making the stack body, cavities are formed in the stack body. In a uniting step, the cavities work to facilitate flow of thermoplastic resin to absorb pressure acting in a direction different from a direction in which pressure exerted on the first conductive paste to unite the stack body, thereby resulting in an increase in pressure for the uniting to solid-state sinter the first conductive paste to make the first layer-to-layer connecting member.
    Type: Grant
    Filed: April 26, 2013
    Date of Patent: June 13, 2017
    Assignee: DENSO CORPORATION
    Inventors: Toshihisa Taniguchi, Yoshihiko Shiraishi, Atusi Sakaida, Keiji Okamoto, Eijirou Miyagawa
  • Patent number: 9620699
    Abstract: An insulating substrate is prepared. In this substrate, plural via holes penetrating in a thickness direction are filled with a conductive paste. This paste is produced by adding an organic solvent to a powder of an, and by processing the power of the alloy to a paste. The substrate is then pressed from a front surface and a back surface of the substrate, while being heated. The conductive paste is solid-phase sintered and interlayer connecting members are formed. A front surface protective member is disposed on a front surface of the substrate and a back surface protective member is disposed on a back surface of the substrate, and a laminate is formed. The laminate is integrated by a lower pressure being applied while heating at a lower temperature, compared to the temperature and pressure in the process of forming the interlayer connecting members.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: April 11, 2017
    Assignee: DENSO CORPORATION
    Inventors: Eijirou Miyagawa, Keita Saitou, Yoshihiko Shiraishi, Yoshitaro Yazaki, Toshihisa Taniguchi, Atusi Sakaida
  • Publication number: 20170012196
    Abstract: An insulating substrate is prepared. In this substrate, plural via holes penetrating in a thickness direction are filled with a conductive paste. This paste is produced by adding an organic solvent to a powder of an alloy, and by processing the power of the alloy to a paste. The substrate is then pressed from a front surface and a back surface of the substrate, while being heated. The conductive paste is solid-phase sintered and interlayer connecting members are formed. A front surface protective member is disposed on a front surface of the substrate and a back surface protective member is disposed on a back surface of the substrate and a laminate is formed. The laminate is integrated by a lower pressure being applied while heating at a lower temperature, compared to the temperature and pressure in the process of forming the interlayer connecting members.
    Type: Application
    Filed: September 22, 2016
    Publication date: January 12, 2017
    Inventors: Eijirou MIYAGAWA, Keita SAITOU, Yoshihiko SHIRAISHI, Yoshitaro YAZAKI, Toshihisa TANIGUCHI, Atusi SAKAIDA
  • Publication number: 20160141733
    Abstract: A heat quantity control device has a heat flux sensor arranged between first and second heating elements arranged adjacently to each other, and a control section for controlling a heat quantity of the first and second heating elements. The heat flux sensor has an insulation board made of thermoplastic resin, first and second via holes formed in the insulation board penetrating in a thickness direction thereof. First and second layer connection members are embedded in the first and second via holes, respectively. The first and second layer connection members are made of different metals and alternately connected in series. The control section controls a heat quantity generated in the first and second heating elements based on the electromotive force generated in the heat flux sensors so that a heat flux flowing between the first and second heating elements becomes not more than a predetermined value.
    Type: Application
    Filed: April 30, 2014
    Publication date: May 19, 2016
    Inventors: Yoshihiko SHIRAISHI, Atusi SAKAIDA, Toshihisa TANIGUCHI, Norio GOUKO, Yoshitaro YAZAKI, Motoki SHIMIZU, Eijirou MIYAGAWA, Yasuhiro TANAKA, Toshikazu HARADA, Keita SAITOU
  • Publication number: 20160121847
    Abstract: A heat flux sensor is installed in such a way that heat flux emanating from a biological object present at a predetermined position is detectable. It is determined whether or not a biological object is present at the predetermined position by comparing sensing results of the heat flux sensor with determination criteria. The determination criteria is preset according to heat flux that can be sensed when a biological object is present at the predetermined position. When the sensing results of the heat flux sensor satisfy the determination criteria, in other words, when the heat flux sensed by the heat flux sensor is the heat flux emanating from a biological object, it is determined that a biological object is present at the predetermined position. Consequently, it is possible to realize accurate detection of a biological object.
    Type: Application
    Filed: May 23, 2014
    Publication date: May 5, 2016
    Inventors: Keita SAITOU, Yoshihiko SHIRAISHI, Yoshitaro YAZAKI, Yasuhiro TANAKA, Eijirou MIYAGAWA, Motoki SHIMIZU, Toshikazu HARADA, Atusi SAKAIDA, Toshihisa TANIGUCHI, Norio GOUKO
  • Publication number: 20150372215
    Abstract: An insulating substrate is prepared. In this substrate, plural via holes penetrating in a thickness direction are filled with a conductive paste. This paste is produced by adding an organic solvent to a powder of an, and by processing the power of the alloy to a paste. The substrate is then pressed from a front surface and a back surface of the substrate, while being heated. The conductive paste is solid-phase sintered and interlayer connecting members are formed. A front surface protective member is disposed on a front surface of the substrate and a back surface protective member is disposed on a back surface of the substrate, and a laminate is formed. The laminate is integrated by a lower pressure being applied while heating at a lower temperature, compared to the temperature and pressure in the process of forming the interlayer connecting members.
    Type: Application
    Filed: January 23, 2014
    Publication date: December 24, 2015
    Applicant: DENSO CORPORATION
    Inventors: Eijirou MIYAGAWA, Keita SAITOU, Yoshihiko SHIRAISHI, Yoshitaro YAZAKI, Toshihisa TANIGUCHI, Atusi SAKAIDA
  • Publication number: 20150144171
    Abstract: As the first conductive paste, a paste is used which is made by adding an organic solvent to powder of alloy in which a plurality of atoms keep a given crystal structure constant. As the second conductive paste, a paste is used which is made by adding an organic solvent to powder of metal different in kind from the alloy. In a step of making the stack body, cavities are formed in the stack body. In a uniting step, the cavities work to facilitate flow of thermoplastic resin to absorb pressure acting in a direction different from a direction in which pressure exerted on the first conductive paste to unite the stack body, thereby resulting in an increase in pressure for the uniting to solid-state sinter the first conductive paste to make the first layer-to-layer connecting member.
    Type: Application
    Filed: April 26, 2013
    Publication date: May 28, 2015
    Inventors: Toshihisa Taniguchi, Yoshihiko Shiraishi, Atusi Sakaida, Keiji Okamoto, Eijirou Miyagawa
  • Publication number: 20110266033
    Abstract: A multilayer board includes a thermoplastic resin film layer, a pattern layer layered on the thermoplastic resin film layer, and a conductor pattern. The thermoplastic resin film layer is made of a plurality of thermoplastic resin films layered with each other, and has two adhesive layers and an interlayer located between the two adhesive layers. Each of the adhesive layers has an interlayer connector passing through the adhesive layer in a thickness direction. The conductor pattern is located on at least one of the pattern layer and the interlayer at a position opposing to the interlayer connector.
    Type: Application
    Filed: April 7, 2011
    Publication date: November 3, 2011
    Applicant: DENSO CORPORATION
    Inventors: Kazuo TADA, Yoshitarou Yazaki, Gentarou Masuda, Yasuhiro Tanaka, Eijirou Miyagawa