Patents by Inventor Eijirou Miyagawa
Eijirou Miyagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210153348Abstract: A flexible laminated sheet manufacturing method includes thermocompression-bonding an insulation film formed of a liquid crystal polymer onto a metal foil between endless belts to form a flexible laminated sheet. The thermocompression bonding includes heating the flexible laminated sheet so that the maximum temperature of the sheet is in the range from a temperature that is 45° C. lower than the melting point of the liquid crystal polymer to a temperature that is 5° C. lower than the melting point. The thermocompression bonding also includes slowly cooling the flexible laminated sheet so that an exit temperature, which is a temperature of the sheet when transferred out of the endless belts, is in the range from a temperature that is 235° C. lower than the melting point of the liquid crystal polymer to a temperature that is 100° C. lower than the melting point.Type: ApplicationFiled: January 25, 2021Publication date: May 20, 2021Inventors: Eisuke TACHIBANA, Taro SUZUKI, Makoto TOTANI, Kouji KONDOH, Eijirou MIYAGAWA, Junya KASAHARA, Takao ARIMA
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Patent number: 10220812Abstract: A heat flux sensor is installed in such a way that heat flux emanating from a biological object present at a predetermined position is detectable. It is determined whether or not a biological object is present at the predetermined position by comparing sensing results of the heat flux sensor with determination criteria. The determination criteria is preset according to heat flux that can be sensed when a biological object is present at the predetermined position. When the sensing results of the heat flux sensor satisfy the determination criteria, in other words, when the heat flux sensed by the heat flux sensor is the heat flux emanating from a biological object, it is determined that a biological object is present at the predetermined position. Consequently, it is possible to realize accurate detection of a biological object.Type: GrantFiled: July 24, 2017Date of Patent: March 5, 2019Assignee: DENSO CORPORATIONInventors: Keita Saitou, Yoshihiko Shiraishi, Yoshitaro Yazaki, Yasuhiro Tanaka, Eijirou Miyagawa, Motoki Shimizu, Toshikazu Harada, Atusi Sakaida, Toshihisa Taniguchi, Norio Gouko
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Patent number: 10053052Abstract: A heat flux sensor is installed in such a way that heat flux emanating from a biological object present at a predetermined position is detectable. It is determined whether or not a biological object is present at the predetermined position by comparing sensing results of the heat flux sensor with determination criteria. The determination criteria is preset according to heat flux that can be sensed when a biological object is present at the predetermined position. When the sensing results of the heat flux sensor satisfy the determination criteria, in other words, when the heat flux sensed by the heat flux sensor is the heat flux emanating from a biological object, it is determined that a biological object is present at the predetermined position. Consequently, it is possible to realize accurate detection of a biological object.Type: GrantFiled: May 23, 2014Date of Patent: August 21, 2018Assignee: DENSO CORPORATIONInventors: Keita Saitou, Yoshihiko Shiraishi, Yoshitaro Yazaki, Yasuhiro Tanaka, Eijirou Miyagawa, Motoki Shimizu, Toshikazu Harada, Atusi Sakaida, Toshihisa Taniguchi, Norio Gouko
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Patent number: 9923250Abstract: A heat quantity control device has a heat flux sensor arranged between first and second heating elements arranged adjacently to each other, and a control section for controlling a heat quantity of the first and second heating elements. The heat flux sensor has an insulation board made of thermoplastic resin, first and second via holes formed in the insulation board penetrating in a thickness direction thereof. First and second layer connection members are embedded in the first and second via holes, respectively. The first and second layer connection members are made of different metals and alternately connected in series. The control section controls a heat quantity generated in the first and second heating elements based on the electromotive force generated in the heat flux sensors so that a heat flux flowing between the first and second heating elements becomes not more than a predetermined value.Type: GrantFiled: April 30, 2014Date of Patent: March 20, 2018Assignee: DENSO CORPORATIONInventors: Yoshihiko Shiraishi, Atusi Sakaida, Toshihisa Taniguchi, Norio Gouko, Yoshitaro Yazaki, Motoki Shimizu, Eijirou Miyagawa, Yasuhiro Tanaka, Toshikazu Harada, Keita Saitou
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Patent number: 9871181Abstract: As the first conductive paste, a paste is used which is made by adding an organic solvent to powder of alloy in which a plurality of atoms keep a given crystal structure constant. As the second conductive paste, a paste is used which is made by adding an organic solvent to powder of metal different in kind from the alloy. In a step of making the stack body, cavities are formed in the stack body. In a uniting step, the cavities work to facilitate flow of thermoplastic resin to absorb pressure acting in a direction different from a direction in which pressure exerted on the first conductive paste to unite the stack body, thereby resulting in an increase in pressure for the uniting to solid-state sinter the first conductive paste to make the first layer-to-layer connecting member.Type: GrantFiled: March 21, 2017Date of Patent: January 16, 2018Assignee: DENSO CORPORATIONInventors: Toshihisa Taniguchi, Yoshihiko Shiraishi, Atusi Sakaida, Keiji Okamoto, Eijirou Miyagawa
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Publication number: 20170320463Abstract: A heat flux sensor is installed in such a way that heat flux emanating from a biological object present at a predetermined position is detectable. It is determined whether or not a biological object is present at the predetermined position by comparing sensing results of the heat flux sensor with determination criteria. The determination criteria is preset according to heat flux that can be sensed when a biological object is present at the predetermined position. When the sensing results of the heat flux sensor satisfy the determination criteria, in other words, when the heat flux sensed by the heat flux sensor is the heat flux emanating from a biological object, it is determined that a biological object is present at the predetermined position. Consequently, it is possible to realize accurate detection of a biological object.Type: ApplicationFiled: July 24, 2017Publication date: November 9, 2017Inventors: Keita SAITOU, Yoshihiko SHIRAISHI, Yoshitaro YAZAKI, Yasuhiro TANAKA, Eijirou MIYAGAWA, Motoki SHIMIZU, Toshikazu HARADA, Atusi SAKAIDA, Toshihisa TANIGUCHI, Norio GOUKO
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Publication number: 20170318670Abstract: A flexible laminated sheet manufacturing method includes thermocompression-bonding an insulation film formed of a liquid crystal polymer onto a metal foil between endless belts to form a flexible laminated sheet. The thermocompression bonding includes heating the flexible laminated sheet so that the maximum temperature of the sheet is in the range from a temperature that is 45° C. lower than the melting point of the liquid crystal polymer to a temperature that is 5° C. lower than the melting point. The thermocompression bonding also includes slowly cooling the flexible laminated sheet so that an exit temperature, which is a temperature of the sheet when transferred out of the endless belts, is in the range from a temperature that is 235° C. lower than the melting point of the liquid crystal polymer to a temperature that is 100° C. lower than the melting point.Type: ApplicationFiled: January 12, 2016Publication date: November 2, 2017Inventors: Eisuke TACHIBANA, Taro SUZUKI, Makoto TOTANI, Kouji KONDOH, Eijirou MIYAGAWA, Junya KASAHARA, Takao ARIMA
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Publication number: 20170213953Abstract: As the first conductive paste, a paste is used which is made by adding an organic solvent to powder of alloy in which a plurality of atoms keep a given crystal structure constant. As the second conductive paste, a paste is used which is made by adding an organic solvent to powder of metal different in kind from the alloy. In a step of making the stack body, cavities are formed in the stack body. In a uniting step, the cavities work to facilitate flow of thermoplastic resin to absorb pressure acting in a direction different from a direction in which pressure exerted on the first conductive paste to unite the stack body, thereby resulting in an increase in pressure for the uniting to solid-state sinter the first conductive paste to make the first layer-to-layer connecting member.Type: ApplicationFiled: March 21, 2017Publication date: July 27, 2017Applicant: DENSO CORPORATIONInventors: Toshihisa TANIGUCHI, Yoshihiko SHIRAISHI, Atusi SAKAIDA, Keiji OKAMOTO, Eijirou MIYAGAWA
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Patent number: 9680079Abstract: As the first conductive paste, a paste is used which is made by adding an organic solvent to powder of alloy in which a plurality of atoms keep a given crystal structure constant. As the second conductive paste, a paste is used which is made by adding an organic solvent to powder of metal different in kind from the alloy. In a step of making the stack body, cavities are formed in the stack body. In a uniting step, the cavities work to facilitate flow of thermoplastic resin to absorb pressure acting in a direction different from a direction in which pressure exerted on the first conductive paste to unite the stack body, thereby resulting in an increase in pressure for the uniting to solid-state sinter the first conductive paste to make the first layer-to-layer connecting member.Type: GrantFiled: April 26, 2013Date of Patent: June 13, 2017Assignee: DENSO CORPORATIONInventors: Toshihisa Taniguchi, Yoshihiko Shiraishi, Atusi Sakaida, Keiji Okamoto, Eijirou Miyagawa
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Patent number: 9620699Abstract: An insulating substrate is prepared. In this substrate, plural via holes penetrating in a thickness direction are filled with a conductive paste. This paste is produced by adding an organic solvent to a powder of an, and by processing the power of the alloy to a paste. The substrate is then pressed from a front surface and a back surface of the substrate, while being heated. The conductive paste is solid-phase sintered and interlayer connecting members are formed. A front surface protective member is disposed on a front surface of the substrate and a back surface protective member is disposed on a back surface of the substrate, and a laminate is formed. The laminate is integrated by a lower pressure being applied while heating at a lower temperature, compared to the temperature and pressure in the process of forming the interlayer connecting members.Type: GrantFiled: January 23, 2014Date of Patent: April 11, 2017Assignee: DENSO CORPORATIONInventors: Eijirou Miyagawa, Keita Saitou, Yoshihiko Shiraishi, Yoshitaro Yazaki, Toshihisa Taniguchi, Atusi Sakaida
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Publication number: 20170012196Abstract: An insulating substrate is prepared. In this substrate, plural via holes penetrating in a thickness direction are filled with a conductive paste. This paste is produced by adding an organic solvent to a powder of an alloy, and by processing the power of the alloy to a paste. The substrate is then pressed from a front surface and a back surface of the substrate, while being heated. The conductive paste is solid-phase sintered and interlayer connecting members are formed. A front surface protective member is disposed on a front surface of the substrate and a back surface protective member is disposed on a back surface of the substrate and a laminate is formed. The laminate is integrated by a lower pressure being applied while heating at a lower temperature, compared to the temperature and pressure in the process of forming the interlayer connecting members.Type: ApplicationFiled: September 22, 2016Publication date: January 12, 2017Inventors: Eijirou MIYAGAWA, Keita SAITOU, Yoshihiko SHIRAISHI, Yoshitaro YAZAKI, Toshihisa TANIGUCHI, Atusi SAKAIDA
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Publication number: 20160141733Abstract: A heat quantity control device has a heat flux sensor arranged between first and second heating elements arranged adjacently to each other, and a control section for controlling a heat quantity of the first and second heating elements. The heat flux sensor has an insulation board made of thermoplastic resin, first and second via holes formed in the insulation board penetrating in a thickness direction thereof. First and second layer connection members are embedded in the first and second via holes, respectively. The first and second layer connection members are made of different metals and alternately connected in series. The control section controls a heat quantity generated in the first and second heating elements based on the electromotive force generated in the heat flux sensors so that a heat flux flowing between the first and second heating elements becomes not more than a predetermined value.Type: ApplicationFiled: April 30, 2014Publication date: May 19, 2016Inventors: Yoshihiko SHIRAISHI, Atusi SAKAIDA, Toshihisa TANIGUCHI, Norio GOUKO, Yoshitaro YAZAKI, Motoki SHIMIZU, Eijirou MIYAGAWA, Yasuhiro TANAKA, Toshikazu HARADA, Keita SAITOU
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Publication number: 20160121847Abstract: A heat flux sensor is installed in such a way that heat flux emanating from a biological object present at a predetermined position is detectable. It is determined whether or not a biological object is present at the predetermined position by comparing sensing results of the heat flux sensor with determination criteria. The determination criteria is preset according to heat flux that can be sensed when a biological object is present at the predetermined position. When the sensing results of the heat flux sensor satisfy the determination criteria, in other words, when the heat flux sensed by the heat flux sensor is the heat flux emanating from a biological object, it is determined that a biological object is present at the predetermined position. Consequently, it is possible to realize accurate detection of a biological object.Type: ApplicationFiled: May 23, 2014Publication date: May 5, 2016Inventors: Keita SAITOU, Yoshihiko SHIRAISHI, Yoshitaro YAZAKI, Yasuhiro TANAKA, Eijirou MIYAGAWA, Motoki SHIMIZU, Toshikazu HARADA, Atusi SAKAIDA, Toshihisa TANIGUCHI, Norio GOUKO
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Publication number: 20150372215Abstract: An insulating substrate is prepared. In this substrate, plural via holes penetrating in a thickness direction are filled with a conductive paste. This paste is produced by adding an organic solvent to a powder of an, and by processing the power of the alloy to a paste. The substrate is then pressed from a front surface and a back surface of the substrate, while being heated. The conductive paste is solid-phase sintered and interlayer connecting members are formed. A front surface protective member is disposed on a front surface of the substrate and a back surface protective member is disposed on a back surface of the substrate, and a laminate is formed. The laminate is integrated by a lower pressure being applied while heating at a lower temperature, compared to the temperature and pressure in the process of forming the interlayer connecting members.Type: ApplicationFiled: January 23, 2014Publication date: December 24, 2015Applicant: DENSO CORPORATIONInventors: Eijirou MIYAGAWA, Keita SAITOU, Yoshihiko SHIRAISHI, Yoshitaro YAZAKI, Toshihisa TANIGUCHI, Atusi SAKAIDA
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Publication number: 20150144171Abstract: As the first conductive paste, a paste is used which is made by adding an organic solvent to powder of alloy in which a plurality of atoms keep a given crystal structure constant. As the second conductive paste, a paste is used which is made by adding an organic solvent to powder of metal different in kind from the alloy. In a step of making the stack body, cavities are formed in the stack body. In a uniting step, the cavities work to facilitate flow of thermoplastic resin to absorb pressure acting in a direction different from a direction in which pressure exerted on the first conductive paste to unite the stack body, thereby resulting in an increase in pressure for the uniting to solid-state sinter the first conductive paste to make the first layer-to-layer connecting member.Type: ApplicationFiled: April 26, 2013Publication date: May 28, 2015Inventors: Toshihisa Taniguchi, Yoshihiko Shiraishi, Atusi Sakaida, Keiji Okamoto, Eijirou Miyagawa
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Publication number: 20110266033Abstract: A multilayer board includes a thermoplastic resin film layer, a pattern layer layered on the thermoplastic resin film layer, and a conductor pattern. The thermoplastic resin film layer is made of a plurality of thermoplastic resin films layered with each other, and has two adhesive layers and an interlayer located between the two adhesive layers. Each of the adhesive layers has an interlayer connector passing through the adhesive layer in a thickness direction. The conductor pattern is located on at least one of the pattern layer and the interlayer at a position opposing to the interlayer connector.Type: ApplicationFiled: April 7, 2011Publication date: November 3, 2011Applicant: DENSO CORPORATIONInventors: Kazuo TADA, Yoshitarou Yazaki, Gentarou Masuda, Yasuhiro Tanaka, Eijirou Miyagawa