Abstract: The object of the present invention is to provide a thermosetting resin composition which can provide a cured material which is excellent in heat resistance, electrical properties, and flexibility, and has storage stability before curing, and in order to achieve the object, the present invention provide a thermosetting resin composition containing a polyurethane resin (A) which has the structure represented by the following general formula (1) and/or the general formula (2), and an epoxy resin (B). (In the chemical formulae, X represents a residue in which two phenolic hydroxyl groups are excluded from a phenol compound having two or more phenolic hydroxyl groups in the molecule.

Abstract: The object of the present invention is to provide a thermosetting resin composition which can provide a cured material which is excellent in heat resistance, electrical properties, and flexibility, and has storage stability before curing, and in order to achieve the object, the present invention provide a thermosetting resin composition containing a polyurethane resin (A) which has the structure represented by the following general formula (1) and/or the general formula (2), and an epoxy resin (B). (In the chemical formulae, X represents a residue in which two phenolic hydroxyl groups are excluded from a phenol compound having two or more phenolic hydroxyl groups in the molecule.

Abstract: A method for producing a branched-polyether resin composition of the present invention includes a first step of obtaining a reaction mixture including: (1-A) a branched-polyether resin (X) containing a hydroxyl group, an acryloyl group, and an epoxy group and (1-B) at least one resin component selected from the group consisting of (1-B-1) a diacrylate (A2) of an aromatic difunctional epoxy resin, (1-B-2) a monoacrylate (A1) of an aromatic difunctional epoxy resin, and (1-B-3) an aromatic difunctional epoxy resin (B) other than (A1) and (A2); and a second step of mixing the reaction mixture and an unsaturated monocarboxylic acid, and reacting the epoxy group in the reaction mixture and a carboxyl group in the unsaturated monocarboxylic acid.

Abstract: A thermosetting polyimide resin composition is provided which comprises a polyimide resin and an epoxy resin, which has excellent heat resistance, low dielectric constant and low dielectric loss tangent and also yields a cured article having good mechanical properties such as tensile strength and tensile elongation. Also, a process for producing a polyimide resin used in the polyimide resin composition is provided. The thermosetting polyimide resin composition comprises a polyimide resin (X), which has a carboxyl group and a linear hydrocarbon structure having a number-average molecular weight of 300 to 6,000, and an epoxy resin (Y).

Abstract: Disclosed is an active energy ray-curable polyimide resin composition which comprises a polymerizable polyimide resin (I) having an isocyanurate ring, an alicyclic structure, an imide ring and a (meth)acryloyl group and being capable of patterning with a dilute alkali aqueous solution.

Abstract: A thermosetting polyimide resin composition is provided which comprises a polyimide resin and an epoxy resin, which has excellent heat resistance, low dielectric constant and low dielectric loss tangent and also yields a cured article having good mechanical properties such as tensile strength and tensile elongation. Also, a process for producing a polyimide resin used in the polyimide resin composition is provided. The thermosetting polyimide resin composition comprises a polyimide resin (X), which has a carboxyl group and a linear hydrocarbon structure having a number-average molecular weight of 300 to 6,000, and an epoxy resin (Y).

Abstract: Disclosed is an active energy ray-curable polyimide resin composition which comprises a polymerizable polyimide resin (I) having an isocyanurate ring, an alicyclic structure, an imide ring and a (meth)acryloyl group and being capable of patterning with a dilute alkali aqueous solution.

Abstract: The present invention provides a radiation curable resin composition and method of production therefor; the present composition has wide applications as an ink, coating or the like, is dilutable in water or an organic solvent, and forms a coating which has excellent hardening characteristics and adherence to a substrate, as well as superior resistance to heat, chemicals and boiling, this resin composition may be redissolved with water or an organic solvent prior to hardening; which have a number average weight of 500 to 50,000, characterized in that the aprotic ammonium salt represented by general formula 1 is contained in the resin in the amount of 0.1 to 4.0 mol/kg.