Abstract: An electronic component mounting device includes an insulating substrate having a metal pattern formed thereon and a MELF electronic component. The MELF electronic component is fitted into a first receiving portion configured with the metal pattern and the insulating substrate exposed from a lacking portion of the metal pattern. The electronic component mounting device further includes a conductive member formed between the MELF electronic component and the metal pattern, and the conductive member is not formed between the MELF electronic component and the insulating substrate.

Abstract: An electronic component mounting device includes an insulating substrate having a metal pattern formed thereon and a MELF electronic component. The MELF electronic component is fitted into a first receiving portion configured with the metal pattern and the insulating substrate exposed from a lacking portion of the metal pattern. The electronic component mounting device further includes a conductive member formed between the MELF electronic component and the metal pattern, and the conductive member is not formed between the MELF electronic component and the insulating substrate.

Abstract: It is an object to enhance accuracy of intervals and parallelism between signal pins and guide pins. Guide pins (5) are integrally united to outsert cases (9) made of resin to which signal pins (3) are planted. The outsert cases (9) are fixed to a circuit board (6) and the signal pins (3) and the guide pins (5) are thus fixed to the common circuit board (6), so that the accuracy of intervals and parallelism among them is high. The circuit board (6) is accommodated in a box-like case and the opening of the case is covered with a lid (4). The guide pins (5) and the signal pins (3) pass through holes (21, 22) provided in the lid (4) and project to the outside. The guide pins (5) play a role of guiding the signal pins (3) when the signal pins (3) are coupled to an external connected body. At the same time, the guide pins (5) also serve to guide the signal pins (3) into the holes (22) when the lid (4) is mounted, so that the workability in the manufacturing process is enhanced.