Abstract: Disclosed is a sintered silicon carbide body with a high thermal conductivity which has a thermal conductivity of not less than 150 W/m.multidot.K, which is produced by(a) mixing(1) a first silicon carbide powder having a mean grain size of from 0.1 to 10 .mu.m with(2) a second silicon carbide powder having a mean grain size of not greater than 0.1 .mu.m prepared by(2-1) introducing a starting gas composed of a silane compound or silicon halide and a hydrocarbon into a plasma of a non-oxidative atmosphere, and(2-2) conducting gas phase reaction between the silane compound or silicon halide and the hydrocarbon while controlling the pressure of the reaction system within the range of from less than 1 atom to 0.1 torr, and(3) optionally, a carbon powder which is required for reducing oxides contained in both the first and second silicon carbide powders,(b) optioanlly reducing the oxides with the carbon, and(c) heating the resulting mixture for sintering. Also, processes of producing the same are disclosed.

Abstract: Disclosed is an electrically conductive sintered silicon carbide body having an electric resistivity of not higher than 1 .OMEGA..multidot.cm, which is produced by(a) mixing(1) a first silicon carbide powder having a mean grain size of from 0.1 to 10 .mu.m with(2) a second silicon carbide powder having a mean grain size of not greater than 0.1 .mu.m prepared by(2-1) introducing a starting gas composed of a silane compound of silicon halide and a hydrocarbon into a plasma of a non-oxidative atmosphere, and(2-2) conducting gas phase reaction between the silane compound or silicon halide and the hydrocarbon while controlling the pressure of the reaction system within the range of from less than 1 atom to 0.1 torr, and(3) optionally, a carbon powder which is required for reducing oxides contained in both the first and second silicon carbide powders,(b) optionally reducing the oxides with the carbon, and(c) heating the resulting mixture for sintering. Also, processes of producing the same are disclosed.

Abstract: Using an organic binder containing at least one water-soluble thermoplastic organic polymer and at least one water-insoluble thermoplastic organic polymer, the water-soluble thermoplastic organic polymer is extracted by debinding treatment in which a plastic molded part such as injection molded part and water are brought into contact with each other to prevent the occurrence of cracks in the molded part. Removal by extraction of the water-soluble thermoplastic polymer reduces the amount of the organic binder contained in the molded part sufficiently, thus preventing the softening and deformation of the molded part at the time of optionally heating and removing the remainder of the organic binder and/or sintering of the molded part and also preventing the occurrence of swelling and cracks by the effect of guide passage formed by the extraction of the organic polymer.