Abstract: A substrate processing apparatus includes: a substrate processing part including a load port configured to place thereon a substrate accommodating vessel in which at least one substrate is accommodated, and configured to take out the at least one substrate from the substrate accommodating vessel and to perform a series of processes on the at least one substrate; and a controller configured to control an opening and closing of a lid of the substrate accommodating vessel, wherein the controller performs control to open the lid after the substrate accommodating vessel is placed on the load port, and the controller performs control to close the lid when an abnormality occurs in the substrate processing part and when none of the at least one substrate removed from the substrate accommodating vessel can be recovered to the substrate accommodating vessel after a predetermined period of time from the occurrence of the abnormality.

Abstract: A substrate processing apparatus includes a load port, a load lock chamber, a processing module, a substrate transport mechanism, and a controller. The substrate transport mechanism includes a plurality of substrate holders, each of which is configured hold one substrate. The controller is configured to control, when the processing module is configured to process one substrate at a time, the substrate transport mechanism such that a first substrate holder transports the substrate between the load port and the processing module and a second substrate holder transports the substrate between the load lock chamber and the processing module. The controller is further configured to control, when the processing module is configured to simultaneously process the plurality of substrates, the substrate transport mechanism such that the plurality of substrate holders simultaneously transport the plurality of substrates between the load port, the load lock chamber, and the processing module.

Abstract: A substrate processing apparatus includes: a substrate processing part including a load port configured to place thereon a substrate accommodating vessel in which at least one substrate is accommodated, and configured to take out the at least one substrate from the substrate accommodating vessel and to perform a series of processes on the at least one substrate; and a controller configured to control an opening and closing of a lid of the substrate accommodating vessel, wherein the controller performs control to open the lid after the substrate accommodating vessel is placed on the load port, and the controller performs control to close the lid when an abnormality occurs in the substrate processing part and when none of the at least one substrate removed from the substrate accommodating vessel can be recovered to the substrate accommodating vessel after a predetermined period of time from the occurrence of the abnormality.

Abstract: There is provided a substrate transfer method capable of preventing fine particles from adhering to a wafer. A substrate processing system 10 includes process modules 12 to 17 each having therein an inner space S1; a transfer module 11, having an inner space S2, connected to the process modules 12 to 17; and opening/closing gate valves 30 each partitioning the inner space S1 and the inner space S2. The transfer module 11 includes in the inner space S2 a transfer arm device 21 for holding a wafer W and for loading/unloading the wafer W into/from the process modules 12 to 17. The transfer arm device 21 holds the wafer W at a retreated position deviated from a facing position facing the gate valve 30 during an opening motion of the gate valve 30.

Abstract: There is provided a substrate transfer method capable of preventing fine particles from adhering to a wafer. A substrate processing system 10 includes process modules 12 to 17 each having therein an inner space S1; a transfer module 11, having an inner space S2, connected to the process modules 12 to 17; and opening/closing gate valves 30 each partitioning the inner space S1 and the inner space S2. The transfer module 11 includes in the inner space S2 a transfer arm device 21 for holding a wafer W and for loading/unloading the wafer W into/from the process modules 12 to 17. The transfer arm device 21 holds the wafer W at a retreated position deviated from a facing position facing the gate valve 30 during an opening motion of the gate valve 30.