Abstract: An epoxy impregnating resin composition comprising 100 parts by weight of a compound having at least two epoxy groups in one molecule, from 0.1 to 100 parts by weight of an allyl epoxy compound having both allyl and epoxy groups in one molecule and represented by the general formula: ##STR1## where R is hydrogen, halogen or a monovalent organic group, from 30 to 300 parts by weight of a liquid cyclic acid anhydride, and from 5 to 300 parts by weight of a compound having a polymerizable double bond.

Abstract: A thermosetting resin composition, consists essentially of:(a) 100 parts by weight of a mixture of liquid acid anhydride and an imide ring-containing epoxy compound obtained from reaction of an epoxy compound having in one molecule thereof at least two epoxy groups and either one or both of imide ring-containing dicarboxylic acid compounds represented by the following general formulae (I) and (II): ##STR1## (where: R.sub.1 is a divalent organic radical) ##STR2## (where: R.sub.2 is a divalent organic radical): (b) 5 to 200 parts by weight of a tri-functional vinyl monomer; and(c) 0.1 to 10 parts by weight of phenoxy resin.

Abstract: A thermosetting resin composition, which is characterized by mixing 5 to 300 parts by weight of tri-functional vinyl monomer and 0.1 to 10 parts by weight of phenoxy resin with respect to 100 parts by weight in total of an epoxy compound containing in its molecule at least two epoxy groups and a curing agent for said epoxy compound.

Abstract: Improved method for producing an electrically insulated conductive body such as coils, etc. for use in electrical apparatuses and appliances, wherein an electrically conductive body is immersed in an electrodeposition paint liquid prepared by dispersing into water mica powder as an inorganic insulative substance and water-dispersion varnish as an organic insulative substance, thereby forming an electro-deposited layer on the electrically conductive body by electrophoresis, followed by drying the electro-deposited layer coated on the electrically conductive body under heat, then the dried electro-deposited conductive body is immersed in a water-soluble resin solution containing therein a curing agent, followed by drying the resin coating under heat, and finally the resin-coated, electro-deposited conductive body is impregnated with an impregnating resin, followed by heat-setting the resin as impregnated.

Abstract: A water dispersion varnish suitable for electrodepositon is prepared by a process comprising reacting:The reaction product ofA. a polyesterimide having a carboxyl group in its chain or at the terminus of the chain and having an ester group and an imide group in its repeating unit or a polyesteramideimide having a carboxyl group in its chain or at the terminus of the chain and having an ester group, an imide group and an amide group in its repeating unit andB. an organic compound having at least two hydroxyl groups withC. a polybasic acid or its anhydride in the presence or absence of a solvent yielding a modified polyesterimide or polyesteramideimide;Dissolving said modified polyesterimide or polyesteramideimide in an organic solvent;Dispersing said modified polyesterimide or polyesteramideimide solution in an aqueous solution containing a surfactant and a volatile base; and removing the volatile components.

Abstract: Acrylonitrile, an acrylic ester such as ethyl acrylate, n-propyl acrylate, n-butyl acrylate, isopropyl acrylate, n-hexyl acrylate and the like are copolymerized with a cross-linkable monomer, an unsaturated organic acid and a vinyl monomer in a one-step or two-step operation to prepare a water-dispersion varnish for electrodeposition which has excellent dispersion stability and gives a coated film having excellent scrape abrasion resistance and high cut-through temperature.

Abstract: A process for soldering a metal substrate coated with an electrodeposited non-peelable coating comprising 35-65 wt parts of methacryl ester, 10-40 wt parts of acrylonitrile, 2-15 wt parts of methacrylic acid, 3-10 wt parts of acrylamide and/or vinyl acetate, in 100 parts of resin.