Abstract: This application relates to a method for manufacturing a printed circuit board. According to the present application, it is possible to manufacture a printed circuit board having excellent bonding strength between a ceramic substrate and a metal sheet, and the manufacturing cost thereof can be reduced.

Abstract: The laminate for a circuit board of the present invention is a laminate including a metal nitride sintered board and a copper sheet, and the laminate has a size with a minimum length from a center of a plane to a peripheral edge of 50 mm or more, and has a void ratio X of 0.50% or less, which is a ratio of a total length LB of voids having a diameter of 1 µm or more confirmed in the vicinity of a bonding interface of the metal nitride sintered board and the copper sheet with respect to a measured length LI of the bonding interface, measured on a cut cross section obtained by cutting the laminate in a lamination direction. According to the present invention, a laminate that is excellent in heat radiation capability, has a feature that an etching solution used in patterning is difficult to remain at the bonding interface, and is excellent in reliability as a product can be provided.

Abstract: A thin-plate-like flexible carbon plate having flexibility, excellent compressive strength, and even electrical conductivity is provided. A carbon plate 1 is a carbon plate having a thickness of 0.05 to 2.0 mm obtained by compression molding of a mixture of (a) 97 to 80 wt % carbon powder composed of 95 to 30 wt % expanded graphite powder and 5 to 70 wt % graphite powder, and (b) 3 to 20 wt % phenolic resin that do not contain ammonia, wherein a compressive strength is 3 MPa or more, a bending strain is 0.6% or more without a crack, and a contact resistance is 6 m?·cm2 or less.

Abstract: A thin-plate-like flexible carbon plate having flexibility, excellent compressive strength, and even electrical conductivity is provided. A carbon plate 1 is a carbon plate having a thickness of 0.05 to 2.0 mm obtained by compression molding of a mixture of (a) 97 to 80 wt % carbon powder composed of 95 to 30 wt % expanded graphite powder and 5 to 70 wt % graphite powder, and (b) 3 to 20 wt % phenolic resin that do not contain ammonia, wherein a compressive strength is 3 MPa or more, a bending strain is 0.6% or more without a crack, and a contact resistance is 6 m?·cm2 or less.

Abstract: An electronic component storing package which generates a large quantity of heat during operation and an electronic apparatus storing such an electronic component are provided. In the electronic component storing package and the electronic apparatus, a heat dissipating member (1) is used which comprising at least five layers including first metal layers (11) having good thermal conductivity and second metal layers (12) having a smaller coefficient of thermal expansion and less thickness compared with the first metal layers (11), the first metal layers (11) and second metal layers (12) being alternately stacked, the first metal layers uppermost and lowermost layers of the layers, a thickness of at least one internally-arranged first metal layer (11a) being thicker than that of the lowermost and uppermost layers.

Abstract: To provide a carbon fiber Ti—Al composite material having hardness, heat resistance and abrasion resistance, having reduced weight and improved strength and thermal conductivity and being excellent in uniformity of the quality. A carbon fiber Ti—Al composite material which is prepared by pressure impregnating a molded product containing fine carbon fibers having a fiber diameter of from 0.5 to 500 nm and a fiber length of at most 1,000 ?m and having a hollow-structured central axis and a titanium powder or a titanium oxide powder, with aluminum or an aluminum alloy by molten metal forging.

Abstract: Recent semiconductor device becomes high powered, and on the material of heat sinks on which these devices are mounted, lower thermal expansion coefficient and higher thermal conductivity are needed. For this requirement, material with thermal conductivity as high as Cu alone and also with low thermal expansion coefficient, is needed. An aspect in accordance with the present invention provides, a cladding material in which 1st material layer and 2nd material layer are laminated alternately, wherein thermal expansion coefficient of said 2nd material is lower than the thermal expansion coefficient of said 1st material, and thermal conductivity of said 2nd material is lower than the thermal conductivity of said 1st material, and a total number of laminated layers composed of said 1st material and said 2nd material is 5 or more.

Abstract: To provide a carbon fiber Ti—Al composite material having hardness, heat resistance and abrasion resistance, having reduced weight, improved strength, elastic modulus and thermal conductivity and being excellent in the uniformity of the quality. A carbon fiber Ti—Al composite material which is prepared by pressure impregnating a molded product containing fine carbon fibers having a fiber diameter of from 0.5 to 500 nm and a carbon length of at most 1,000 ?m and having a hollow-structured central axis, carbon long fibers having a fiber diameter of from 5 to 15 ?m and a titanium powder or a titanium oxide powder, with aluminum or an aluminum alloy by molten metal forging.

Abstract: An electronic component storing package which generates a large quantity of heat during operation and an electronic apparatus storing such an electronic component are provided. In the electronic component storing package and the electronic apparatus, a heat dissipating member (1) is used which comprising at least five layers including first metal layers (11) having good thermal conductivity and second metal layers (12) having a smaller coefficient of thermal expansion and less thickness compared with the first metal layers (11), the first metal layers (11) and second metal layers (12) being alternately stacked, the first metal layers uppermost and lowermost layers of the layers, a thickness of at least one internally-arranged first metal layer (11a) being thicker than that of the lowermost and uppermost layers.

Abstract: Recent semiconductor device becomes high powered, and on the material of heat sinks on which these devices are mounted, lower thermal expansion coefficient and higher thermal conductivity are needed. For this requirement, material with thermal conductivity as high as Cu alone and also with low thermal expansion coefficient, is needed. An aspect in accordance with the present invention provides, a cladding material in which 1st material layer and 2nd material layer are laminated alternately, wherein thermal expansion coefficient of said 2nd material is lower than the thermal expansion coefficient of said 1st material, and thermal conductivity of said 2nd material is lower than the thermal conductivity of said 1st material, and a total number of laminated layers composed of said 1st material and said 2nd material is 5 or more.

Abstract: To provide a fine carbon fiber/metal composite material having high mechanical strength, a high thermal conductivity and a low coefficient of thermal expansion and suitable as a substrate for an electronic device. A fine carbon fiber/metal composite material, which is prepared by pressure impregnating a molded product containing fine carbon fibers having a fiber diameter of from 0.5 to 500 nm and a fiber length of at most 1,000 ?m, having a multilayer structure wherein cylindrical carbon layers overlap one another, and having a hollow-structured central axis, with aluminum, magnesium, copper or an alloy of such a metal, by molten metal forging.

Abstract: The present invention provides an FRP honeycomb structure which is used as a base structure material for various base structures and which offers appropriate rigidity and compression strength while reducing the weight of the entire structure.

Abstract: To provide a novel process for producing a unidirectional carbon fiber reinforced carbon composite material having all of high thermal conductivity, low thermal expansion properties and high strength, useful as e.g. a semiconductor heatsink. Carbon fibers are impregnated with a liquid for impregnation prepared by dispersing or dissolving powdery carbon, fine carbon fibers having a fiber diameter of from 0.5 to 500 nm and a fiber length of at most 1,000 ?m and having a hollow-structured central axis and a thermosetting resin in a medium, and the carbon fibers are molded, cured and then carbonized so that they are aligned in one direction.

Abstract: To provide a fine carbon fiber/metal composite material having high mechanical strength, a high thermal conductivity and a low coefficient of thermal expansion and suitable as a substrate for an electronic device. A fine carbon fiber/metal composite material, which is prepared by pressure impregnating a molded product containing fine carbon fibers having a fiber diameter of from 0.5 to 500 nm and a fiber length of at most 1,000 ?m, having a multilayer structure wherein cylindrical carbon layers overlap one another, and having a hollow-structured central axis, with aluminum, magnesium, copper or an alloy of such a metal, by molten metal forging.

Abstract: To provide a carbon fiber Ti—Al composite material having hardness, heat resistance and abrasion resistance, having reduced weight and improved strength and thermal conductivity and being excellent in uniformity of the quality. A carbon fiber Ti—Al composite material which is prepared by pressure impregnating a molded product containing fine carbon fibers having a fiber diameter of from 0.5 to 500 nm and a fiber length of at most 1,000 ?m and having a hollow-structured central axis and a titanium powder or a titanium oxide powder, with aluminum or an aluminum alloy by molten metal forging.

Abstract: To provide a carbon fiber Ti—Al composite material having hardness, heat resistance and abrasion resistance, having reduced weight, improved strength, elastic modulus and thermal conductivity and being excellent in the uniformity of the quality. A carbon fiber Ti—Al composite material which is prepared by pressure impregnating a molded product containing fine carbon fibers having a fiber diameter of from 0.5 to 500 nm and a carbon length of at most 1,000 ?m and having a hollow-structured central axis, carbon long fibers having a fiber diameter of from 5 to 15 ?m and a titanium powder or a titanium oxide powder, with aluminum or an aluminum alloy by molten metal forging.

Abstract: The present invention provides a method of producing the separator for a fuel cell that is suitable for mass production and that by separating the compression-molding process of pressing a precursor powder comprising carbon powder and thermosetting resin with a press from the resin-setting process of setting the thermosetting resin by applying heat, is capable of increasing the production rate of the expensive press, while at the same time decreasing the production cost. The fuel-cell separator is produced by a compression-molding process in which a mixture of carbon powder and thermosetting resin is used as the precursor powder, and in which a press is used to apply pressure to the precursor powder that has been placed in a die and mold it into a molded plate having a separator shape; and a resin-setting process in which the molded plate formed in the compression-molding process is heated in a heating apparatus such as an oven to set the thermosetting resin.

Abstract: According to the present invention, there is provided a carbon-based metal composite material comprising a carbonaceous matrix and a metal component dispersed in said carbonaceous matrix, wherein at least 90 volume percent of the pores of the carbonaceous matrix is substituted with said metal component, and the content of said metal component is 35% or less based on the total volume of said carbon-based metal composite material; a method of producing a carbon-based metal composite material wherein impregnation of the carbon formed body with molten metal under pressure is carried out by pre-heating said carbon formed body and then impregnating the open pores of the carbon formed body with molten metal under a pressure of at least 200 kg/cm2 of the cross-sectional area of the plunger; and a substrate-shaped formed body for an electronic component comprising a carbon-based metal composite material.

Abstract: A carbon fiber-reinforced carbon composite material is disclosed which includes a matrix of carbon and unidirectionally oriented carbon fibers dispersed in the matrix, wherein the content of the carbon fibers is at least 50% based on the volume of the composite material, wherein the volume of pores having a pore diameter of 10 .mu.m or more is not greater than 5% of the total pore volume of the composite material, and wherein at least 90% of the total pore volume is the volume of open pores. The composite material is obtained by impregnating carbon fibers with a dispersion having a viscosity of 5-50 cP at 25.degree. C. and containing carbonaceous powder with an average particle diameter of smaller than 0.5 .mu.m in an organic solvent solution of a thermosetting resin. After unidirectionally aligning the carbon fibers, the impregnated fibers are molded and cured and then calcined.

Abstract: Extremely high modulus carbon fibers can be produced by carbonization at a substantially lower temperature, for example, at about 2500.degree. C. This is made possible by selectively stabilizing only an outer surface layer portion of a carbonaceous pitch-based fiber comprised mainly of optically anisotropic components, while retaining the inner portion of the fiber in a non-stabilized state and without damage to the crystallinity thereof.