Patents by Inventor Eiko Imazaki
Eiko Imazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20260129754Abstract: A circuit board includes a fluororesin layer, an adherend layer and an adhesion layer bonding the fluororesin layer and the adherend layer together, the fluororesin layer contains polytetrafluoroethylene and a first inorganic filler, a content of the first inorganic filler in the fluororesin layer is 50% by volume to 66% by volume, the adhesion layer contains a resin and a second inorganic filler, a content of a fluororesin in the resin is 5% by mass or less, a content of the second inorganic filler in the adhesion layer is 29% by volume to 47% by volume, and a through-hole extending through the fluororesin layer and the adhesion layer is formed.Type: ApplicationFiled: September 4, 2023Publication date: May 7, 2026Applicants: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.Inventors: Shingo KAIMORI, Satoshi KIYA, Hiroshi UEDA, Motohiko SUGIURA, Eiko IMAZAKI
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Publication number: 20240422902Abstract: A dielectric sheet includes a polytetrafluoroethylene and spherical inorganic fillers, wherein a mass ratio of the inorganic fillers to the polytetrafluoroethylene is 1.3 or more, the inorganic fillers have an average particle diameter of 0.3 ?m to 4.0 ?m, and the inorganic fillers include a silica filler. Part of the polytetrafluoroethylene is present in the form of a plurality of fibrous bodies, and in a SEM image of a surface of the dielectric sheet after a 180-degree peel test, at least part of fibrous bodies among the plurality of fibrous bodies has areas with a thickness of 0.1 ?m to 3.0 ?m and a length of 50 ?m to 5000 ?m, and an average space between the areas of the at least part of fibrous bodies is 10 ?m or less.Type: ApplicationFiled: October 31, 2022Publication date: December 19, 2024Applicants: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.Inventors: Shingo KAIMORI, Takashi NINOMIYA, Yoshio MEZAKI, Motohiko SUGIURA, Eiko IMAZAKI, Yasuhiro OKUDA
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Patent number: 11343918Abstract: A method of making a printed circuit board includes a step of providing a double-sided plate that is an insulating substrate having conductive layers on respective surfaces thereof, a first coating step of coating a first surface of the double-sided plate with a first photosensitive resin film, a second coating step of coating a second surface of the double-sided plate with a second photosensitive resin film, a first exposure step of exposing the photosensitive resin film coating the first surface after the first and second coating steps, and a second exposure step of exposing the photosensitive resin film coating the second surface after the first exposure step, wherein a maximum depth of a depression in an outermost surface of the second photosensitive resin film used in the second exposure step is less than 1.0 ?m.Type: GrantFiled: December 17, 2018Date of Patent: May 24, 2022Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Shigeaki Uemura, Eiko Imazaki, Koji Nitta, Yoshio Oka, Hideki Matsuoka, Ippei Tanaka, Takayuki Yonezawa
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Patent number: 11304309Abstract: A printed circuit board according to an embodiment of the present disclosure includes a base film having an insulating property, and a conductive pattern that is stacked on at least one surface of the base film and that includes a plurality of wiring parts arranged in parallel. The plurality of wiring parts have an average width of 5 ?m or more and 15 ?m or less. The plurality of wiring parts have an electroless plating layer and an electroplating layer stacked on the electroless plating layer. A void density at an interface between the electroless plating layer and the electroplating layer in a section of the plurality of wiring parts in a thickness direction is 0.01 ?m2/?m or less.Type: GrantFiled: March 7, 2019Date of Patent: April 12, 2022Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Shoichiro Sakai, Eiko Imazaki, Koji Nitta
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Publication number: 20210153358Abstract: A printed circuit board according to an embodiment of the present disclosure includes a base film having an insulating property, and a conductive pattern that is stacked on at least one surface of the base film and that includes a plurality of wiring parts arranged in parallel. The plurality of wiring parts have an average width of 5 ?m or more and 15 ?m or less. The plurality of wiring parts have an electroless plating layer and an electroplating layer stacked on the electroless plating layer. A void density at an interface between the electroless plating layer and the electroplating layer in a section of the plurality of wiring parts in a thickness direction is 0.01 ?m2/?m or less.Type: ApplicationFiled: March 7, 2019Publication date: May 20, 2021Inventors: Shoichiro SAKAI, Eiko IMAZAKI, Koji NITTA
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Patent number: 10980114Abstract: A printed circuit board according to one embodiment of the present invention is a printed circuit board including a plate-shaped or a sheet-shaped insulating material having a penetrating hole, and a metal plating layer layered on both surfaces of the insulating material and an inner peripheral surface of the insulating material, wherein an inner diameter of the penetrating hole monotonically decreases from a top surface of the insulating material toward a back surface, and wherein the inner diameter of the penetrating hole at a center in a thickness direction of the insulating material is smaller than an average of an opening diameter on the top side and an opening diameter on the back side.Type: GrantFiled: July 24, 2018Date of Patent: April 13, 2021Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.Inventors: Eiko Imazaki, Koji Nitta, Kousuke Miura, Shoichiro Sakai, Kenji Takahashi, Masahiro Matsumoto, Hirohisa Saito
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Publication number: 20210045250Abstract: A method of making a printed circuit board includes a step of providing a double-sided plate that is an insulating substrate having conductive layers on respective surfaces thereof, a first coating step of coating a first surface of the double-sided plate with a first photosensitive resin film, a second coating step of coating a second surface of the double-sided plate with a second photosensitive resin film, a first exposure step of exposing the photosensitive resin film coating the first surface after the first and second coating steps, and a second exposure step of exposing the photosensitive resin film coating the second surface after the first exposure step, wherein a maximum depth of a depression in an outermost surface of the second photosensitive resin film used in the second exposure step is less than 1.0 ?m.Type: ApplicationFiled: December 17, 2018Publication date: February 11, 2021Inventors: Shigeaki UEMURA, Eiko IMAZAKI, Koji NITTA, Yoshio OKA, Hideki MATSUOKA, Ippei TANAKA, Takayuki YONEZAWA
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Patent number: 10917967Abstract: A printed wiring board includes an insulator having a first surface, and a second surface opposite to the first surface, a through-hole penetrating from the first surface to the second surface, and a metal plated layer formed on the first and second surfaces of the insulator, and on an inner peripheral surface of the through-hole, wherein an inside diameter of the through-hole gradually decreases from the first surface toward the second surface of the insulator. An average diameter of the through-hole is 20 ?m or greater and 35 ?m or less at the first surface, and is 3 ?m or greater and 15 ?m or less at the second surface, and an average thickness of the metal plated layer formed on the first and second surfaces is 8 ?m or greater and 12 ?m or less.Type: GrantFiled: March 6, 2019Date of Patent: February 9, 2021Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Kenji Takahashi, Eiko Imazaki, Koji Nitta, Shoichiro Sakai, Kousuke Miura, Masahiro Matsumoto, Hirohisa Saito
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Patent number: 10886531Abstract: Provided is a method for producing a negative electrode for an electric storage device, the method comprising the steps of preparing a negative electrode composition comprising a negative electrode active material that reversibly carries a sodium ion, metal sodium, and a liquid dispersion medium for dispersing them; allowing a negative electrode current collector to hold the negative electrode composition; evaporating at least part of the liquid dispersion medium from the negative electrode composition held by the negative electrode current collector, thereby giving a negative electrode precursor comprising the negative electrode active material, the metal sodium, and the negative electrode current collector; and bringing the negative electrode precursor into contact with an electrolyte having sodium ion conductivity, thereby doping the negative electrode active material with sodium eluted from the metal sodium.Type: GrantFiled: November 12, 2015Date of Patent: January 5, 2021Assignees: Sumitomo Electric Industries, Ltd., Nippon Soda Co., Ltd.Inventors: Koji Nitta, Shoichiro Sakai, Atsushi Fukunaga, Eiko Imazaki, Koma Numata, Hideaki Ito, Hitoshi Kobayashi, Toshiaki Yamashita, Shinichi Maruyama
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Publication number: 20200413537Abstract: A printed wiring board includes an insulator having a first surface, and a second surface opposite to the first surface, and including a through-hole penetrating from the first surface to the second surface, and a metal plated layer formed on the first surface and the second surface of the insulator, and on an inner peripheral surface of the through-hole, wherein an inside diameter of the through-hole gradually decreases from the first surface toward the second surface of the insulator, an average diameter of the through-hole at the first surface of the insulator is 20 ?m or greater and 35 ?m or less, the average diameter of the through-hole at the second surface of the insulator is 3 ?m or greater and 15 ?m or less, and an average thickness of the metal plated layer formed on the first surface and the second surface of the insulator is 8 ?m or greater and 12 ?m or less.Type: ApplicationFiled: March 6, 2019Publication date: December 31, 2020Inventors: Kenji TAKAHASHI, Eiko IMAZAKI, Koji NITTA, Shoichiro SAKAI, Kousuke MIURA, Masahiro MATSUMOTO, Hirohisa SAITO
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Publication number: 20200196445Abstract: A printed circuit board according to one embodiment of the present invention is a printed circuit board including a plate-shaped or a sheet-shaped insulating material having a penetrating hole, and a metal plating layer layered on both surfaces of the insulating material and an inner peripheral surface of the insulating material, wherein an inner diameter of the penetrating hole monotonically decreases from a top surface of the insulating material toward a back surface, and wherein the inner diameter of the penetrating hole at a center in a thickness direction of the insulating material is smaller than an average of an opening diameter on the top side and an opening diameter on the back side.Type: ApplicationFiled: July 24, 2018Publication date: June 18, 2020Inventors: Eiko IMAZAKI, Koji NITTA, Kousuke MIURA, Shoichiro SAKAI, Kenji TAKAHASHI, Masahiro MATSUMOTO, Hirohisa SAITO
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Patent number: 10270104Abstract: A positive electrode for a sodium ion secondary battery includes a positive electrode active material that intercalates and deintercalates sodium ions, a conductive assistant, a binder, and a carboxylic acid, the binder containing a vinylidene fluoride-based polymer, the carboxylic acid having at least one of a boiling point and a thermal decomposition point, and whichever of the boiling point and the thermal decomposition point is lower being higher than 150° C. The carboxylic acid is preferably at least one selected from the group consisting of hydroxy acids and polycarboxylic acids.Type: GrantFiled: July 22, 2015Date of Patent: April 23, 2019Assignee: Sumitomo Electric Industries, Ltd.Inventors: Eiko Imazaki, Shoichiro Sakai, Atsushi Fukunaga, Koji Nitta
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Publication number: 20190027744Abstract: Provided is a method for producing a negative electrode for an electric storage device, the method comprising the steps of: preparing a negative electrode composition comprising a negative electrode active material that reversibly carries a sodium ion, metal sodium, and a liquid dispersion medium for dispersing them; allowing a negative electrode current collector to hold the negative electrode composition; evaporating at least part of the liquid dispersion medium from the negative electrode composition held by the negative electrode current collector, thereby giving a negative electrode precursor comprising the negative electrode active material, the metal sodium, and the negative electrode current collector; and bringing the negative electrode precursor into contact with an electrolyte having sodium ion conductivity, thereby doping the negative electrode active material with sodium eluted from the metal sodium.Type: ApplicationFiled: November 12, 2015Publication date: January 24, 2019Applicants: Sumitomo Electric Industries, Ltd., Nippon Soda Co., Ltd.Inventors: Shinichi Maruyama, Koji Nitta, Shoichiro Sakai, Atsushi Fukunaga, Eiko Imazaki, Koma Numata, Hideaki Ito, Hitoshi Kobayashi, Toshiaki Yamashita, Shinichi Maruyama
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Publication number: 20180151877Abstract: Provided is a method for producing a negative electrode for an electric storage device, the method comprising the steps of: preparing a negative electrode composition comprising a negative electrode active material that reversibly carries a sodium ion, metal sodium, and a liquid dispersion medium for dispersing them; allowing a negative electrode current collector to hold the negative electrode composition; evaporating at least part of the liquid dispersion medium from the negative electrode composition held by the negative electrode current collector, thereby giving a negative electrode precursor comprising the negative electrode active material, the metal sodium, and the negative electrode current collector; and bringing the negative electrode precursor into contact with an electrolyte having sodium ion conductivity, thereby doping the negative electrode active material with sodium eluted from the metal sodium.Type: ApplicationFiled: November 12, 2015Publication date: May 31, 2018Applicants: Sumitomo Electric Industries, Ltd., Nippon Soda Co., Ltd.Inventors: Shinichi Maruyama, Koji Nitta, Shoichiro Sakai, Atsushi Fukunaga, Eiko Imazaki, Koma Numata, Hideaki Ito, Hitoshi Kobayashi, Toshiaki Yamashita, Shinichi Maruyama
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Publication number: 20170324086Abstract: Provided is a method for producing a negative electrode for an electric storage device, the method comprising the steps of preparing a negative electrode composition comprising a negative electrode active material that reversibly carries a sodium ion, metal sodium, and a liquid dispersion medium for dispersing them; allowing a negative electrode current collector to hold the negative electrode composition; evaporating at least part of the liquid dispersion medium from the negative electrode composition held by the negative electrode current collector, thereby giving a negative electrode precursor comprising the negative electrode active material, the metal sodium, and the negative electrode current collector; and bringing the negative electrode precursor into contact with an electrolyte having sodium ion conductivity, thereby doping the negative electrode active material with sodium eluted from the metal sodium.Type: ApplicationFiled: November 12, 2015Publication date: November 9, 2017Applicants: Sumitomo Electric Industries, Ltd., Nippon Soda Co., Ltd.Inventors: Koji Nitta, Shoichiro Sakai, Atsushi Fukunaga, Eiko Imazaki, Koma Numata, Hideaki Ito, Hitoshi Kobayashi, Toshiaki Yamashita
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Publication number: 20170309958Abstract: Provided are an electrolytic solution for sodium-ion secondary battery, the solution having sodium-ion conductivity, and including a sodium salt and a non-aqueous solvent, wherein the non-aqueous solvent includes a fluorophosphate ester and propylene carbonate, and a content of the fluorophosphate ester in the non-aqueous solvent is 5 to 50 mass %; and a sodium-ion secondary battery including the same.Type: ApplicationFiled: October 5, 2015Publication date: October 26, 2017Applicant: Sumitomo Electric Industries, Ltd.Inventors: Shoichiro Sakai, Koji Nitta, Atsushi Fukunaga, Eiko Imazaki, Masahiro Aoki
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Patent number: 9761871Abstract: An aspect of the present invention relates to a negative electrode for a sodium molten salt battery, the negative electrode including a negative electrode current collector and a negative electrode mixture layer arranged on a surface of the negative electrode current collector, the negative electrode mixture layer including negative electrode active material particles and a film arranged on a surface of each of the negative electrode active material particles, the negative electrode active material particles containing hard carbon, and the film containing a sodium-containing sulfide.Type: GrantFiled: May 23, 2014Date of Patent: September 12, 2017Assignee: Sumitomo Electric Industries, Ltd.Inventors: Shoichiro Sakai, Atsushi Fukunaga, Koma Numata, Eiko Imazaki, Koji Nitta
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Patent number: 9755240Abstract: Provided is an electrode for a sodium molten-salt battery in which degradation of the electrode can be suppressed even when charging and discharging are repeated, and which has excellent cycle characteristics. The electrode for a sodium molten-salt battery includes a current collector and an electrode mixture adhering to a surface of the current collector, in which the electrode mixture includes an electrode active material and a binder containing a polymer, and the polymer does not contain a fluorine atom. The polymer can include, for example, at least one selected from the group consisting of polyamide resins and polyimide resins or at least one selected from the group consisting of acrylic resins, rubber-like polymers, and cellulose derivatives.Type: GrantFiled: December 17, 2013Date of Patent: September 5, 2017Assignee: Sumitomo Electric Industries, Ltd.Inventors: Shoichiro Sakai, Koma Numata, Eiko Imazaki, Atsushi Fukunaga, Koji Nitta, Shinji Inazawa
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Publication number: 20170222228Abstract: A positive electrode for a sodium ion secondary battery includes a positive electrode active material that intercalates and deintercalates sodium ions, a conductive assistant, a binder, and a carboxylic acid, the binder containing a vinylidene fluoride-based polymer, the carboxylic acid having at least one of a boiling point and a thermal decomposition point, and whichever of the boiling point and the thermal decomposition point is lower being higher than 150° C. The carboxylic acid is preferably at least one selected from the group consisting of hydroxy acids and polycarboxylic acids.Type: ApplicationFiled: July 22, 2015Publication date: August 3, 2017Inventors: Eiko IMAZAKI, Shoichiro SAKAI, Atsushi FUKUNAGA, Koji NITTA
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Patent number: 9711827Abstract: Provided is a sodium molten-salt battery having good charge-discharge cycle characteristics. The sodium molten-salt battery includes a positive electrode that contains a positive electrode active material, a negative electrode that contains a negative electrode active material, and a molten-salt electrolyte that contains a sodium salt and an ionic liquid that dissolves the sodium salt. The negative electrode active material contains non-graphitizable carbon. The ionic liquid is a salt of a bis(sulfonyl)imide anion and a first onium cation that does not cause a Faradaic reaction with the non-graphitizable carbon. The molten-salt electrolyte contains a second onium cation in an amount of 1,000 ppm by mass or less. The second onium cation is represented by a general formula (1): R1R2R3R4N+ where R1 to R4 are each independently a hydrogen atom or a methyl group.Type: GrantFiled: March 7, 2014Date of Patent: July 18, 2017Assignee: Sumitomo Electric Industries, Ltd.Inventors: Atsushi Fukunaga, Shinji Inazawa, Koji Nitta, Shoichiro Sakai, Eiko Imazaki, Koma Numata