Patents by Inventor Eiko Nakao

Eiko Nakao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photosolder resist composition
    Patent number: 5506321
    Abstract: A photosensitive resin composition or photosensitive heat-curing resin composition comprising a photocurable oligomer containing 2 or more polymerizable double bonds and a carboxyl group and a heat-curing component selected from a compound containing one polymerizable double bond and one epoxy group, a compound containing one or more polymerizable double bonds and one or more blocked isocyanate groups; a photosensitive resin composition comprising a photocurable oligomer containing a carboxyl group, a blocked isocyanate group and 2 or more polymerizable double bonds; and a novel compound containing one or more polymerizable double bonds and one or more blocked isocyanate groups are disclosed. The resin compositions have high photosensitivity, excellent developability and provide a solder resist pattern with excellent properties.
    Type: Grant
    Filed: October 29, 1993
    Date of Patent: April 9, 1996
    Assignee: Ajinomoto Co., Inc.
    Inventors: Hiroyasu Koto, Kiyonori Furuta, Eiko Nakao, Shigeo Nakamura