Patents by Inventor Eiko Wakata

Eiko Wakata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210304968
    Abstract: Disclosed herein is a multilayer capacitor that includes a capacitor layer having a plurality of odd-numbered electrode layers which are positioned at odd-numbered rows and a plurality of even-numbered electrode layers which are positioned at even-numbered rows. The capacitor layer includes a first side surface to which the odd-numbered electrode layers are exposed, a second side surface to which the even-numbered electrode layers are exposed, and a first planar region. The first external terminal covers the first side surface so as to be connected to the odd-numbered electrode layers. The second external terminal covers the second side surface so as to be connected to the even-numbered electrode layers. The first external terminal covers also the first planar region and is connected to the first internal electrode layer through a first via conductor extending in a stacking direction.
    Type: Application
    Filed: March 19, 2021
    Publication date: September 30, 2021
    Inventors: Daiki ISHII, Eiko WAKATA
  • Patent number: 10958232
    Abstract: Disclosed herein is an LC filter that includes a conductive substrate, a first capacitive insulating film having one surface covered with the conductive substrate and other surface covered with a first capacitive electrode, a first inductor pattern having one end connected to the first capacitive electrode, a first terminal electrode connected to other end of the first inductor pattern, and a common terminal electrode connected to the conductive substrate.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: March 23, 2021
    Assignee: TDK CORPORATION
    Inventors: Eiko Wakata, Kenichi Yoshida
  • Publication number: 20200035410
    Abstract: Disclosed herein is an LC filter that includes a conductive substrate, a first capacitive insulating film having one surface covered with the conductive substrate and other surface covered with a first capacitive electrode, a first inductor pattern having one end connected to the first capacitive electrode, a first terminal electrode connected to other end of the first inductor pattern, and a common terminal electrode connected to the conductive substrate.
    Type: Application
    Filed: July 24, 2019
    Publication date: January 30, 2020
    Inventors: Eiko WAKATA, Kenichi YOSHIDA
  • Patent number: 10211157
    Abstract: An electronic component includes a first electronic component and a second electronic component that is stacked on the first electronic component. A second electrode layer of the first electronic component includes a plurality of divided electrode layers, and a pair of electrodes of the second electronic component are electrically connected to different electrode layers included in the plurality of electrode layers of the second electrode layer, and a first electrode layer of the first electronic component is divided into a plurality of electrode layers to correspond to the electrode layers which are included in the second electrode layer and which are electrically connected to the pair of electrodes of the second electronic component.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: February 19, 2019
    Assignee: TDK CORPORATION
    Inventors: Kenichi Yoshida, Mitsuhiro Tomikawa, Eiko Wakata
  • Publication number: 20170373009
    Abstract: An electronic component includes a first electronic component and a second electronic component that is stacked on the first electronic component. A second electrode layer of the first electronic component includes a plurality of divided electrode layers, and a pair of electrodes of the second electronic component are electrically connected to different electrode layers included in the plurality of electrode layers of the second electrode layer, and a first electrode layer of the first electronic component is divided into a plurality of electrode layers to correspond to the electrode layers which are included in the second electrode layer and which are electrically connected to the pair of electrodes of the second electronic component.
    Type: Application
    Filed: June 26, 2017
    Publication date: December 28, 2017
    Applicant: TDK CORPORATION
    Inventors: Kenichi YOSHIDA, Mitsuhiro TOMIKAWA, Eiko WAKATA
  • Publication number: 20160293334
    Abstract: A lower electrode (4) can have an uneven surface structure. An upper electrode (6) can also have the uneven surface structure. A projecting portion of the upper electrode (6) projecting to the lower electrode side is positioned in a gap between projecting portions of the lower electrode (4) and the lower electrode (4) includes Cu as a main component. Young's moduli of a substrate (1), a stress adjustment layer (2), and the lower electrode (4) have a specific relation. Also, corner portions of radii (R1) of curvature positioned inside a projecting portion (4b) have a specific relation.
    Type: Application
    Filed: March 29, 2016
    Publication date: October 6, 2016
    Applicant: TDK CORPORATION
    Inventors: Shinji EHARA, Ikuhito ONODERA, Eiko WAKATA, Katsunori OSANAI, Masamichi TANIGUCHI
  • Patent number: 8952767
    Abstract: A bandpass filter includes a layered structure including a plurality of stacked dielectric layers, and first to third resonators provided within the layered structure. In terms of circuit configuration, the second resonator is located between the first and third resonators. The first resonator includes a first inductor and a first capacitor. The second resonator includes a second inductor and a second capacitor. The third resonator includes a third inductor and a third capacitor. The second inductor is disposed at a position different from that of each of the first and third inductors in the stacking direction of the dielectric layers. The second inductor is lower in inductance than the first and third inductors. The second capacitor is higher in capacitance than the first and third capacitors.
    Type: Grant
    Filed: March 26, 2012
    Date of Patent: February 10, 2015
    Assignee: TDK Corporation
    Inventors: Eiko Wakata, Shigemitsu Tomaki, Isao Abe
  • Patent number: 8378763
    Abstract: A bandpass filter includes three resonators of which adjacent two are electromagnetically coupled to each other, and two coupling paths connected in parallel for forming capacitive coupling between non-adjacent two of the resonators. Each of the two coupling paths includes at least one capacitor and an inductor connected in series. The two coupling paths function to form an attenuation pole at a frequency lower than the passband frequencies in the pass attenuation characteristics of the bandpass filter.
    Type: Grant
    Filed: September 24, 2010
    Date of Patent: February 19, 2013
    Assignee: TDK Corporation
    Inventor: Eiko Wakata
  • Publication number: 20120249264
    Abstract: A bandpass filter includes a layered structure including a plurality of stacked dielectric layers, and first to third resonators provided within the layered structure. In terms of circuit configuration, the second resonator is located between the first and third resonators. The first resonator includes a first inductor and a first capacitor. The second resonator includes a second inductor and a second capacitor. The third resonator includes a third inductor and a third capacitor. The second inductor is disposed at a position different from that of each of the first and third inductors in the stacking direction of the dielectric layers. The second inductor is lower in inductance than the first and third inductors. The second capacitor is higher in capacitance than the first and third capacitors.
    Type: Application
    Filed: March 26, 2012
    Publication date: October 4, 2012
    Applicant: TDK CORPORATION
    Inventors: Eiko WAKATA, Shigemitsu TOMAKI, Isao ABE
  • Publication number: 20110074527
    Abstract: A bandpass filter includes three resonators of which adjacent two are electromagnetically coupled to each other, and two coupling paths connected in parallel for forming capacitive coupling between non-adjacent two of the resonators. Each of the two coupling paths includes at least one capacitor and an inductor connected in series. The two coupling paths function to form an attenuation pole at a frequency lower than the passband frequencies in the pass attenuation characteristics of the bandpass filter.
    Type: Application
    Filed: September 24, 2010
    Publication date: March 31, 2011
    Applicant: TDK CORPORATION
    Inventor: Eiko WAKATA
  • Publication number: 20070229191
    Abstract: A surface acoustic wave element comprises a first surface acoustic wave element unit formed on a surface of a piezo-electric substrate, and a second surface acoustic wave element unit formed on the surface of said piezo-electric substrate adjacent to said first surface acoustic wave element unit. Each of said first surface acoustic wave element unit and said second surface acoustic wave element unit includes a signal input terminal, a signal output terminal, a ground terminal, a signal path for coupling said signal input terminal to the signal output terminal, series arm resonators connected in series on said signal path, a branch line branched from said signal path to said ground terminal, and parallel arm resonators connected on said branch line. The signal path of at least one of the first surface acoustic wave element unit and second surface acoustic wave element unit is extended outside of the center line of said surface acoustic wave element unit.
    Type: Application
    Filed: March 2, 2007
    Publication date: October 4, 2007
    Applicant: TDK CORPORATION
    Inventors: Masahiro Yamaki, Yoshikazu Kihara, Eiko Wakata