Abstract: A light emitting device, a transmitter, and a silicon photonics chip, among other things, are disclosed. An illustrative light emitting device is disclosed to include a silicon substrate, a waveguide disposed on or integrated in the silicon substrate, where the waveguide includes a wide waveguide section at a first end and a narrow waveguide section at a second end, a first metal pad disposed over the wide waveguide section and at least partially across the first end of the waveguide, and a second metal pad disposed over the wide waveguide section, distanced away from the first metal pad. Electrical current passing between the first metal pad and the second metal pad may cause light to be produced in the wide waveguide section and the light produced in the wide waveguide section is at least partially reflected by the first metal pad and directed to the narrow waveguide section for transmission.

Abstract: Processes for localized lasering of a lamination stack and graphene-coated printed circuit board (PCB) are disclosed. An example PCB may include a lamination stack, post-lamination, that may further include a core, an adhesive layer, and at least one graphene-metal structure. A top layer of graphene of the graphene-metal structure may have never been grown before the lamination process or may have been removed post-lamination such that a portion of the top layer of graphene is missing. The localized lasering process described herein may grow (for the first time) or re-grow the graphene layer of the exposed portion of the metal layer without adverse effects to the rest of the lamination stack or PCB and while promoting a uniform layer of graphene on the top surface. A process of growing graphene through application of molecular layer and a self-assembled monolayer (SAM), are also described herein.