Abstract: A ball grid array (BGA) assembly can include a component substrate having at least one underfill channel defined therethrough providing fluidic communication between a first side of the component substrate and a second side of the component substrate, a plurality of pads or leads exposed on the second side and configured to be soldered to a mating PCB, a cover mounted to the component substrate defining a reservoir cavity between the first side and the cover, and an underfill material disposed within the reservoir cavity such that the underfill material can flow through the at least one underfill channel to a gap defined between the second side and the mating PCB when the component substrate is being soldered to the mating PCB.

Abstract: A ball grid array (BGA) assembly can include a component substrate having at least one underfill channel defined therethrough providing fluidic communication between a first side of the component substrate and a second side of the component substrate, a plurality of pads or leads exposed on the second side and configured to be soldered to a mating PCB, a cover mounted to the component substrate defining a reservoir cavity between the first side and the cover, and an underfill material disposed within the reservoir cavity such that the underfill material can flow through the at least one underfill channel to a gap defined between the second side and the mating PCB when the component substrate is being soldered to the mating PCB.

Abstract: A ball grid array (BGA) assembly can include a component substrate having at least one underfill channel defined therethrough providing fluidic communication between a first side of the component substrate and a second side of the component substrate, a plurality of pads or leads exposed on the second side and configured to be soldered to a mating PCB, a cover mounted to the component substrate defining a reservoir cavity between the first side and the cover, and an underfill material disposed within the reservoir cavity such that the underfill material can flow through the at least one underfill channel to a gap defined between the second side and the mating PCB when the component substrate is being soldered to the mating PCB.

Abstract: A frequency controlled oscillator (100) is manufactured using an array (200) of mechanically interconnected oscillator bases (110) having component cavities (130) and wiring patterns therein. A frequency control component (120) serves as a cover for a cavity within the array, and in addition is electrically connected to oscillator components (140, 150) mounted within the cavity to regulate the frequency of electrical oscillation. Both the oscillator bases and finished oscillators may be tested while still in the array, prior to being separated from each other. In a most preferred embodiment, the array of oscillator bases are manufactured from a polymeric sheet material laminated with electrically conductive traces. The polymeric sheet material is selectively punched or formed prior to lamination so that intermediate and upper layers (112, 113) have predetermined sections removed.

Abstract: A frequency controlled oscillator (100) is manufactured using an array (200) of mechanically interconnected oscillator bases (110) having component cavities (130) and wiring patterns therein. A frequency control component (120) serves as a cover for a cavity within the array, and in addition is electrically connected to oscillator components (140, 150) mounted within the cavity to regulate the frequency of electrical oscillation. Both the oscillator bases and finished oscillators may be tested while still in the array, prior to being separated from each other. In a most preferred embodiment, the array of oscillator bases are manufactured from a polymeric sheet material laminated with electrically conductive traces. The polymeric sheet material is selectively punched or formed prior to lamination so that intermediate and upper layers (112, 113) have predetermined sections removed.

Abstract: A heater apparatus (10) for a piezoelectric device (12) includes a resistive heating element (18) on an insulating substrate (14). The heating element (18) maintains a temperature of the piezoelectric device (12) within a predetermined temperature range. A plurality of electrical couplings (20) extend through the insulating substrate (14). The electrical couplings (20) electrically connect to the heating element (18) and mechanically and electrically connect to the piezoelectric device (12). The piezoelectric device (12) is suspended above the heating element (18) on at least two of the electrical couplings (20). As a result, the heater apparatus (10) and piezoelectric device (12) can be enclosed within a standard crystal package.

Abstract: A diffusion bonding process provides a metallurgical bond between at least two metallic bodies having either iron or nickel as a component, utilizing a cobalt base alloy diffusion bondable to the metallic bodies at a temperature below the liquidus of either body but sufficient to promote interdiffusion of the cobalt alloy and metallic bodies. The bodies and alloy are contacted and subjected to the bonding temperature, whereupon solid state diffusion bonding occurs, producing a metallurgical bond which has a strength equivalent to brazing.