Patents by Inventor Eileen KUTSCHA

Eileen KUTSCHA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Non-destructive optical method for determining minimum bond strength and proving bond efficacy
    Patent number: 10228237
    Abstract: A method for determining a strain includes bonding first and second components together, at an elevated temperature, using a bonding agent. A strain is then measured in the first component using a strain measurement tool as the first component cools from the elevated temperature. The strain measurement tool is configured to detect movement the first component as the first component cools.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: March 12, 2019
    Assignee: THE BOEING COMPANY
    Inventors: Keith D. Humfeld, Eileen Kutscha
  • NON-DESTRUCTIVE OPTICAL METHOD FOR DETERMINING MINIMUM BOND STRENGTH AND PROVING BOND EFFICACY
    Publication number: 20190017810
    Abstract: A method for determining a strain includes bonding first and second components together, at an elevated temperature, using a bonding agent. A strain is then measured in the first component using a strain measurement tool as the first component cools from the elevated temperature. The strain measurement tool is configured to detect movement the first component as the first component cools.
    Type: Application
    Filed: July 12, 2017
    Publication date: January 17, 2019
    Inventors: Keith D. HUMFELD, Eileen KUTSCHA