Abstract: A selectively metallized heat transfer label for transfer to a substrate includes a support portion having a carrier layer and a release layer applied to the carrier layer, and a transfer portion including a protective layer applied to the release layer, a metallizable layer applied to the protective layer, a metal layer applied to the metallizable layer, a metal transferring adhesive layer applied to the metal layer and configured to adhere to both the metal layer and the desired substrate and a non-metal transferring ink layer applied to the metal layer and configured to adhere to the desired substrate but not to the metal layer. When heat and pressure are applied to the carrier, the metal transferring adhesive adheres to both the metal layer and the substrate while the non-transferring ink layer adheres only to the substrate.

Abstract: A selectively metallized heat transfer label for transfer to a substrate includes a support portion comprising a carrier layer and a release layer applied to the carrier layer, and a transfer portion comprising a protective layer applied to the release layer, a metallizable layer applied to the protective layer, a metal layer applied to the metallizable layer, a metal transferring adhesive layer applied to the metal layer and configured to adhere to both the metal layer and the desired substrate and a non-metal transferring ink layer applied to the metal layer and configured to adhere to the desired substrate but not to the metal layer. The protective layer and the metallizable layer can be formed from the same material, as separate layers. When heat and pressure are applied to the carrier layer using conventional heat transfer equipment, the metal transferring adhesive adheres to both the metal layer and the substrate while the non-transferring ink layer adheres only to the substrate.