Abstract: Polyamide substrates are pre-conditioned for electroless plating by contact with an aqueous alkaline solution having a pH of at least about 10 and etched with an aqueous acid etch solution of an organic acid containing at least two carbon atoms, in combination with from 1 to 10 percent by weight of an inorganic acid which is nondeleteriously reactive with the organic acid. Trichloroacetic acid is the preferred organic acid and sulfuric, hydrochloric and/or nitric the preferred inorganic acids. Contact with the aqueous alkaline solution can be eliminated where the polyamide is caprolactam.

Abstract: Filled polyester substrates are conditioned for electroless plating by contact with an alkaline conditioner having a pH of at least 8, followed by contact with an aqueous acid fluoride etch solution having a pH less than about 5 and a fluoride concentration of at least 1 mole per liter of solution.

Abstract: Filled polycarbonate resin substrates are conditioned for electroless plating by contact with an alkaline conditioner having a pH of at least 8, followed by contact with an aqueous acid fluoride etch solution having a pH less than about 5 and a fluoride concentration of at least 1 mole per liter of solution.

Abstract: Polyamide substrates are pre-conditioned for electroless plating by contact with an alkaline aqueous solution having a pH of at least about 10 and etched with an aqueous acid etch solution. The aqueous acid etch solution is preferably an aqueous solution of an organic acid containing at least two carbon atoms, particularly an acetic acid compound, such as trichloroacetic acid.

Abstract: Caprolactam polymeric substrates are conditioned for electroless plating by etching with an aqueous solution of organic acid containing from 2 to 4 carbon atoms, preferably an acetic acid compound, such as trichloroacetic acid.

Abstract: Mixtures of water with water soluble and/or miscible halogenated compounds are used to pre-etch polysulfone and other polymers such as polyesters and polycarbonates to induce or improve adhesion of metals deposited by electroless plating processes.

Abstract: An aqueous noble metal suspension capable of one stage activation of the surface of a nonconductor for electroless plating is provided by reducing a noble metal ion in an aqueous solution of a noble metal salt with a non-complexing reducing agent for the noble metal ion in the presence of a water soluble organic suspending agent.The particulate noble metal is rapidly absorbed by a nonconducting surface over a broad range of operating temperatures when the suspension is maintained at a pH below 3.5.

Abstract: Water soluble salts of metals other than the noble metals, such as copper and nickel salts, are converted in the presence of a water soluble suspending agent to suspensions of water insoluble catalytic particles which are absorbable onto the surface of nonconductors to permit electroless plating of the surfaces.