Abstract: A device is provided. The device can include a heatsink arrangement for dissipating heat within the device, a heat generating component, a heat conducting channel and a casing. The casing can be shaped and dimensioned to carry the heatsink arrangement and the heat generating component. The casing can include a first face and a second face. The first and second faces can be spaced apart such that sides are defined therebetween. The first face, the second face and the sides can form an enclosure associable with air volume defined by air enclosed within the enclosure. The heat conducting channel can couple the heat generating component and the heatsink arrangement so as to channel heat from the heat generating component to the heatsink arrangement, thereby reducing amount of heat being dissipated directly to the air volume. The heat generating component and the heat conducting channel are within the enclosure.