Patents by Inventor Ein Ng

Ein Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a semiconductor package and leadframe therefor
    Publication number: 20060263940
    Abstract: A leadframe for a semiconductor package is formed with an indentation on a bottom surface. A side of the indentation is used to form a mold-lock that assists in securing the leadframe to the encapsulation material of the semiconductor package.
    Type: Application
    Filed: July 24, 2006
    Publication date: November 23, 2006
    Inventors: Chuan Ng, Ein Ng, Yeu Lee
  • Method of forming a semiconductor package and leadframe therefor
    Publication number: 20050179118
    Abstract: A leadframe for a semiconductor package is formed with an indentation on a bottom surface. A side of the indentation is used to form a mold-lock that assists in securing the leadframe to the encapsulation material of the semiconductor package.
    Type: Application
    Filed: May 21, 2004
    Publication date: August 18, 2005
    Inventors: Chuan Ng, Ein Ng, Yeu Lee