Patents by Inventor Eisaku Kojima

Eisaku Kojima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding apparatus
    Publication number: 20060191631
    Abstract: Laser generated from a laser generator is reflected by a laser mirror, passes through an array substrate (glass substrate) through a backup glass, and then, directly irradiated to an ACF in a pinpoint manner. The laser from the laser generator is set to have a wavelength whose transmittance of transmitting the TCP and the array substrate having the ACF inserted therebetween is higher than that of the other wavelength. The ACF is welded by this laser irradiation, so that the TCP and the array substrate are bonded to each other.
    Type: Application
    Filed: February 9, 2006
    Publication date: August 31, 2006
    Inventors: Eisaku Kojima, Takehiko Wada