Abstract: In a state wherein front ends of latch members 18A and 18B are apart from each other so that the upper surface of an alignment plate/positioning member 24 is outside, a pressing section 12PU of a heat sink member 12 is brought into contact with the periphery of a semiconductor device 22.

Abstract: In a state wherein front ends of latch members 18A and 18B are apart from each other so that the upper surface of an alignment plate/positioning member 24 is outside, a pressing section 12PU of a heat sink member 12 is brought into contact with the periphery of a semiconductor device 22.

Abstract: An IC socket in which a presser cover is closed with respect to a socket body, and a body or leads of an IC loaded in the socket body are pressed by an IC pressing member attached to the presser cover so as to be contacted under pressure with contacts of the socket body. The IC pressing member and the presser cover are attached together through a resiliently engageable resilient engagement mechanism.

Abstract: A socket for an IC package includes a plurality of contacts arranged in array in such a manner as to correspond to a plurality of IC leads of an IC package. Each of the contacts comprises a first unitary contact extending to a lower surface portion of each of the unitary IC leads so as to be brought into pressure contact with the lower surface portion, and a second unitary contact extending to a side surface portion of the lead so as to be brought into pressure contact with the side surface portion. The first and second unitary contacts have male terminals separately connected to a wiring board, respectively.