Abstract: This invention provides a baggage inspection device that can maintain or improve inspection throughput. The Baggage Inspection Device 100 according to an embodiment of this invention comprises Conveyor 20 that transports Baggage BA, Inspection Unit 10 that inspects Baggage BA, Curtain 31 that shields X-rays emitted from Inspection Unit 10, and Transportation Assist Mechanism 32 that assists transportation of Baggage BA by moving Curtain 31 that comes into contact with Baggage BA in a direction along Direction D1, i.e. the transport direction of Baggage BA.

Abstract: A means is provided for enabling easy identification of baggage in which one or more hazardous item is detected. An inspection system is equipped with a first conveyor, inspection device, cover, camera, controller and display. The first conveyor transports baggage to the inspection device. The inspection device captures transmitted-light images of the baggage using light that transmits through the baggage. The cover covers a transport path of the baggage to prevent a hand of a visitor from being inserted into an image shooting area where electromagnetic waves that are harmful to the human body are irradiated. The camera captures visible-light images of the baggage using visible light. The controller controls the first conveyor, inspection device, camera and display. Under control of the controller, the display simultaneously displays a transmitted-light image and a visible-light image of the baggage.

Abstract: A technique is provided to enable a baggage holder to smoothly place baggage on a conveyor belt. An inspection device inspects the baggage of a visitor using x-rays. A belt conveyor transports the baggage to an inspection device. On the surface of the belt, plural marks are printed at predetermined intervals along the transport direction. When the belt conveyor drives the belt, the marks move in the transport direction at the transport speed of the belt. When placing baggage on the belt, the visitor can easily perceive the status of the belt, such as its transport direction and speed. The inspection device may have a light emitter near the loading position where baggage should be placed on the belt, and the color of light from the light emitter may change to notify the visitor when baggage should be placed on the belt.

Abstract: Provided are a system for non-destructively inspecting baggage, a method for non-destructively inspecting baggage, a program, and a recording medium in which an inspection that corresponds to the owner of an article to be inspected is performed even when the article to be inspected overlaps various objects including similar materials, whereby the system, method, program, and recording medium are efficient and do not exhibit any oversight in inspection.

Abstract: A physical quantity sensor for detecting a physical quantity includes: a first substrate having a first physical quantity detection element; a second substrate having a second physical quantity detection element, wherein the second substrate contacts the first substrate; and an accommodation space disposed between the first substrate and the second substrate. The first physical quantity detection element is disposed in the accommodation space. The first physical quantity detection element is protected with the first substrate and the second substrate since the first physical quantity detection element is sealed in the accommodation space.

Abstract: A semiconductor pressure sensing apparatus includes a metallic stem having a diaphragm and a semiconductor sensor bonded to the diaphragm. The semiconductor sensor includes a gauge section and first and second bonding pads. The gauge section is configured to be deformed according to a deformation of the diaphragm. The first and second bonding pads are respectively connected to different positions of the gauge section so that an electrical resistance between the first and second bonding pads can change with a change in the deformation of the diaphragm. The gauge section is formed to a semiconductor layer of an silicon-on-insulator substrate. The semiconductor sensor is directly bonded to the diaphragm by activating contact surfaces between the semiconductor sensor and the diaphragm.

Abstract: A physical quantity sensor for detecting a physical quantity includes: a first substrate having a first physical quantity detection element; a second substrate having a second physical quantity detection element, wherein the second substrate contacts the first substrate; and an accommodation space disposed between the first substrate and the second substrate. The first physical quantity detection element is disposed in the accommodation space. The first physical quantity detection element is protected with the first substrate and the second substrate since the first physical quantity detection element is sealed in the accommodation space.

Abstract: A physical quantity sensor for detecting a physical quantity includes: a first substrate having a first physical quantity detection element; a second substrate having a second physical quantity detection element, wherein the second substrate contacts the first substrate; and an accommodation space disposed between the first substrate and the second substrate. The first physical quantity detection element is disposed in the accommodation space. The first physical quantity detection element is protected with the first substrate and the second substrate since the first physical quantity detection element is sealed in the accommodation space.

Abstract: A semiconductor pressure sensing apparatus includes a metallic stem having a diaphragm and a semiconductor sensor bonded to the diaphragm. The semiconductor sensor includes a gauge section and first and second bonding pads. The gauge section is configured to be deformed according to a deformation of the diaphragm. The first and second bonding pads are respectively connected to different positions of the gauge section so that an electrical resistance between the first and second bonding pads can change with a change in the deformation of the diaphragm. The gauge section is formed to a semiconductor layer of an silicon-on-insulator substrate. The semiconductor sensor is directly bonded to the diaphragm by activating contact surfaces between the semiconductor sensor and the diaphragm.

Abstract: A physical quantity sensor for detecting a physical quantity includes: a first substrate having a first physical quantity detection element; a second substrate having a second physical quantity detection element, wherein the second substrate contacts the first substrate; and an accommodation space disposed between the first substrate and the second substrate. The first physical quantity detection element is disposed in the accommodation space. The first physical quantity detection element is protected with the first substrate and the second substrate since the first physical quantity detection element is sealed in the accommodation space.

Abstract: A semiconductor device having a membrane includes a semiconductor substrate, which has an active surface, and a membrane. A cavity is located between the active surface and the membrane and hermetically sealed. The membrane includes a first film, which has a through hole that extends through the first film, and a second film, which has been formed by reflowing a reflow layer made of a material that becomes viscous and reflows when heated. The through hole has been plugged by the second film.

Abstract: A semiconductor sensor includes a P-type semiconductor substrate having a N-type semiconductor layer disposed on one surface of the substrate and a P-type diffused resistor disposed in the N-type semiconductor layer. A first electric voltage is applied to the N-type semiconductor layer, a second electric voltage is applied to the substrate, a third electric voltage is applied to the P-type diffused resistor. The first electric voltage is higher than the second and third electric voltages. The sensor ensures stable operation against electric leakage and high noise protection because two depletion layers are formed.

Abstract: A semiconductor sensor includes a P-type semiconductor substrate having a N-type semiconductor layer disposed on one surface of the substrate and a P-type diffused resistor disposed in the N-type semiconductor layer. A first electric voltage is applied to the N-type semiconductor layer, a second electric voltage is applied to the substrate, a third electric voltage is applied to the P-type diffused resistor. The first electric voltage is higher than the second and third electric voltages. The sensor ensures stable operation against electric leakage and high noise protection because two depletion layers are formed.

Abstract: A semiconductor device having a membrane includes a semiconductor substrate, which has an active surface, and a membrane. A cavity is located between the active surface and the membrane and hermetically sealed. The membrane includes a first film, which has a through hole that extends through the first film, and a second film, which has been formed by reflowing a reflow layer made of a material that becomes viscous and reflows when heated. The through hole has been plugged by the second film.

Abstract: An airflow sensor including a micro-heater having a film structure, which can reduce a warpage of the film structure even when a thick ness of the film structure to improve a mechanical strength thereof. An airflow sensor is provided with a monocrystalline silicon substrate having a hollow portion therein; a thin film heater portion as a micro-heater arranged above the hollow portion; and a temperature sensor. The thin film heater portion has a laminated structure of a lower thin film, a heater layer, and an upper thin film. The lower and the upper thin film respectively have a tensile stress film and a compressive stress film laminated with the tensile stress film, and are symmetry laminated with respect to the heater layer. The tensile stress film is made up of a Si3N4 film having a great moisture-proof characteristic; and the compressive stress film is made up of a SiO2 film having a great adhesion.

Abstract: In the method for manufacturing a semiconductor substrate, a concavity and a connecting hole for connecting the concavity to the outside are formed on a lower face side of a first substrate, and the first substrate is laminated with a second substrate in an atmosphere at atmospheric pressure. A diaphragm is formed by thinning the first substrate from its upper face by polishing. A sealing hole reaching to the connecting hole is formed from the upper face of the first substrate. An oxide film is formed in the sealing hole in a vacuum, whereby the connecting hole is sealed while the pressure of the pressure reference chamber is reduced to a vacuum. In this way, since the pressure reference chamber is pressure-reduced in a final stage, the diaphragm can be prevented from deforming due to pressure difference during polishing.

Abstract: A semiconductor acceleration sensor, which prevents an adhesion of a movable portion to a fixed portion due to an electrostatic force generated during being handled. The acceleration sensor has a sensor portion and a handling portion. The sensor portion has a first semiconductor layer; a movable portion including a weight portion supported to the first semiconductor layer for moving in accordance with an acceleration externally applied thereto and movable electrodes integrally formed with the weight portion; and fixed electrodes having a detection surface confronted to a detection surface of the movable electrodes and supported to the first semiconductor layer. The handling portion is to be contacted during being handled, and is provided at surrounding portion of the sensor portion with a trench interposed therebetween. The sensor portion is electrically insulated from the handling portion by the trench.

Abstract: White light projected from a white light source is divided into three light beams of primary colors, i.e., red, green and blue by a dichroic mirror. Three light beams projected from the dichroic mirror are made incident upon a micro-lens array and reflected on and modulated in a liquid crystal panel disposed beneath the micro-lens array. The liquid crystal panel is driven by a driver circuit which supplies color signals to the panel, thereby modulating the light beams in the panel. The modulated light beams are projected from the micro-lens array to a schlieren diaphragm which eliminates scattered light components from the light beams. The light beams then enter into a projection lens and display color images on the screen. Since light beams constituting a picture element consisting of red, green and blue colors are projected from a single micro-lens of the micro-lens array, a color image displayed on the screen has no blur among three primary colors.

Abstract: In an improved semiconductor pressure sensor adapted to detect a pressure of a measured medium such as a refrigerant used in a refrigerating cycle for an automobile, there are provided a sensing portion composed of a glass support plate and a silicon substrate disposed thereon and provided with a diaphragm portion displaceable in accordance to a pressure of the measured medium at such a position of the silicon substrate as to be brought into contact with the measured medium, a detecting means disposed within the sensing portion so as to detect a displacement of the diaphragm portion, a housing having an interior space including an accommodation portion for accommodating the sensing portion and having at least a predetermined portion of the accommodation portion made up of metal as opposed to the sensing portion, and a solder glass provided between the predetermined portion of the housing and a predetermined portion of the sensing portion so as to hermetically seal the interior space of the housing with respec

Abstract: A facedown-type semiconductor pressure sensor has a Si sensing element including a diaphragm, a spacer, and a piezoresistive device embedded in the diaphragm, and a pedestal. The spacer, which is positioned between the semiconductor substrate and the pedestal, has a photolitho-graphically etched hole such that the sensing element, the hole and the pedestal define a sealed chamber. The sealed pressure chamber is substantially aligned with the diaphragm.