Abstract: An etching apparatus for etching a printed circuit board includes a transport mechanism for horizontally transporting a printed circuit board in a transporting direction so that a height of the printed circuit board during etching is kept at a transport position, a plurality of upper spray nozzles for injecting an etchant to a top surface of the printed circuit board transported by the transport mechanism, and a plurality of lower spray nozzles for injecting an etchant to a bottom surface of the printed circuit board. In the etching apparatus, a flow rate of the etchant injected to the top surface of the printed circuit board is made greater than a flow rate of the etchant injected to the bottom surface of the printed circuit board by an arrangement of the upper spray nozzles and the lower spray nozzles.

Abstract: A method of applying a coating material to two surfaces of a plate includes the steps of applying the coating material to the two surfaces simultaneously such that holding areas in the absence of the coating material are provided on the two surfaces in proximity of side ends of the plate with respect to a travel direction of the plate, and conveying the plate by holding the holding areas.