Abstract: A soldering device and method includes the steps of forming a solder melting pot by assembling plural trowel members, supplying a solder tip to the solder melting pot, and sequentially repeating the operation for supplying the molten solder to the respective soldering point. In the improvement, an additional heating portion which comes close to the solder melting pot is formed near or with the trowel members, and the soldering point to which molten solder has already been supplied by the prior molten solder supplying operation is additionally heated during the supplying operation of the next soldering point. The trowel members are used to simultaneously perform the operation for supplying the molten solder and another operation for additionally heating the soldering point to which the molten solder has been supplied. A plurality of points to be soldered aligned at predetermined intervals are efficiently soldered.

Abstract: The soldering method comprising the steps of forming a solder melting pot by assembling plural trowel members, supplying a solder tip to the solder melting pot, and sequentially repeating the operation for supplying the molten solder to the respective soldering point. In the improvement, an additional heating portion which comes close to the solder melting pot is formed to the trowel members, and the soldering point to which molten solder has been supplied by the prior molten solder supplying operation is additionally heated during the supplying operation. The trowel members are used to simultaneously perform the operation for supplying the molten solder and another operation for additionally heating the soldering point to which the molten solder has been supplied. A plurality of points to be soldered aligned at predetermined intervals are efficiently soldered.

Abstract: A soldering device and method includes the steps of forming a solder melting pot by assembling plural trowel members, supplying a solder tip to the solder melting pot, and sequentially repeating the operation for supplying the molten solder to the respective soldering point. In the improvement, an additional heating portion which comes close to the solder melting pot is formed near or with the trowel members, and the soldering point to which molten solder has already been supplied by the prior molten solder supplying operation is additionally heated during the supplying operation of the next soldering point. The trowel members are used to simultaneously perform the operation for supplying the molten solder and another operation for additionally heating the soldering point to which the molten solder has been supplied. A plurality of points to be soldered aligned at predetermined intervals are efficiently soldered.

Abstract: The soldering method comprising the steps of forming a solder melting pot by assembling plural trowel members, supplying a solder tip to the solder melting pot, and sequentially repeating the operation for supplying the molten solder to the respective soldering point. In the improvement, an additional heating portion which comes close to the solder melting pot is formed to the trowel members, and the soldering point to which molten solder has been supplied by the prior molten solder supplying operation is additionally heated during the supplying operation. The trowel members are used to simultaneously perform the operation for supplying the molten solder and another operation for additionally heating the soldering point to which the molten solder has been supplied. A plurality of points to be soldered aligned at predetermined intervals are efficiently soldered.

Abstract: The improvement in the soldering method comprising the steps of feeding a predetermined volume of solid solder to a solder melting pot, heating and melting the solder in the pot, and then dropping the molten solder onto a workpiece. A wire solder is held between at least one pair of endless running belts which run with opposed faces thereof in contact with each other thereby to straighten the wire solder. The tip-end of the straightened wire solder is pressed against the solder melting pot to melt the wire solder from the tip-end. On completion of feeding a predetermined volume of the wire solder, the running belts are run in reverse to retreat the tip-end of the wire solder from the solder melting pot. A soldering apparatus for realizing the aforementioned method is also provided.

Abstract: The improvement in the soldering method of soldering a workpiece comprising the steps of forming a solder melting pot by engaging plural trowel members, supplying a solder tip having a constant volume to the solder melting pot, melting the solder tip and holding the molten solder temporarily in the solder melting pot and then separating the plural trowel members to allow the molten solder to drop onto the workpiece. The improvement comprises detecting complete melting of the solder tip by sensing the change in intensity of the light reflected by the surface of the molten solder, and heating the molten solder for an additional time period after the completion of melting of the solder tip. A soldering apparatus for use to realize the aforementioned method is also provided.

Abstract: A method of applying molten solder onto a desired point of a small workpiece, such as a printed circuit board, under well-controlled condition. A solter tip is temporarily held above a solder melting pot and then allowed to fall into a solder melting pot in which the solder tip is melted and held for a pre-set time duration. In this manner, the scattering in velosity of the falling solder and the dislocation of the fallen tip are minimized to control the temperature of the molten solder precisely. A soldering apparatus used for the practice of the method of this invention is also provided. In a preferred embodiment, the soldering apparatus is provided with means for removing the debris sticking to the inner face of the solder melting pot.