Patents by Inventor Eisuke Hirano

Eisuke Hirano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board and electronic device including same
    Patent number: 9820379
    Abstract: A circuit board and an electronic device having the circuit board that includes a ceramic sintered body, a through conductor and a metal wiring layer. The ceramic sintered body includes a through hole penetrating from a first main surface to a second main surface thereof. The through conductor is in the through hole and has first and second ends. The metal wiring layer covering the first end and electrically connected to the through conductor. The through conductor includes: a first portion having a hollow cylinder shape, in contact with an inner wall of the through hole and extending from the first end to the second end; and a second portion having a columnar shape and disposed inside the first portion. The second portion has an average grain size of the metal larger than that in the first portion.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: November 14, 2017
    Assignee: Kyocera Corporation
    Inventors: Kiyotaka Nakamura, Yoshio Ohashi, Yuuichi Abe, Eisuke Hirano, Kunihide Shikata, Keiichi Sekiguchi
  • CIRCUIT BOARD AND ELECTRONIC DEVICE PROVIDED WITH SAME
    Publication number: 20140268589
    Abstract: A circuit board and an electronic device having the circuit board that includes a ceramic sintered body, a through conductor and a metal wiring layer. The ceramic sintered body includes a through hole penetrating from a first main surface to a second main surface thereof. The through conductor is in the through hole and has first and second ends. The metal wiring layer covering the first end and electrically connected to the through conductor. The through conductor includes: a first portion having a hollow cylinder shape, in contact with an inner wall of the through hole and extending from the first end to the second end; and a second portion having a columnar shape and disposed inside the first portion. The second portion has an average grain size of the metal larger than that in the first portion.
    Type: Application
    Filed: May 30, 2012
    Publication date: September 18, 2014
    Applicant: Kyocera Corporation
    Inventors: Kiyotaka Nakamura, Yshio Ohashi, Yuuichi Abe, Eisuke Hirano, Kunihide Shikata, Kiichi Sekiguchi