Abstract: A circuit package having an inner lead, an outer lead and a circuit element is provided, in which the circuit element is connected a first surface of the inner lead. The circuit package has a first molded resin portion and second molded resin portions. The first molded resin portion is formed from a second surface, opposite to the first surface, of the inner lead toward the first surface inner lead embedding the inner lead and the circuit element. And the second molded resin portions are formed on side portions of the outer lead excluding the first and second surfaces of the outer lead.

Abstract: There is provided a circuit package which makes it possible to reduce equipment investment and production cost, change a package size easily according to specifications, and produce a lead frame having an outer lead with a proper length. In the circuit package in which a circuit element is connected to the top surface of the inner lead of the lead frame, the circuit package has a first molded resin portion formed at an upper side of a bottom surface of the lead frame so as to cover the inner lead of the lead frame and a portion of the circuit element to be connected to the inner lead and a second molded resin portion formed at side portions of the outer lead except the top and bottom surfaces of the outer lead.

Abstract: For reducing the diameter of any axially limited part of a metal tube, that part is heated externally by an annular heater while at least the adjacent part or parts of the metal tube are being cooled and held at a temperature sufficiently low to limit the free thermal expanison of the heated part. On cooling, the part that has been heated becomes less in diameter than the other portions of the metal tube. The complete length of the metal tube can likewise be reduced in diameter by moving the annular heater and the metal tube relative to each other in the longitudinal direction of the tube from one end to the other while at least the adjacencies of the part being heated are being cooled as by water. The same method is adaptable for the fabrication of wear-resistant dual wall pipe for the transportation of fluids, as is also disclosed herein.