Abstract: According to one embodiment, there is provided a semiconductor device including a chip, and a gate electrode connected to a gate electrode pad provided on the chip. The gate electrode includes an external exposed portion having an external exposed surface that is flush with an external exposed surface of a sealing resin, and a gate electrode pad connection portion continuous with the external exposed portion and connected to the gate electrode pad, the gate electrode pad connection portion including a portion sandwiched between the gate electrode pad and a part of the sealing resin.

Abstract: According to one embodiment, a connection device includes an engaging claw extending in a first direction from a first member, and a receiving portion provided in a second member. The engaging claw includes a pair of first side surfaces, and a pair of engaging protrusions projecting out from the respective side surface. Each engaging protrusion includes an inclined surface continuous from the first side surface and inclined to the first direction. The receiving portion includes a pair of slopes extending in the first direction and each including a second side surface engaging the first side surface, and an engaging projection connected to the second side surface, the engaging projection engaging the engaging protrusion.

Abstract: According to one embodiment, a connection device includes an engaging claw extending in a first direction from a first member, and a receiving portion provided in a second member. The engaging claw includes a pair of first side surfaces, and a pair of engaging protrusions projecting out from the respective side surface. Each engaging protrusion includes an inclined surface continuous from the first side surface and inclined to the first direction. The receiving portion includes a pair of slopes extending in the first direction and each including a second side surface engaging the first side surface, and an engaging projection connected to the second side surface, the engaging projection engaging the engaging protrusion.

Abstract: Provided is a fastening member which is a columnar fastening member, and the fastening member includes: a first hole provided in a direction parallel to a height direction of the fastening member; a thread on a side surface of the first hole; a planar portion around the first hole; and a projection between the planar portion and the first hole.

Abstract: According to one embodiment, a connection device includes an engaging claw extending in a first direction from a first member, and a receiving portion provided in a second member. The engaging claw includes a pair of first side surfaces, and a pair of engaging protrusions projecting out from the respective side surface. Each engaging protrusion includes an inclined surface continuous from the first side surface and inclined to the first direction. The receiving portion includes a pair of slopes extending in the first direction and each including a second side surface engaging the first side surface, and an engaging projection connected to the second side surface, the engaging projection engaging the engaging protrusion.

Abstract: According to one embodiment, a connection device includes an engaging claw extending in a first direction from a first member, and a receiving portion provided in a second member. The engaging claw includes a pair of first side surfaces, and a pair of engaging protrusions projecting out from the respective side surface. Each engaging protrusion includes an inclined surface continuous from the first side surface and inclined to the first direction. The receiving portion includes a pair of slopes extending in the first direction and each including a second side surface engaging the first side surface, and an engaging projection connected to the second side surface, the engaging projection engaging the engaging protrusion.

Abstract: Provided is a terminal plate according to an embodiment including: a first plate portion for being connected to a first semiconductor element; a second plate portion for being connected to a second semiconductor element; a third plate portion provided above the first plate portion and the second plate portion; a first connecting portion provided between the first plate portion and the third plate portion and connecting the first plate portion and the third plate portion; a second connecting portion provided between the second plate portion and the third plate portion and connecting the second plate portion and the third plate portion; a fourth plate portion provided above the first plate portion and the second plate portion and provided on the opposite side of the third plate portion with interposing the first and second plate portions; a third connecting portion provided between the first plate portion and the fourth plate portion and connecting the first plate portion and the fourth plate portion; a fourth

Abstract: A semiconductor device including a main board; a first board provided on the main board; first and second semiconductor elements provided on the first board; a first positive terminal provided on the first board; a first negative terminal provided on the first board; a first output terminal provided on the first board; a second board provided on the main board; third and fourth semiconductor elements provided on the second board; a second positive terminal provided on the second board; a second negative terminal provided on the second board; a second output terminal provided on the second board; a first terminal plate connecting the first positive terminal and the second positive terminal, a second terminal plate connecting the first negative terminal and the second negative terminal, and a third terminal plate connecting the first output terminal and the second output terminal.

Abstract: Provided is a semiconductor device according to an embodiment including: a main board; a first board provided on the main board; a second board provided on the main board; a first electrode member provided on the first board and having a first planar portion; a second electrode member provided on the first board and having a second planar portion; a third electrode member provided on the first board and having a third planar portion; a first semiconductor element provided on the first electrode member and having a first electrode and a second electrode; a second semiconductor element provided on the second electrode member and having a third electrode and a fourth electrode; a first wire electrically connecting the second electrode and the second electrode member; a second wire electrically connecting the fourth electrode and the third electrode member; a fourth electrode member provided on the second board and having a fourth planar portion; a fifth electrode member provided on the second board and having a

Abstract: Provided is a fastening member which is a columnar fastening member, and the fastening member includes: a first hole provided in a direction parallel to a height direction of the fastening member; a thread on a side surface of the first hole; a planar portion around the first hole; and a projection between the planar portion and the first hole.

Abstract: Provided is a terminal plate according to an embodiment including: a first plate portion for being connected to a first semiconductor element; a second plate portion for being connected to a second semiconductor element; a third plate portion provided above the first plate portion and the second plate portion; a first connecting portion provided between the first plate portion and the third plate portion and connecting the first plate portion and the third plate portion; a second connecting portion provided between the second plate portion and the third plate portion and connecting the second plate portion and the third plate portion; a fourth plate portion provided above the first plate portion and the second plate portion and provided on the opposite side of the third plate portion with interposing the first and second plate portions; a third connecting portion provided between the first plate portion and the fourth plate portion and connecting the first plate portion and the fourth plate portion; a fourth

Abstract: A semiconductor module includes a substrate, first and second wirings on the substrate, a semiconductor package disposed on the first wiring and having a pair of main electrodes on top and bottom surfaces of the semiconductor package, and a third wiring extending between the top surface of the semiconductor package and the second wiring.

Abstract: A semiconductor module includes a substrate, first and second wirings on the substrate, a semiconductor package disposed on the first wiring and having a pair of main electrodes on top and bottom surfaces of the semiconductor package, and a third wiring extending between the top surface of the semiconductor package and the second wiring.

Abstract: A semiconductor device includes a semiconductor chip comprising a first and second terminal surfaces. An insulator surrounds an outer circumference of a side surface of the chip. A reinforcing-member is arranged between the side surface of the chip and an inner side surface of the insulator and surrounds the outer circumference of the side surface of the chip. A first and second holders hold the reinforcing-member therebetween at a top and bottom surfaces of the reinforcing-member. The first and second holders comprise protrusions facing an inner wall surface of the reinforcing-member, and the when ?1in represents an inner-diameter of parts of the reinforcing-member opposing to the protrusions, ?1out represents an outer-diameter of the reinforcing-member, ?2 represents an outer-diameter of the protrusion of either the first or the second holder, and ?3 represents an inner diameter of the insulator, the following Expression 1 is satisfied ?1in??2<?1out.

Abstract: A semiconductor device, such as a pressure contact type semiconductor device, includes a frame body comprising ceramic and having an annular cylindrical shape which satisfies a relationship: (2/5E)·(D/t)3?17.4, when the inner diameter of the frame body is D (in mm), the thickness of the frame body in a radial direction is t (in mm), and the Young's modulus of the ceramic is E (in GPa). A plurality of semiconductor elements are enclosed within an interior spaced formed by at least the frame body, a first electrode block disposed on one side of the semiconductor elements, and a second electrode block disposed on another side of the semiconductor elements.

Abstract: A semiconductor device includes a semiconductor chip comprising a first and second terminal surfaces. An insulator surrounds an outer circumference of a side surface of the chip. A reinforcing-member is arranged between the side surface of the chip and an inner side surface of the insulator and surrounds the outer circumference of the side surface of the chip. A first and second holders hold the reinforcing-member therebetween at a top and bottom surfaces of the reinforcing-member. The first and second holders comprise protrusions facing an inner wall surface of the reinforcing-member, and the when ?1in represents an inner-diameter of parts of the reinforcing-member opposing to the protrusions, ?1out represents an outer-diameter of the reinforcing-member, ?2 represents an outer-diameter of the protrusion of either the first or the second holder, and ?3 represents an inner diameter of the insulator, the following Expression 1 is satisfied ?1in??2<?3-?1out.

Abstract: A semiconductor device component includes a first portion having a first hole usable as a nut insertion hole, and a second portion having a second hole adjacent to the first hole with a wall interposed therebetween. The first hole includes a first surface facing the wall, a second surface adjacent to the first surface, a third surface adjacent to the second surface, a fourth surface adjacent to the third surface and facing the first surface, a fifth surface adjacent to the fourth surface and facing the second surface, and a sixth surface adjacent to the fifth surface and the first surface and facing the third surface. A distance between the first and fourth surfaces is greater than a distance between the second and fifth surfaces, and greater than a distance between the third and sixth surfaces.

Abstract: According to one embodiment, a semiconductor device includes a semiconductor chip including a first terminal surface and a second terminal surface located on a side opposite to the first terminal surface. An insulation unit surrounds an outer circumference of a side surface of the semiconductor chip. A metal unit is disposed between the side surface of the semiconductor chip and an inner side surface of the insulation unit.

Abstract: An aspect of the present embodiment, there is provided a semiconductor device, including an insulating substrate, at least one semiconductor chip provided above the insulating substrate, a wiring terminal including a connection portion electrically connected to the semiconductor chip, a surrounding frame surrounding the semiconductor chip and the connection portion, an embedded material provided in the surrounding frame covering the semiconductor chip and the connection portion, and a pressing unit provided on a surface of the embedded material.

Abstract: A semiconductor device component includes a first portion having a first hole usable as a nut insertion hole, and a second portion having a second hole adjacent to the first hole with a wall interposed therebetween. The first hole includes a first surface facing the wall, a second surface adjacent to the first surface, a third surface adjacent to the second surface, a fourth surface adjacent to the third surface and facing the first surface, a fifth surface adjacent to the fourth surface and facing the second surface, and a sixth surface adjacent to the fifth surface and the first surface and facing the third surface. A distance between the first and fourth surfaces is greater than a distance between the second and fifth surfaces, and greater than a distance between the third and sixth surfaces.