Abstract: Provided is a semiconductor manufacturing device including an expanding unit that expands a holding member having an adhesive layer on which a substrate in a state of being diced into plural semiconductor chips is held, a detection unit that detects an adhesive state between one of the semiconductor chips and the holding member, in a state in which the holding member is expanded, and a pickup unit that picks up the semiconductor chip by changing an operation relevant to pickup of the semiconductor chip based on the detected adhesive state.

Abstract: Provided is a semiconductor manufacturing device including an expanding unit that expands a holding member having an adhesive layer on which a substrate in a state of being diced into plural semiconductor chips is held, a detection unit that detects an adhesive state between one of the semiconductor chips and the holding member, in a state in which the holding member is expanded, and a pickup unit that picks up the semiconductor chip by changing an operation relevant to pickup of the semiconductor chip based on the detected adhesive state.

Abstract: An LED array head has LED arrays, a substrate, first electrode pads, second electrode pads, and light-blocking elements. Plural LEDs are positioned at the LED arrays. The LED arrays are staggered on the substrate. The first electrode pads are provided at end portions of the LED arrays and positioned facing LEDs of adjacent LED arrays. The second electrode pads are provided on the substrate at a side opposite the adjacent LED arrays and connected to the first electrode pad electrically by the wires. The light-blocking elements block light, which is emitted from the LEDs of the adjacent LED arrays, from reaching the wires.