Abstract: A semiconductor device includes a first contact positioned on an externally accessible surface of the semiconductor device and electrically coupled with a first structure in the semiconductor device, a second contact positioned on an externally accessible surface and electrically coupled with a second structure in the semiconductor device, and an isolation structure disposed between the first contact and the second contact, the isolation structure self-aligning with a first surface of the first contact such that the first surface of the first contact is orthogonal to the externally accessible surface up to a depth and faces the second contact.