Patents by Inventor Eko SUSILO

Eko SUSILO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package
    Patent number: 12199019
    Abstract: A semiconductor package is disclosed. In one example, the semiconductor package comprises a semiconductor chip, a molded body encapsulating the semiconductor chip and comprising a top face and an opposing bottom face and four side faces connecting the top and bottom faces, and a plurality of electrical contacts arranged on two of the side faces of the molded body, wherein the other two side faces are metal-free side faces, and wherein the molded body comprises a cut surface at no more than one of the side faces.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: January 14, 2025
    Assignee: Infineon Technologies AG
    Inventors: Mohamad Yazid Bin Wagiman, Romel Solanoy Lazala, Eko Susilo, Prasanna Kumar Vishwanathan
  • SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE
    Publication number: 20210305135
    Abstract: A semiconductor package is disclosed. In one example, the semiconductor package comprises a semiconductor chip, a molded body encapsulating the semiconductor chip and comprising a top face and an opposing bottom face and four side faces connecting the top and bottom faces, and a plurality of electrical contacts arranged on two of the side faces of the molded body, wherein the other two side faces are metal-free side faces, and wherein the molded body comprises a cut surface at no more than one of the side faces.
    Type: Application
    Filed: March 23, 2021
    Publication date: September 30, 2021
    Applicant: Infineon Technologies AG
    Inventors: Mohamad Yazid Bin WAGIMAN, Romel Solanoy LAZALA, Eko SUSILO, Prasanna Kumar VISHWANATHAN