Abstract: Customizable tunable filters are provided herein. In certain implementations, a tunable filter including: a first filter bank including a plurality of high-pass filters each having a different cutoff frequency, and a second filter bank including a plurality of low-pass filters each having a different cutoff frequency. The tunable filter further includes a first pair of switches configured to select a first filter chosen from the first filter bank, and a second pair of switches configured to select a second filter chosen from the second filter bank. The tunable filter operates with a first cutoff frequency of the first filter and with a second cutoff frequency of the second filter.

Abstract: Apparatus and methods for control and calibration of tunable filters are provided. In certain embodiments, a tunable filter includes at least one controllable component (for instance, a controllable inductor or a controllable capacitor) having a value that changes or adjusts a center frequency of the tunable filter. For example, the controllable component can correspond to a controllable inductor or a controllable capacitor of an inductor-capacitor (LC) resonator of the tunable filter. The tunable filter further includes a control circuit implemented with an approximation function for estimating a value of the controllable component for achieving a desired center frequency indicated by a frequency control signal.

Abstract: Apparatus and methods for tunable filtering are provided. In certain embodiments, a tunable filter is implemented using one or more controllable capacitors formed on a semiconductor die and using one or more shielded integrated inductors formed on a secondary circuit board that attaches to a carrier circuit board. Additionally, the shielded integrated inductors are formed from patterned metallization layers of the secondary circuit board, and shielding is provided on the secondary circuit board and/or the carrier circuit board to shield the inductors from the semiconductor die and/or other components.

Abstract: Customizable tunable filters are provided herein. In certain implementations, a tunable filter including: a first filter bank including a plurality of high-pass filters each having a different cutoff frequency, and a second filter bank including a plurality of low-pass filters each having a different cutoff frequency. The tunable filter further includes a first pair of switches configured to select a first filter chosen from the first filter bank, and a second pair of switches configured to select a second filter chosen from the second filter bank. The tunable filter operates with a first cutoff frequency of the first filter and with a second cutoff frequency of the second filter.

Abstract: A die is packaged by flip-chip mounting the die with the active side facing a low loss substrate. A ground plane is coupled to the active side of the die by vias through the low loss substrate. The ground plane is positioned to concentrate high frequency electromagnetic fields in the low loss substrate. A tuning height can be adjusted to tune the center frequency of a circuit in the die.

Abstract: An edge launch and fabrication method wherein spaced elongated slots are formed through a circuit board. The slots are plated at least along one side thereof connecting ground planes of the circuit board thus forming spaced edge plated regions. Circuit modules are produced by singulating the circuit board along a cut line offset outwardly from the plated slot sides to form an edge launch outwardly extending from and between the spaced edge plated regions.

Abstract: A tunable bandpass filter integrated circuit includes a filter core including at least two spaced conductor layers, a plurality of peripherally spaced backside vias extending between the conductor layers defining a resonator cavity, at least one internal backside via, and a tunable impedance connected in series with the internal backside via between the conductor layers for adjusting the resonance of the cavity.

Abstract: A cavity resonator integrated on a monolithic microwave integrated circuit (MMIC) is provided. The cavity resonator includes a cavity defined by an upper metal surface and a lower metal surface embedded in a low conductivity semiconductor, and a plurality of discrete metal connections coupled between the upper and lower metal surfaces, and at least one port for coupling to the cavity electromagnetically.

Abstract: A voltage controlled oscillator including an RF output terminal and a DC control terminal, an active circuit, and a resonant circuit interconnected with the active circuit and including a plurality of series resonators each having an electrically variable capacitance and fixed inductor; the active circuit includes at least one transistor having an operating current density which is approximately 35% or less of the peak fT operating current density and/or the active circuit includes a multi-transistor bank disposed in at least two separate sections, each pair of sections spaced apart to provide improved thermal uniformity among the transistors without substantially increasing parasitic impedance among them for providing an improved lower phase noise output at said RF output terminal.

Abstract: A microstrip combline bandpass filter includes an input port, an output port, and a plurality of resonators each including a microstrip line having a first end and a second end. One of the plurality of resonators is connected to the input port, and another of the plurality of resonators is connected to the output port. The filter also includes a plurality of pairs of series coupled varactors. The first end of each microstrip line is coupled to one of the pairs of varactors, and the second end of each microstrip line is coupled to ground.

Abstract: A microstrip combline bandpass filter includes an input port, an output port, and a plurality of resonators each including a microstrip line having a first end and a second end. One of the plurality of resonators is connected to the input port, and another of the plurality of resonators is connected to the output port. The filter also includes a plurality of pairs of series coupled varactors. The first end of each microstrip line is coupled to one of the pairs of varactors, and the second end of each microstrip line is coupled to ground.

Abstract: A microstrip combline bandpass filter includes an input port, an output port, and a plurality of resonators each including a microstrip line having a first end and a second end. One of the plurality of resonators is connected to the input port, and another of the plurality of resonators is connected to the output port. The filter also includes a plurality of pairs of series coupled varactors. The first end of each microstrip line is coupled to one of the pairs of varactors, and the second end of each microstrip line is coupled to ground.

Abstract: A novel package includes a substrate including an upper surface ground plane connected to a lower surface ground plane by vias through the substrate, a die located on the upper ground plane and including a die pad, a transmission path including, on the upper surface of the substrate, a bonding pad connected to a first transmission line itself connected to a transition pad, and on the lower surface of the substrate, a second transmission line connected to the transition pad by a via through the substrate. A wire bond extends from the bonding pad to the die pad. A portion of the upper surface ground plane and the lower surface ground plane are connected by vias defining opposing walls on either side of the transmission path for signal isolation.

Abstract: A novel package includes a substrate including an upper surface ground plane connected to a lower surface ground plane by vias through the substrate, a die located on the upper ground plane and including a die pad, a transmission path including, on the upper surface of the substrate, a bonding pad connected to a first transmission line itself connected to a transition pad, and on the lower surface of the substrate, a second transmission line connected to the transition pad by a via through the substrate. A wire bond extends from the bonding pad to the die pad. A portion of the upper surface ground plane and the lower surface ground plane are connected by vias defining opposing walls on either side of the transmission path for signal isolation.