Abstract: In a coating system, two rollers are arranged adjacent to one another. A donor foil with rheological material dispensed thereon is advanced through a gap between the two rollers. Such gap spreads the dispensed material over the donor foil, coating the donor foil with a layer of the material with a uniform thickness associated with the gap width. Each roller is supported on a holder. Adjustment of the gap width may be effected by keeping the position of one of the holders fixed, while horizontally translating the position of the other holder. The position of the translatable holder may be adjusted by pistons and linear actuators. The pistons may bias the moveable holder towards the stationary holder. The linear actuators mounted on the moveable holder may extend respective arms against the stationary holder, thereby countering the biasing of the pistons and pushing the moveable holder away from the stationary holder.

Abstract: Systems and methods for laser assisted deposition of a material includes a printing unit configured to print individual dot-like portions of a material from a donor substrate onto a receiving substrate, and a vacuum shuttle configured to be positionable in two or three dimensions between the printing unit and the donor substrate and to engage the donor substrate upon application of a vacuum to the vacuum shuttle. The printing unit may include a coating system and a laser. The vacuum shuttle includes a vacuum channel about its periphery and an open window through which the laser irradiates the donor substrate. The vacuum channel is fluidly coupled to a vacuum inlet for receiving a vacuum suction, thereby to engage the donor substrate and hold it taught against the bottom of the vacuum shuttle in operation. The vacuum shuttle may also include one or more distance measuring sensors and fiducial markers.

Abstract: An optical system and method are presented for use in measurements on an upper surface of a layered sample when located in a measurement plane. The optical system is configured as a normal-incidence system having an illumination channel and a collection channel, and comprises an objective lens unit and a light propagation affecting device. The objective lens unit is accommodated in the illumination and collection channels, thereby defining a common optical path for propagation of illuminating light from the illumination channel toward an illuminating region in the measurement plane and for propagation of light returned from measurement plane to the collection channel. The light propagation affecting device comprises an apertured structure located in at least one of the illumination and collection channels, and configured to provide angular obscuration of light propagation path for blocking angular segments associated with light propagation from regions outside the illuminated region.

Abstract: A measurement system is presented configured for integration with a processing equipment for applying optical measurements to a structure.

Abstract: An optical system and method are presented for use in measurements on an upper surface of a layered sample when located in a measurement plane. The optical system is configured as a normal-incidence system having an illumination channel and a collection channel, and comprises an objective lens unit and a light propagation affecting device. The objective lens unit is accommodated in the illumination and collection channels, thereby defining a common optical path for propagation of illuminating light from the illumination channel toward an illuminating region in the measurement plane and for propagation of light returned from measurement plane to the collection channel. The light propagation affecting device comprises an apertured structure located in at least one of the illumination and collection channels, and configured to provide angular obscuration of light propagation path for blocking angular segments associated with light propagation from regions outside the illuminated region.

Abstract: An inspection system and method are presented for inspecting structures having a pattern formed by an array of elongated grooves having high aspect-ratio geometry, such as semiconductor wafers formed with vias. The inspection system comprises an imaging system and a control unit. The imaging system is configured and operable for imaging the structure with a dark-field imaging scheme and generating a dark-field image. The control unit comprises an analyzer module for analyzing pixels brightness in the dark-field image for identifying a defective groove, being a groove characterized by pixels brightness in the dark-field image lower than nominal brightness by a predetermined factor.

Abstract: An inspection system and method are presented for inspecting structures having a pattern formed by an array of elongated grooves having high aspect-ratio geometry, such as semiconductor wafers formed with vias. The inspection system comprises an imaging system and a control unit. The imaging system is configured and operable for imaging the structure with a dark-field imaging scheme and generating a dark-field image. The control unit comprises an analyzer module for analyzing pixels brightness in the dark-field image for identifying a defective groove, being a groove characterized by pixels brightness in the dark-field image lower than nominal brightness by a predetermined factor.

Abstract: A method and system are presented for use in inspection of via containing structures. According to this technique, measured data indicative of a spectral response of a via-containing region of a structure under measurements is processed, and, upon identifying a change in at least one parameter of the spectral response with respect to a spectral signature of the via-containing region, output data is generated indicative of a possible defect at an inner surface of the via.

Abstract: A method and system are presented for use in inspection of via containing structures. According to this technique, measured data indicative of a spectral response of a via-containing region of a structure under measurements is processed, and, upon identifying a change in at least one parameter of the spectral response with respect to a spectral signature of the via-containing region, output data is generated indicative of a possible defect at an inner surface of the via.