Patents by Inventor Elah Bozorg-Grayeli
Elah Bozorg-Grayeli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240136244Abstract: Thermal heat spreaders and/or an IC die with solderable thermal structures may be assembled together with a solder array thermal interconnects. A thermal heat spreader may include a non-metallic material and one or more metallized surfaces suitable for bonding to a solder alloy employed as thermal interface material between the heat spreader and an IC die. An IC die may include a metallized back-side surface similarly suitable for bonding to a thermal interconnect comprising a solder alloy. Metallization on the IC die and/or heat spreader may comprise a plurality of solderable structures. A multi-chip package may include multiple IC die having different die thickness that are accommodated by a z-height thickness variation in the thermal interconnects and/or the solderable structures of the IC die or heat spreader.Type: ApplicationFiled: December 22, 2023Publication date: April 25, 2024Applicant: Intel CorporationInventors: Debendra Mallik, Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad
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Patent number: 11935799Abstract: Disclosed herein are integrated circuit (IC) package lids with polymer features, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A foot or rib of the lid may include a polymer material.Type: GrantFiled: June 25, 2019Date of Patent: March 19, 2024Assignee: Intel CorporationInventors: Elah Bozorg-Grayeli, Taylor William Gaines, Frederick W. Atadana, Sergio Antonio Chan Arguedas, Robert F. Cheney
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Patent number: 11935808Abstract: Thermal heat spreaders and/or an IC die with solderable thermal structures may be assembled together with a solder array thermal interconnects. A thermal heat spreader may include a non-metallic material and one or more metallized surfaces suitable for bonding to a solder alloy employed as thermal interface material between the heat spreader and an IC die. An IC die may include a metallized back-side surface similarly suitable for bonding to a thermal interconnect comprising a solder alloy. Metallization on the IC die and/or heat spreader may comprise a plurality of solderable structures. A multi-chip package may include multiple IC die having different die thickness that are accommodated by a z-height thickness variation in the thermal interconnects and/or the solderable structures of the IC die or heat spreader.Type: GrantFiled: March 26, 2020Date of Patent: March 19, 2024Assignee: Intel CorporationInventors: Debendra Mallik, Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad
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Patent number: 11923267Abstract: Thermal heat spreaders and/or an IC die with solderable thermal structures may be assembled together with a solder array thermal interconnects. A thermal heat spreader may include a non-metallic material and one or more metallized surfaces suitable for bonding to a solder alloy employed as thermal interface material between the heat spreader and an IC die. An IC die may include a metallized back-side surface similarly suitable for bonding to a thermal interconnect comprising a solder alloy. Metallization on the IC die and/or heat spreader may comprise a plurality of solderable structures. A multi-chip package may include multiple IC die having different die thickness that are accommodated by a z-height thickness variation in the thermal interconnects and/or the solderable structures of the IC die or heat spreader.Type: GrantFiled: March 26, 2020Date of Patent: March 5, 2024Assignee: Intel CorporationInventors: Debendra Mallik, Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad
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Patent number: 11881440Abstract: Microelectronic devices, assemblies, and systems include a microelectronic die and composite material to conduct heat from the microelectronic die such that the composite material includes polymer chains chemically bonded to fill particles having a hexagonal lattice of carbon atoms such as graphene sheet fill particles and/or carbon nanotube fill particles.Type: GrantFiled: February 21, 2020Date of Patent: January 23, 2024Assignee: Intel CorporationInventors: Marely E. Tejeda Ferrari, Taylor Gaines, Elah Bozorg-Grayeli, James C. Matayabas, Jr.
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First-level integration of second-level thermal interface material for integrated circuit assemblies
Patent number: 11881438Abstract: A second-level thermal interface material (TIM2) that is to couple to a system-level thermal solution is applied to an integrated circuit (IC) assembly comprising an IC die and an assembly substrate prior to the assembly substrate being joined to a host component at the system-level. Challenges associated with TIM2 application may therefore be addressed at a first level of IC die integration, simplifying subsequent assembly and better controlling thermal coupling to a subsequently applied thermal solution. Where a first-level IC assembly includes a stiffener, the TIM may be affixed to the stiffener through an adhesive bond or a fusion bond. After the IC assembly including the TIM is soldered to the host board, a thermal solution may be placed in contact with the TIM. With early application of a solder TIM, a solder TIM may be reflowed upon the IC die multiple times.Type: GrantFiled: January 17, 2020Date of Patent: January 23, 2024Assignee: Intel CorporationInventors: Elah Bozorg-Grayeli, Kyle Arrington, Sergio Chan Arguedas, Aravindha Antoniswamy -
Patent number: 11869824Abstract: A thermal interface structure may be formed comprising a thermally conductive substrate having a first surface and an opposing second surface, a first liquid metal layer on the first surface of the thermally conductive substrate, and a second liquid metal layer on the second surface of the thermally conductive substrate. The thermal interface structure may be used in an integrated circuit assembly or package between at least one integrated circuit device and a heat dissipation device.Type: GrantFiled: November 4, 2019Date of Patent: January 9, 2024Assignee: Intel CorporationInventors: Kyle J. Arrington, Aaron McCann, Kelly Lofgreen, Elah Bozorg-Grayeli, Aravindha Antoniswamy, Joseph B. Petrini
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Patent number: 11710677Abstract: Embodiments may relate to a microelectronic package that includes an integrated heat spreader (IHS) coupled with a package substrate. The microelectronic package may further include a sealant material between the package substrate and the IHS. The sealant material may be formed of a material that cures when exposed to ultraviolet (UV) wavelengths. Other embodiments may be described or claimed.Type: GrantFiled: July 8, 2019Date of Patent: July 25, 2023Assignee: Intel CorporationInventors: Taylor William Gaines, Ken Hackenberg, Elah Bozorg-Grayeli
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Patent number: 11710672Abstract: Embodiments may relate to a method of forming a microelectronic package with an integrated heat spreader (IHS). The method may include placing a solder thermal interface material (STIM) layer on a face of a die that is coupled with a package substrate; coupling the IHS with the STIM layer and the package substrate such that the STIM is between the IHS and the die; performing formic acid fluxing of the IHS, STIM layer, and die; and dispensing, subsequent to the formic acid fluxing, sealant on the package substrate around a periphery of the IHS.Type: GrantFiled: July 8, 2019Date of Patent: July 25, 2023Assignee: Intel CorporationInventors: Taylor William Gaines, Ken Hackenberg, Frederick W. Atadana, Elah Bozorg-Grayeli
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Publication number: 20220199489Abstract: Embodiments disclosed herein include polymer thermal interface materials. In an embodiment a thermal interface material (TIM) comprises a polymer matrix and a liquid metal filler in the polymer matrix. In an embodiment, the liquid metal filler comprises a liquid core and an oxide layer around the liquid core. In an embodiment, the liquid core comprises gallium or a gallium alloy, and the oxide layer comprises a metal oxide other than gallium oxide.Type: ApplicationFiled: December 15, 2021Publication date: June 23, 2022Inventors: Kyle ARRINGTON, Kosuke HIROTA, Elah BOZORG-GRAYELI
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Publication number: 20210305121Abstract: Thermal heat spreaders and/or an IC die with solderable thermal structures may be assembled together with a solder array thermal interconnects. A thermal heat spreader may include a non-metallic material and one or more metallized surfaces suitable for bonding to a solder alloy employed as thermal interface material between the heat spreader and an IC die. An IC die may include a metallized back-side surface similarly suitable for bonding to a thermal interconnect comprising a solder alloy. Metallization on the IC die and/or heat spreader may comprise a plurality of solderable structures. A multi-chip package may include multiple IC die having different die thickness that are accommodated by a z-height thickness variation in the thermal interconnects and/or the solderable structures of the IC die or heat spreader.Type: ApplicationFiled: March 26, 2020Publication date: September 30, 2021Applicant: Intel CorporationInventors: Debendra Mallik, Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad
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Publication number: 20210305120Abstract: Thermal heat spreaders and/or an IC die with solderable thermal structures may be assembled together with a solder array thermal interconnects. A thermal heat spreader may include a non-metallic material and one or more metallized surfaces suitable for bonding to a solder alloy employed as thermal interface material between the heat spreader and an IC die. An IC die may include a metallized back-side surface similarly suitable for bonding to a thermal interconnect comprising a solder alloy. Metallization on the IC die and/or heat spreader may comprise a plurality of solderable structures. A multi-chip package may include multiple IC die having different die thickness that are accommodated by a z-height thickness variation in the thermal interconnects and/or the solderable structures of the IC die or heat spreader.Type: ApplicationFiled: March 26, 2020Publication date: September 30, 2021Applicant: Intel CorporationInventors: Debendra Mallik, Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad
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Publication number: 20210305119Abstract: Thermal heat spreaders and/or an IC die with solderable thermal structures may be assembled together with a solder array thermal interconnects. A thermal heat spreader may include a non-metallic material and one or more metallized surfaces suitable for bonding to a solder alloy employed as thermal interface material between the heat spreader and an IC die. An IC die may include a metallized back-side surface similarly suitable for bonding to a thermal interconnect comprising a solder alloy. Metallization on the IC die and/or heat spreader may comprise a plurality of solderable structures. A multi-chip package may include multiple IC die having different die thickness that are accommodated by a z-height thickness variation in the thermal interconnects and/or the solderable structures of the IC die or heat spreader.Type: ApplicationFiled: March 26, 2020Publication date: September 30, 2021Applicant: Intel CorporationInventors: Debendra Mallik, Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad
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Publication number: 20210265238Abstract: Microelectronic devices, assemblies, and systems include a microelectronic die and composite material to conduct heat from the microelectronic die such that the composite material includes polymer chains chemically bonded to fill particles having a hexagonal lattice of carbon atoms such as graphene sheet fill particles and/or carbon nanotube fill particles.Type: ApplicationFiled: February 21, 2020Publication date: August 26, 2021Applicant: INTEL CORPORATIONInventors: Marely E. Tejeda Ferrari, Taylor Gaines, Elah Bozorg-Grayeli, James C. Matayabas, JR.
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FIRST-LEVEL INTEGRATION OF SECOND-LEVEL THERMAL INTERFACE MATERIAL FOR INTEGRATED CIRCUIT ASSEMBLIES
Publication number: 20210225729Abstract: A second-level thermal interface material (TIM2) that is to couple to a system-level thermal solution is applied to an integrated circuit (IC) assembly comprising an IC die and an assembly substrate prior to the assembly substrate being joined to a host component at the system-level. Challenges associated with TIM2 application may therefore be addressed at a first level of IC die integration, simplifying subsequent assembly and better controlling thermal coupling to a subsequently applied thermal solution. Where a first-level IC assembly includes a stiffener, the TIM may be affixed to the stiffener through an adhesive bond or a fusion bond. After the IC assembly including the TIM is soldered to the host board, a thermal solution may be placed in contact with the TIM. With early application of a solder TIM, a solder TIM may be reflowed upon the IC die multiple times.Type: ApplicationFiled: January 17, 2020Publication date: July 22, 2021Applicant: Intel CorporationInventors: Elah Bozorg-Grayeli, Kyle Arrington, Sergio Chan Arguedas, Aravindha Antoniswamy -
Patent number: 11004768Abstract: A multi-chip package includes multiple IC die interconnected to a package substrate. An integrated heat spreader (IHS) is located over one or more primary IC die, but is absent from over one or more secondary IC die. Thermal cross-talk between IC dies and/or thermal performance of individual IC dies may be improved by constraining the dimensions of the IHS to be over less than all IC die of the package. A first thermal interface material (TIM) may be between the IHS and the primary IC die, but absent from over the secondary IC die. A second TIM may be between a heat sink and the IHS and also between the heat sink and the secondary IC die. The heat sink may be segmented, or have a non-planarity to accommodate differences in z-height across the IC die and/or as a result of constraining the dimensions of the IHS to be over less than all IC die.Type: GrantFiled: August 1, 2019Date of Patent: May 11, 2021Assignee: Intel CorporationInventors: Muhammad S. Islam, Enisa Harris, Suzana Prstic, Sergio Chan Arguedas, Sachin Deshmukh, Aravindha Antoniswamy, Elah Bozorg-Grayeli
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Publication number: 20210134698Abstract: A thermal interface structure may be formed comprising a thermally conductive substrate having a first surface and an opposing second surface, a first liquid metal layer on the first surface of the thermally conductive substrate, and a second liquid metal layer on the second surface of the thermally conductive substrate. The thermal interface structure may be used in an integrated circuit assembly or package between at least one integrated circuit device and a heat dissipation device.Type: ApplicationFiled: November 4, 2019Publication date: May 6, 2021Applicant: Intel CorporationInventors: Kyle J. Arrington, Aaron McCann, Kelly Lofgreen, Elah Bozorg-Grayeli, Aravindha Antoniswamy, Joseph B. Petrini
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Publication number: 20210035886Abstract: A multi-chip package includes multiple IC die interconnected to a package substrate. An integrated heat spreader (IHS) is located over one or more primary IC die, but is absent from over one or more secondary IC die. Thermal cross-talk between IC dies and/or thermal performance of individual IC dies may be improved by constraining the dimensions of the IHS to be over less than all IC die of the package. A first thermal interface material (TIM) may be between the IHS and the primary IC die, but absent from over the secondary IC die. A second TIM may be between a heat sink and the IHS and also between the heat sink and the secondary IC die. The heat sink may be segmented, or have a non-planarity to accommodate differences in z-height across the IC die and/or as a result of constraining the dimensions of the IHS to be over less than all IC die.Type: ApplicationFiled: August 1, 2019Publication date: February 4, 2021Applicant: Intel CorporationInventors: Muhammad S. Islam, Enisa Harris, Suzana Prstic, Sergio Chan Arguedas, Sachin Deshmukh, Aravindha Antoniswamy, Elah Bozorg-Grayeli
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Publication number: 20210013123Abstract: Embodiments may relate to a microelectronic package that includes an integrated heat spreader (IHS) coupled with a package substrate. The microelectronic package may further include a sealant material between the package substrate and the IHS. The sealant material may be formed of a material that cures when exposed to ultraviolet (UV) wavelengths. Other embodiments may be described or claimed.Type: ApplicationFiled: July 8, 2019Publication date: January 14, 2021Applicant: Intel CorporationInventors: Taylor William Gaines, Ken Hackenberg, Elah Bozorg-Grayeli
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Publication number: 20210013115Abstract: Embodiments may relate to a microelectronic package comprising an integrated heat spreader (IHS) coupled with a package substrate. A sealant may be positioned between, and physically coupled to, the IHS and the package substrate. The sealant may at least partially extend from a footprint of the IHS. Other embodiments may be described or claimed.Type: ApplicationFiled: July 8, 2019Publication date: January 14, 2021Applicant: Intel CorporationInventors: Taylor William Gaines, Ken Hackenberg, Frederick W. Atadana, Elah Bozorg-Grayeli