Abstract: A magnetic sensor packaging structure with a hysteresis coil comprising a substrate, a sensor chip, a spiral hysteresis coil on the substrate, and wire bonding pads. The sensor bridge arms are composed of magnetoresistive sensing elements. The sensor bridge arms are deposited on the sensor chip, and the sensor bridge arms are electrically interconnected to form a magnetoresistive sensor bridge that is located on the hysteresis coil. The magnetic field generated by the spiral hysteresis coil is collinear with a sensitive axis of the sensor bridge. The magnetoresistive sensor bridge is located on the substrate and encapsulated. By placing the spiral hysteresis coil on the substrate, it is capable of supporting larger currents with smaller resistance value. This allows the sensor hysteresis to be effectively eliminated. In addition, the packaging structure manufacturing process is simple and cost effective.

Abstract: A magnetic sensor packaging structure with a hysteresis coil comprising a substrate, a sensor chip, a spiral hysteresis coil on the substrate, and wire bonding pads. The sensor bridge arms are composed of magnetoresistive sensing elements. The sensor bridge arms are deposited on the sensor chip, and the sensor bridge arms are electrically interconnected to form a magnetoresistive sensor bridge that is located on the hysteresis coil. The magnetic field generated by the spiral hysteresis coil is collinear with a sensitive axis of the sensor bridge. The magnetoresistive sensor bridge is located on the substrate and encapsulated. By placing the spiral hysteresis coil on the substrate, it is capable of supporting larger currents with smaller resistance value. This allows the sensor hysteresis to be effectively eliminated. In addition, the packaging structure manufacturing process is simple and cost effective.

Abstract: Disclosed is a digital liquid level sensor based on a magnetoresistive sensor cross-point array, including: a plurality of TMR magnetic sensor chips; a microcontroller, a row decoder, and a column decoder, wherein the microcontroller is electrically connected to the row decoder and the column decoder, the TMR magnetic sensor chips include a plurality of MTJ elements, diodes are connected between each row of MTJ elements and a row lead or a column lead, the TMR magnetic sensor chips are addressed by means of data decoded by the row decoder and the column decoder and on the basis of the equation Address=m+[M×(n?1)], Address representing an address value, and m representing the value of a current row, and the microcontroller is used for scanning addresses of the TMR magnetic sensor chips for the address of an MTJ element in the highest active state, converting the address value into a liquid level value in a linear proportional relationship therewith, and transmitting the liquid level value to an output interfac