Abstract: Plies of continuous fiber material are oriented and cut to the intended shape of a structural component, such as the vertical tail of an aircraft. Two skins or laminates are created by laying the cut-to-shape plies into a matched mold, with over-woven or over-braided mandrels or similar tooling details placed between the skins. The mold is closed and a thermosetting resin is injected into the mold to fully impregnate any fibers that were unimpregnated at the time of mold closure and to fully fill all void areas inside the mold. The mold is held closed with pressure, such as by a press, and heated to cure the resin while the resin in the mold is subjected to a hydrostatic pressure sufficient to constrain growth of voids. The contiguous faces of the impregnated braid or weave covering the mandrels are united by the resin, forming vertical or angular laminate between the inner faces of the skins.

Abstract: Plies of continuous fiber material are oriented and cut to the intended shape of a structural component, such as the vertical tail of an aircraft. Two skins or laminates are created by laying the cut-to-shape plies into a matched mold, with over-woven or over-braided mandrels or similar tooling details placed between the skins. The mold is closed and a thermosetting resin is injected into the mold to fully impregnate any fibers that were unimpregnated at the time of mold closure and to fully fill all void areas inside the mold. The mold is held closed with pressure, such as by a press, and heated to cure the resin while the resin in the mold is subjected to a hydrostatic pressure sufficient to constrain growth of voids. The contiguous faces of the impregnated braid or weave covering the mandrels are united by the resin, forming vertical or angular laminate between the inner faces of the skins.

Abstract: Heat transfer device (30) dissipates and removes heat energy from a heat source and delivers the heat energy to a heat sink. Heat transfer device (30) includes diamond substrate (32) for receiving the heat energy from the heat source. Interconnect point (36) connects to diamond substrate (32). Fiber (34), such as a carbon fiber, connects at interconnect point (36) to receive the heat energy from diamond substrate (32) and conduct the heat energy to the heat sink.

Abstract: Heat transfer device (30) dissipates and removes heat energy from a heat source and delivers the heat energy to a heat sink. Heat transfer device (30) includes diamond substrate (32) for receiving the heat energy from the heat source. Interconnect point (36) connects to diamond substrate (32). Fiber (34), such as a carbon fiber, connects at interconnect point (36) to receive the heat energy from diamond substrate (32) and conduct the heat energy to the heat sink.

Abstract: Heat transfer device (30) dissipates and removes heat energy from a heat source and delivers the heat energy to a heat sink. Heat transfer device (30) includes diamond substrate (32) for receiving the heat energy from the heat source. Interconnect point (36) connects to diamond substrate (32). Fiber (34), such as a carbon fiber, connects at interconnect point (36) to receive the heat energy from diamond substrate (32) and conduct the heat energy to the heat sink.