Patents by Inventor Eldon Cornish

Eldon Cornish has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Voltage multiplexed chip I/O for multi-chip modules
    Patent number: 5815100
    Abstract: An electrical interconnect between a plurality of output nodes of a first integrated circuit (IC) and a plurality of input nodes of a second IC, the interconnect. A first bond pad located on the first integrated circuit is coupled to the output nodes. A second bond pad located on the second integrated circuit is coupled to the input nodes. A first digital-to-analog converter located on the first integrated circuit and having an output coupled to the first bond pad receives a plurality of binary inputs from the output nodes of the first integrated circuit. A first analog-to-digital converter is located on the second integrated circuit and coupled to the second bond pad and has an output line coupled to each of the plurality of input nodes of the second IC.
    Type: Grant
    Filed: June 4, 1996
    Date of Patent: September 29, 1998
    Assignee: Hewlett-Packard Company
    Inventors: Kenneth Rush, Eldon Cornish, Steve Draving