Patents by Inventor Eleanor Rudin

Eleanor Rudin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor wafer processing adhesives and tapes
    Patent number: 5851664
    Abstract: A semiconductor wafer processing tape comprises a permanent backing and a layer of a non-pressure sensitive adhesive comprising a thermoplastic elastomer block copolymer on the permanent backing. Optionally, the adhesive may include an adhesion modifier such as a tackifying resin, a liquid rubber or a photocrosslinking agent. The tapes are useful for both wafer grinding and wafer dicing applications. A method of processing semiconductor wafers is disclosed.
    Type: Grant
    Filed: June 3, 1997
    Date of Patent: December 22, 1998
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Richard E. Bennett, Gerald C. Bird, Mark K. Nestegard, Eleanor Rudin