Patents by Inventor Electronics and Telecommunication Research Inst

Electronics and Telecommunication Research Inst has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130157643
    Abstract: Disclosed is a small cell base station managing method of a small cell base station managing system which manages a plurality of small cell base stations. The small cell base station managing method includes receiving a reconfiguration request; selecting a radio access technology (hereinafter, referred to as RAT) of a selected small cell base station according the reconfiguration request; and requesting the selected small cell base station to operate using the selected RAT.
    Type: Application
    Filed: November 21, 2012
    Publication date: June 20, 2013
    Applicant: Electronics and Telecommunications Research Institute
    Inventor: Electronics and telecommunications research inst
  • Publication number: 20130156943
    Abstract: Provided is a color patterning method, in which electrophoretic microcapsules are used. The patterning method may include preparing a microcapsule slurry, in which electrophoretic microcapsules and a water-soluble binder are mixed, coating the microcapsule slurry on a first substrate, moving the microcapsules from the first substrate to a stamp, and moving the microcapsules from the stamp to a second substrate to form patterns. By using the patterning method, it is possible to form an intended pattern without physical and chemical damage on the microcapsules and realize an improved color electronic paper.
    Type: Application
    Filed: December 7, 2012
    Publication date: June 20, 2013
    Applicant: Electronics and Telecommunications Research Institute
    Inventor: Electronics & Telecommunications Research Inst
  • Publication number: 20130151139
    Abstract: When a user enters an indoor space, such as a building, where it is difficult to obtain absolute positioning information, probable indoor path information is estimated based on outer appearance information of the building that the user is presumed to have entered and the moving distance and moving direction of the user. Also, location information calculated according to an estimated navigation method is selectively corrected by using the estimated indoor path information.
    Type: Application
    Filed: November 29, 2012
    Publication date: June 13, 2013
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventor: Electronics and telecommunications research inst
  • Publication number: 20130126838
    Abstract: Provided is a method of forming an organic thin film including forming a first layer containing a first organic material on a substrate, performing a first imprint process on the first layer using a pattern mold, forming a second layer containing a second organic material on the first layer after the first imprint process, and performing a second imprint process on the second layer using a blanket mold.
    Type: Application
    Filed: November 23, 2012
    Publication date: May 23, 2013
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventor: Electronics and telecommunications research inst
  • Publication number: 20130061438
    Abstract: In a piezoelectric speaker, an acoustic diaphragm is thicker than a piezoelectric thin film and is formed of a more flexible and higher elasticity material than the piezoelectric thin film, thereby greatly improving output sound pressure in a low frequency band and reducing sound distortion. Further, the piezoelectric thin film is attached to the acoustic diaphragm in an inclined structure in which the piezoelectric thin film is horizontally turned from the acoustic diaphragm, thereby preventing a standing wave from being created by structural symmetry and minimizing sound distortion.
    Type: Application
    Filed: November 7, 2012
    Publication date: March 14, 2013
    Applicant: Electronics and Telecommunications Research Institute
    Inventor: Electronics and Telecommunication Research Inst
  • Publication number: 20130040428
    Abstract: A semiconductor package is provided. The semiconductor package includes a package body, a plurality of semiconductor chips, and an external connection terminal. The package body is stacked with a plurality of sheets where conductive patterns and vias are disposed. The plurality of semiconductor chips are inserted into insert slots extending from one surface of the package body. The external connection terminal is provided on other surface opposite to the one surface of the package body. Here, the plurality of semiconductor chips are electrically connected to the external connection terminal.
    Type: Application
    Filed: October 16, 2012
    Publication date: February 14, 2013
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventor: Electronics and Telecommunication Research Inst