Patents by Inventor Elene Chobanyan

Elene Chobanyan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240055157
    Abstract: A signal cable for an AC-coupled link, may include: a signal conductor; a dielectric surrounding the signal conductor; and a ground sheath having a conductive layer disposed at least partially around the conductor such that the dielectric is positioned between the ground sheath and the signal conductor, wherein the conductive layer comprises a first portion extending in a first direction along the cable and a second portion extending in a second direction, opposite the first direction, along the cable and further wherein the first and second portions of the conductive layer are separated from each other by a gap, the gap being dimensioned to provide a determined amount of capacitance in series in the ground sheath. The gap may form a complete separation between the first and second portions of the conductive layer.
    Type: Application
    Filed: October 23, 2023
    Publication date: February 15, 2024
    Inventors: Karl J. Bois, James David Stewart, David P. Kopp, Elene Chobanyan
  • Patent number: 11810689
    Abstract: A signal cable for an AC-coupled link, may include: a signal conductor; a dielectric surrounding the signal conductor; and a ground sheath having a conductive layer disposed at least partially around the conductor such that the dielectric is positioned between the ground sheath and the signal conductor, wherein the conductive layer comprises a first portion extending in a first direction along the cable and a second portion extending in a second direction, opposite the first direction, along the cable and further wherein the first and second portions of the conductive layer are separated from each other by a gap, the gap being dimensioned to provide a determined amount of capacitance in series in the ground sheath. The gap may form a complete separation between the first and second portions of the conductive layer.
    Type: Grant
    Filed: October 12, 2020
    Date of Patent: November 7, 2023
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Karl J. Bois, James David Stewart, David P. Kopp, Elene Chobanyan
  • Patent number: 11424859
    Abstract: Systems and methods are provided for implementing forward error correction (FEC) on data transferred on a data link on the physical layer. Binary encoding can be done in accordance with a physical unit (phit) FEC format. The phit FEC format allows for correction of two bit errors and comprises a codeword having a variable bit size. Pre-coding the phit enables burst errors associated with the link to converted into bit errors. The data can be transmitted in the phit FEC format to a receiving PHY. The correctable two bit errors at one or more locations within the phit FEC format can then be corrected by decoding at the receiving PHY in accordance with the phit FEC. The FEC techniques can minimize latency in the PHY.
    Type: Grant
    Filed: October 15, 2020
    Date of Patent: August 23, 2022
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Christopher Michael Brueggen, James Donald Regan, Elene Chobanyan
  • Publication number: 20220123860
    Abstract: Systems and methods are provided for implementing forward error correction (FEC) on data transferred on a data link on the physical layer. Binary encoding can be done in accordance with a physical unit (phit) FEC format. The phit FEC format allows for correction of two bit errors and comprises a codeword having a variable bit size. Pre-coding the phit enables burst errors associated with the link to converted into bit errors. The data can be transmitted in the phit FEC format to a receiving PHY. The correctable two bit errors at one or more locations within the phit FEC format can then be corrected by decoding at the receiving PHY in accordance with the phit FEC. The FEC techniques minimize latency in the PHY, being optimal for Gen-Z systems. The FEC techniques can provide improvements over existing FEC schemes that employ large code word sizes and experience high latency.
    Type: Application
    Filed: October 15, 2020
    Publication date: April 21, 2022
    Inventors: CHRISTOPHER MICHAEL BRUEGGEN, JAMES DONALD REGAN, ELENE CHOBANYAN
  • Patent number: 11309615
    Abstract: A multiple-layer circuit board has a signaling layer plane, an exterior layer plane, and a ground layer plane. A pair of differential signal lines implemented as strip-lines are within the signaling layer, and propagate electromagnetic interference (EMI) along the signaling layer. A dual slot common mode noise filter may be etched within the ground layer and may include a first U-shaped etching pair comprising a first U-shaped etching and a second U-shaped etching opposing the first U-shaped etching within the ground layer plane.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: April 19, 2022
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: David Kopp, James Stewart, Karl Bois, Elene Chobanyan
  • Publication number: 20220115166
    Abstract: A signal cable for an AC-coupled link, may include: a signal conductor; a dielectric surrounding the signal conductor; and a ground sheath having a conductive layer disposed at least partially around the conductor such that the dielectric is positioned between the ground sheath and the signal conductor, wherein the conductive layer comprises a first portion extending in a first direction along the cable and a second portion extending in a second direction, opposite the first direction, along the cable and further wherein the first and second portions of the conductive layer are separated from each other by a gap, the gap being dimensioned to provide a determined amount of capacitance in series in the ground sheath. The gap may form a complete separation between the first and second portions of the conductive layer.
    Type: Application
    Filed: October 12, 2020
    Publication date: April 14, 2022
    Inventors: KARL J. BOIS, JAMES DAVID STEWART, DAVID P. KOPP, ELENE CHOBANYAN
  • Patent number: 11191152
    Abstract: A printed circuit board (PCB) may include a signal layer having a functional region and a PCB signal layer testing region. The PCB signal layer testing region may include a first differential pair having a first length formed on the signal layer, a second differential pair having a second length, different than the first length, formed on the signal layer and a third differential pair having a third length, different than the first length and different than the second length, formed on the signal layer.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: November 30, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Elene Chobanyan, Karl J. Bois, Christian Olsen
  • Patent number: 11042683
    Abstract: A system may include an input engine and a void avoidance engine. The input engine may access an electronic circuit design of an electronic design automation (EDA) tool as well as identify a first net and a second net in the electronic circuit design. The void avoidance engine may perform a void avoidance verification scan to determine whether the first net, the second net, or both, are within a threshold distance from any voids in the electronic circuit design. The void avoidance engine may also generate a double violation alert responsive to a determination that the first net and the second net are both within the threshold distance from a particular void in the electronic circuit design and that the first net and the second net are located on different sides of the same plane of the electronic circuit design.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: June 22, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Elene Chobanyan, Karl J. Bois
  • Publication number: 20200321672
    Abstract: A multiple-layer circuit board has a signaling layer plane, an exterior layer plane, and a ground layer plane. A pair of differential signal lines implemented as strip-lines are within the signaling layer, and propagate electromagnetic interference (EMI) along the signaling layer. A dual slot common mode noise filter may be etched within the ground layer and may include a first U-shaped etching pair comprising a first U-shaped etching and a second U-shaped etching opposing the first U-shaped etching within the ground layer plane.
    Type: Application
    Filed: April 3, 2019
    Publication date: October 8, 2020
    Inventors: David Kopp, James Stewart, Karl Bois, Elene Chobanyan
  • Publication number: 20200236777
    Abstract: A printed circuit board (PCB) may include a signal layer having a functional region and a PCB signal layer testing region. The PCB signal layer testing region may include a first differential pair having a first length formed on the signal layer, a second differential pair having a second length, different than the first length, formed on the signal layer and a third differential pair having a third length, different than the first length and different than the second length, formed on the signal layer.
    Type: Application
    Filed: January 18, 2019
    Publication date: July 23, 2020
    Inventors: Elene Chobanyan, Karl J. Bois, Christian Olsen
  • Patent number: 10499489
    Abstract: A multiple-layer circuit board has a signaling layer, an exterior layer, and a ground layer. A pair of differential signal lines implemented as strip lines are within the signaling layer, and propagate electromagnetic interference (EMI) along the signaling layer. An element conductively extends inwards from the exterior layer. A void of a defected ground structure within the ground layer has a size, shape, and a location in relation to the element to suppress the EMI propagated by the strip lines. A resistive material of the defected ground structure along a perimeter of the void improves suppression of the EMI propagated by the strip lines, via the resistive material absorbing the EMI.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: December 3, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Karl J. Bois, Elene Chobanyan, Benjamin Toby
  • Patent number: 10445458
    Abstract: Examples describe a system that may include an input engine and a proximity verification engine. The input engine may access an electronic circuit design of an electronic design automation (EDA) tool, may identify a particular signal net and a particular power net the particular signal net is referenced to in the electronic circuit design. The input engine may further identify a particular signal via in the electronic circuit design corresponding to the particular signal net and power vias in the electronic circuit design corresponding to the particular power net. In such examples, the proximity verification engine may also verify that the particular signal via is within a threshold distance from at least one of the power vias and generate a proximity alert in response to a determination that none of the power vias are within the threshold distance from the particular signal via.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: October 15, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Elene Chobanyan, Karl J Bois, Charles Andrew Hartman
  • Patent number: 10356964
    Abstract: Examples described herein include an electromagnetic interference shield. In some examples, the electromagnetic interference shield includes a wall comprised of a conductive material. The wall may have a first surface, a second surface, and a thickness between the first surface and the second surface. The shield may include a rounded opening in the wall that creates an air passageway through the thickness of the wall. The shield may also include a first obstruction in the opening and a second obstruction in the opening. The first obstruction may span across the opening. The second obstruction may span across the opening and intersect the first obstruction. The first obstruction and the second obstruction may be waveguide structures.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: July 16, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Elene Chobanyan, Karl J. Bois, Dave Mayer, Arlen L. Roesner
  • Publication number: 20190021164
    Abstract: A multiple-layer circuit board has a signaling layer, an exterior layer, and a ground layer. A pair of differential signal lines implemented as strip lines are within the signaling layer, and propagate electromagnetic interference (EMI) along the signaling layer. An element conductively extends inwards from the exterior layer. A void of a defected ground structure within the ground layer has a size, shape, and a location in relation to the element to suppress the EMI propagated by the strip lines. A resistive material of the defected ground structure along a perimeter of the void improves suppression of the EMI propagated by the strip lines, via the resistive material absorbing the EMI.
    Type: Application
    Filed: July 14, 2017
    Publication date: January 17, 2019
    Inventors: Karl J. Bois, Elene Chobanyan, Benjamin Toby
  • Patent number: 9971864
    Abstract: A system may include an input engine and a symmetry verification engine. The input engine may access an electronic circuit design of an electronic design automation (EDA) tool as well as identify a particular net in the electronic circuit design. The a symmetry verification engine may identify a pair of differential signal vias in the electronic circuit design corresponding to the particular net and determine a verification area surrounding the pair of differential signal vias. The symmetry verification engine may also verify that a particular ground via within the verification area satisfies symmetry criteria with respect to the pair of differential signal vias.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: May 15, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Karl J. Bois, Elene Chobanyan
  • Publication number: 20180089358
    Abstract: Examples describe a system that may include an input engine and a proximity verification engine. The input engine may access an electronic circuit design of an electronic design automation (EDA) tool, may identify a particular signal net and a particular power net the particular signal net is referenced to in the electronic circuit design. The input engine may further identify a particular signal via in the electronic circuit design corresponding to the particular signal net and power vias in the electronic circuit design corresponding to the particular power net. In such examples, the proximity verification engine may also verify that the particular signal via is within a threshold distance from at least one of the power vias and generate a proximity alert in response to a determination that none of the power vias are within the threshold distance from the particular signal via.
    Type: Application
    Filed: September 29, 2016
    Publication date: March 29, 2018
    Inventors: Elene Chobanyan, Karl J. Bois, Charles Andrew Hartman
  • Publication number: 20180025107
    Abstract: A system may include an input engine and a symmetry verification engine. The input engine may access an electronic circuit design of an electronic design automation (EDA) tool as well as identify a particular net in the electronic circuit design. The a symmetry verification engine may identify a pair of differential signal vias in the electronic circuit design corresponding to the particular net and determine a verification area surrounding the pair of differential signal vias. The symmetry verification engine may also verify that a particular ground via within the verification area satisfies symmetry criteria with respect to the pair of differential signal vias.
    Type: Application
    Filed: July 22, 2016
    Publication date: January 25, 2018
    Inventors: Karl J. Bois, Elene Chobanyan
  • Publication number: 20180025106
    Abstract: A system may include an input engine and a void avoidance engine. The input engine may access an electronic circuit design of an electronic design automation (EDA) tool as well as identify a first net and a second net in the electronic circuit design. The void avoidance engine may perform a void avoidance verification scan to determine whether the first net, the second net, or both, are within a threshold distance from any voids in the electronic circuit design. The void avoidance engine may also generate a double violation alert responsive to a determination that the first net and the second net are both within the threshold distance from a particular void in the electronic circuit design and that the first net and the second net are located on different sides of the same plane of the electronic circuit design.
    Type: Application
    Filed: July 22, 2016
    Publication date: January 25, 2018
    Inventors: Elene Chobanyan, Karl J. Bois
  • Publication number: 20180026325
    Abstract: Examples described herein include an electromagnetic interference shield. In some examples, the electromagnetic interference shield includes a wall comprised of a conductive material. The wall may have a first surface, a second surface, and a thickness between the first surface and the second surface. The shield may include a rounded opening in the wall that creates an air passageway through the thickness of the wall. The shield may also include a first obstruction in the opening and a second obstruction in the opening. The first obstruction may span across the opening. The second obstruction may span across the opening and intersect the first obstruction. The first obstruction and the second obstruction may be waveguide structures.
    Type: Application
    Filed: July 21, 2016
    Publication date: January 25, 2018
    Inventors: Elene Chobanyan, Karl J. Bois, Dave Mayer, Arlen L. Roesner