Patents by Inventor Elene Chobanyan
Elene Chobanyan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240055157Abstract: A signal cable for an AC-coupled link, may include: a signal conductor; a dielectric surrounding the signal conductor; and a ground sheath having a conductive layer disposed at least partially around the conductor such that the dielectric is positioned between the ground sheath and the signal conductor, wherein the conductive layer comprises a first portion extending in a first direction along the cable and a second portion extending in a second direction, opposite the first direction, along the cable and further wherein the first and second portions of the conductive layer are separated from each other by a gap, the gap being dimensioned to provide a determined amount of capacitance in series in the ground sheath. The gap may form a complete separation between the first and second portions of the conductive layer.Type: ApplicationFiled: October 23, 2023Publication date: February 15, 2024Inventors: Karl J. Bois, James David Stewart, David P. Kopp, Elene Chobanyan
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Patent number: 11810689Abstract: A signal cable for an AC-coupled link, may include: a signal conductor; a dielectric surrounding the signal conductor; and a ground sheath having a conductive layer disposed at least partially around the conductor such that the dielectric is positioned between the ground sheath and the signal conductor, wherein the conductive layer comprises a first portion extending in a first direction along the cable and a second portion extending in a second direction, opposite the first direction, along the cable and further wherein the first and second portions of the conductive layer are separated from each other by a gap, the gap being dimensioned to provide a determined amount of capacitance in series in the ground sheath. The gap may form a complete separation between the first and second portions of the conductive layer.Type: GrantFiled: October 12, 2020Date of Patent: November 7, 2023Assignee: Hewlett Packard Enterprise Development LPInventors: Karl J. Bois, James David Stewart, David P. Kopp, Elene Chobanyan
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Patent number: 11424859Abstract: Systems and methods are provided for implementing forward error correction (FEC) on data transferred on a data link on the physical layer. Binary encoding can be done in accordance with a physical unit (phit) FEC format. The phit FEC format allows for correction of two bit errors and comprises a codeword having a variable bit size. Pre-coding the phit enables burst errors associated with the link to converted into bit errors. The data can be transmitted in the phit FEC format to a receiving PHY. The correctable two bit errors at one or more locations within the phit FEC format can then be corrected by decoding at the receiving PHY in accordance with the phit FEC. The FEC techniques can minimize latency in the PHY.Type: GrantFiled: October 15, 2020Date of Patent: August 23, 2022Assignee: Hewlett Packard Enterprise Development LPInventors: Christopher Michael Brueggen, James Donald Regan, Elene Chobanyan
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Publication number: 20220123860Abstract: Systems and methods are provided for implementing forward error correction (FEC) on data transferred on a data link on the physical layer. Binary encoding can be done in accordance with a physical unit (phit) FEC format. The phit FEC format allows for correction of two bit errors and comprises a codeword having a variable bit size. Pre-coding the phit enables burst errors associated with the link to converted into bit errors. The data can be transmitted in the phit FEC format to a receiving PHY. The correctable two bit errors at one or more locations within the phit FEC format can then be corrected by decoding at the receiving PHY in accordance with the phit FEC. The FEC techniques minimize latency in the PHY, being optimal for Gen-Z systems. The FEC techniques can provide improvements over existing FEC schemes that employ large code word sizes and experience high latency.Type: ApplicationFiled: October 15, 2020Publication date: April 21, 2022Inventors: CHRISTOPHER MICHAEL BRUEGGEN, JAMES DONALD REGAN, ELENE CHOBANYAN
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Patent number: 11309615Abstract: A multiple-layer circuit board has a signaling layer plane, an exterior layer plane, and a ground layer plane. A pair of differential signal lines implemented as strip-lines are within the signaling layer, and propagate electromagnetic interference (EMI) along the signaling layer. A dual slot common mode noise filter may be etched within the ground layer and may include a first U-shaped etching pair comprising a first U-shaped etching and a second U-shaped etching opposing the first U-shaped etching within the ground layer plane.Type: GrantFiled: April 3, 2019Date of Patent: April 19, 2022Assignee: Hewlett Packard Enterprise Development LPInventors: David Kopp, James Stewart, Karl Bois, Elene Chobanyan
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Publication number: 20220115166Abstract: A signal cable for an AC-coupled link, may include: a signal conductor; a dielectric surrounding the signal conductor; and a ground sheath having a conductive layer disposed at least partially around the conductor such that the dielectric is positioned between the ground sheath and the signal conductor, wherein the conductive layer comprises a first portion extending in a first direction along the cable and a second portion extending in a second direction, opposite the first direction, along the cable and further wherein the first and second portions of the conductive layer are separated from each other by a gap, the gap being dimensioned to provide a determined amount of capacitance in series in the ground sheath. The gap may form a complete separation between the first and second portions of the conductive layer.Type: ApplicationFiled: October 12, 2020Publication date: April 14, 2022Inventors: KARL J. BOIS, JAMES DAVID STEWART, DAVID P. KOPP, ELENE CHOBANYAN
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Patent number: 11191152Abstract: A printed circuit board (PCB) may include a signal layer having a functional region and a PCB signal layer testing region. The PCB signal layer testing region may include a first differential pair having a first length formed on the signal layer, a second differential pair having a second length, different than the first length, formed on the signal layer and a third differential pair having a third length, different than the first length and different than the second length, formed on the signal layer.Type: GrantFiled: January 18, 2019Date of Patent: November 30, 2021Assignee: Hewlett Packard Enterprise Development LPInventors: Elene Chobanyan, Karl J. Bois, Christian Olsen
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Patent number: 11042683Abstract: A system may include an input engine and a void avoidance engine. The input engine may access an electronic circuit design of an electronic design automation (EDA) tool as well as identify a first net and a second net in the electronic circuit design. The void avoidance engine may perform a void avoidance verification scan to determine whether the first net, the second net, or both, are within a threshold distance from any voids in the electronic circuit design. The void avoidance engine may also generate a double violation alert responsive to a determination that the first net and the second net are both within the threshold distance from a particular void in the electronic circuit design and that the first net and the second net are located on different sides of the same plane of the electronic circuit design.Type: GrantFiled: July 22, 2016Date of Patent: June 22, 2021Assignee: Hewlett Packard Enterprise Development LPInventors: Elene Chobanyan, Karl J. Bois
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Publication number: 20200321672Abstract: A multiple-layer circuit board has a signaling layer plane, an exterior layer plane, and a ground layer plane. A pair of differential signal lines implemented as strip-lines are within the signaling layer, and propagate electromagnetic interference (EMI) along the signaling layer. A dual slot common mode noise filter may be etched within the ground layer and may include a first U-shaped etching pair comprising a first U-shaped etching and a second U-shaped etching opposing the first U-shaped etching within the ground layer plane.Type: ApplicationFiled: April 3, 2019Publication date: October 8, 2020Inventors: David Kopp, James Stewart, Karl Bois, Elene Chobanyan
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Publication number: 20200236777Abstract: A printed circuit board (PCB) may include a signal layer having a functional region and a PCB signal layer testing region. The PCB signal layer testing region may include a first differential pair having a first length formed on the signal layer, a second differential pair having a second length, different than the first length, formed on the signal layer and a third differential pair having a third length, different than the first length and different than the second length, formed on the signal layer.Type: ApplicationFiled: January 18, 2019Publication date: July 23, 2020Inventors: Elene Chobanyan, Karl J. Bois, Christian Olsen
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Patent number: 10499489Abstract: A multiple-layer circuit board has a signaling layer, an exterior layer, and a ground layer. A pair of differential signal lines implemented as strip lines are within the signaling layer, and propagate electromagnetic interference (EMI) along the signaling layer. An element conductively extends inwards from the exterior layer. A void of a defected ground structure within the ground layer has a size, shape, and a location in relation to the element to suppress the EMI propagated by the strip lines. A resistive material of the defected ground structure along a perimeter of the void improves suppression of the EMI propagated by the strip lines, via the resistive material absorbing the EMI.Type: GrantFiled: July 14, 2017Date of Patent: December 3, 2019Assignee: Hewlett Packard Enterprise Development LPInventors: Karl J. Bois, Elene Chobanyan, Benjamin Toby
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Patent number: 10445458Abstract: Examples describe a system that may include an input engine and a proximity verification engine. The input engine may access an electronic circuit design of an electronic design automation (EDA) tool, may identify a particular signal net and a particular power net the particular signal net is referenced to in the electronic circuit design. The input engine may further identify a particular signal via in the electronic circuit design corresponding to the particular signal net and power vias in the electronic circuit design corresponding to the particular power net. In such examples, the proximity verification engine may also verify that the particular signal via is within a threshold distance from at least one of the power vias and generate a proximity alert in response to a determination that none of the power vias are within the threshold distance from the particular signal via.Type: GrantFiled: September 29, 2016Date of Patent: October 15, 2019Assignee: Hewlett Packard Enterprise Development LPInventors: Elene Chobanyan, Karl J Bois, Charles Andrew Hartman
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Patent number: 10356964Abstract: Examples described herein include an electromagnetic interference shield. In some examples, the electromagnetic interference shield includes a wall comprised of a conductive material. The wall may have a first surface, a second surface, and a thickness between the first surface and the second surface. The shield may include a rounded opening in the wall that creates an air passageway through the thickness of the wall. The shield may also include a first obstruction in the opening and a second obstruction in the opening. The first obstruction may span across the opening. The second obstruction may span across the opening and intersect the first obstruction. The first obstruction and the second obstruction may be waveguide structures.Type: GrantFiled: July 21, 2016Date of Patent: July 16, 2019Assignee: Hewlett Packard Enterprise Development LPInventors: Elene Chobanyan, Karl J. Bois, Dave Mayer, Arlen L. Roesner
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Publication number: 20190021164Abstract: A multiple-layer circuit board has a signaling layer, an exterior layer, and a ground layer. A pair of differential signal lines implemented as strip lines are within the signaling layer, and propagate electromagnetic interference (EMI) along the signaling layer. An element conductively extends inwards from the exterior layer. A void of a defected ground structure within the ground layer has a size, shape, and a location in relation to the element to suppress the EMI propagated by the strip lines. A resistive material of the defected ground structure along a perimeter of the void improves suppression of the EMI propagated by the strip lines, via the resistive material absorbing the EMI.Type: ApplicationFiled: July 14, 2017Publication date: January 17, 2019Inventors: Karl J. Bois, Elene Chobanyan, Benjamin Toby
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Patent number: 9971864Abstract: A system may include an input engine and a symmetry verification engine. The input engine may access an electronic circuit design of an electronic design automation (EDA) tool as well as identify a particular net in the electronic circuit design. The a symmetry verification engine may identify a pair of differential signal vias in the electronic circuit design corresponding to the particular net and determine a verification area surrounding the pair of differential signal vias. The symmetry verification engine may also verify that a particular ground via within the verification area satisfies symmetry criteria with respect to the pair of differential signal vias.Type: GrantFiled: July 22, 2016Date of Patent: May 15, 2018Assignee: Hewlett Packard Enterprise Development LPInventors: Karl J. Bois, Elene Chobanyan
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Publication number: 20180089358Abstract: Examples describe a system that may include an input engine and a proximity verification engine. The input engine may access an electronic circuit design of an electronic design automation (EDA) tool, may identify a particular signal net and a particular power net the particular signal net is referenced to in the electronic circuit design. The input engine may further identify a particular signal via in the electronic circuit design corresponding to the particular signal net and power vias in the electronic circuit design corresponding to the particular power net. In such examples, the proximity verification engine may also verify that the particular signal via is within a threshold distance from at least one of the power vias and generate a proximity alert in response to a determination that none of the power vias are within the threshold distance from the particular signal via.Type: ApplicationFiled: September 29, 2016Publication date: March 29, 2018Inventors: Elene Chobanyan, Karl J. Bois, Charles Andrew Hartman
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Publication number: 20180025107Abstract: A system may include an input engine and a symmetry verification engine. The input engine may access an electronic circuit design of an electronic design automation (EDA) tool as well as identify a particular net in the electronic circuit design. The a symmetry verification engine may identify a pair of differential signal vias in the electronic circuit design corresponding to the particular net and determine a verification area surrounding the pair of differential signal vias. The symmetry verification engine may also verify that a particular ground via within the verification area satisfies symmetry criteria with respect to the pair of differential signal vias.Type: ApplicationFiled: July 22, 2016Publication date: January 25, 2018Inventors: Karl J. Bois, Elene Chobanyan
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Publication number: 20180025106Abstract: A system may include an input engine and a void avoidance engine. The input engine may access an electronic circuit design of an electronic design automation (EDA) tool as well as identify a first net and a second net in the electronic circuit design. The void avoidance engine may perform a void avoidance verification scan to determine whether the first net, the second net, or both, are within a threshold distance from any voids in the electronic circuit design. The void avoidance engine may also generate a double violation alert responsive to a determination that the first net and the second net are both within the threshold distance from a particular void in the electronic circuit design and that the first net and the second net are located on different sides of the same plane of the electronic circuit design.Type: ApplicationFiled: July 22, 2016Publication date: January 25, 2018Inventors: Elene Chobanyan, Karl J. Bois
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Publication number: 20180026325Abstract: Examples described herein include an electromagnetic interference shield. In some examples, the electromagnetic interference shield includes a wall comprised of a conductive material. The wall may have a first surface, a second surface, and a thickness between the first surface and the second surface. The shield may include a rounded opening in the wall that creates an air passageway through the thickness of the wall. The shield may also include a first obstruction in the opening and a second obstruction in the opening. The first obstruction may span across the opening. The second obstruction may span across the opening and intersect the first obstruction. The first obstruction and the second obstruction may be waveguide structures.Type: ApplicationFiled: July 21, 2016Publication date: January 25, 2018Inventors: Elene Chobanyan, Karl J. Bois, Dave Mayer, Arlen L. Roesner