Patents by Inventor Elenita Chanhvongsak

Elenita Chanhvongsak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Through silicon via fabrication
    Patent number: 10867855
    Abstract: One or more embodiments are directed to establishing electrical connections through silicon wafers with low resistance and high density, while at the same time maintaining processability for further fabrication. Such connections through silicon wafers enable low resistance connections from the top side of a silicon wafer to the bottom side of the silicon wafer.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: December 15, 2020
    Assignee: Honeywell International Inc.
    Inventors: Robert E. Higashi, Son T. Lu, Elenita Chanhvongsak
  • THROUGH SILICON VIA FABRICATION
    Publication number: 20200365459
    Abstract: One or more embodiments are directed to establishing electrical connections through silicon wafers with low resistance and high density, while at the same time maintaining processability for further fabrication. Such connections through silicon wafers enable low resistance connections from the top side of a silicon wafer to the bottom side of the silicon wafer.
    Type: Application
    Filed: May 13, 2019
    Publication date: November 19, 2020
    Inventors: Robert E. Higashi, Son T. Lu, Elenita Chanhvongsak