Abstract: A printing device for printing markings directly onto insulated round wires is presented. The printing device includes a printing module (1, 2) that prints the markings onto a retransfer film (7) as transfer carrier and a transport device (9, 13, 24) transports the retransfer film (7) into the transfer device (9, 13, 24) for transfer printing of the marking onto the round wires (16). The transfer device (9, 13, 24) includes two die halves (4, 5) with a plurality of semicircular grooves (3) for wires (16) of different diameters. A lower die half (5) is configured to receive the wires (16) while an upper die half (4) is configured with heater (12) to heat and enclose the wire (16) with the retransfer film (7) bearing the marking. The two die halves (4, 5) are joined under pressure and heat around the wire (16) to be printed on.

Abstract: The invention comprises a printing device for printing markings directly onto insulated round wires, comprising a printing module (1, 2) for printing the marking onto a retransfer film (7) as transfer carrier and a transport device (9, 13, 24) for the retransfer film (7) for transporting into a transfer device for transfer printing of the marking onto the round wires (16). The transfer device comprises two die halves (4, 5) with a plurality of semicircular grooves (3) for wires (16) of different diameters, wherein the lower die half (5) is configured to receive the round wires (16), the upper die half (4) is equipped with a heating means (12), and to enclose the wire (16) with the retransfer film (7) bearing the marking is movable in the direction of the lower die half (5), so that as a result of this movement the two die halves (4, 5) are joined under pressure and heat around the wire (16) to be printed on.