Patents by Inventor ELI B. SMITH

ELI B. SMITH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110168435
    Abstract: A printed circuit board includes, but is not limited to, a plurality of electrically conductive layers and a plurality of dielectric layers. Each dielectric layer is interposed between adjacent conductive layers to form a body of alternate conductive layers and dielectric layers. At least one of the electrically conductive layers protrudes beyond an end of the body.
    Type: Application
    Filed: January 13, 2010
    Publication date: July 14, 2011
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventors: ALAN L. BARRY, ELI B. SMITH, BROOKS S. MANN, NICHOLAS HAYDEN HERRON, MARK D. KORICH, DAVID TANG, CINDY CHOU