Patents by Inventor Eli Toledano

Eli Toledano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7626610
    Abstract: According to the invention, an electronic module tester for engaging a camera module is disclosed. The electronic module tester includes a camera tester body, an engagement ring, and a camera back support. The engagement ring engages a lens holder of the camera module, where the engagement ring comprises an engagement surface, an outer circumference and an inner circumference. The engagement surface rotates and is not keyed for any key on the lens holder. The camera back support engages a back of the camera module, where the back is on the opposite side of camera module as the lens holder. The engagement ring and the camera back support are separated, but biased together to engage the camera module.
    Type: Grant
    Filed: November 12, 2004
    Date of Patent: December 1, 2009
    Assignee: Transchip Israel Ltd.
    Inventors: Eli Toledano, Ron Wittenberg
  • Publication number: 20050128336
    Abstract: According to the invention, an electronic module tester for engaging a camera module is disclosed. The electronic module tester includes a camera tester body, an engagement ring, and a camera back support. The engagement ring engages a lens holder of the camera module, where the engagement ring comprises an engagement surface, an outer circumference and an inner circumference. The engagement surface rotates and is not keyed for any key on the lens holder. The camera back support engages a back of the camera module, where the back is on the opposite side of camera module as the lens holder. The engagement ring and the camera back support are separated, but biased together to engage the camera module.
    Type: Application
    Filed: November 12, 2004
    Publication date: June 16, 2005
    Applicant: TransChip, Inc.
    Inventors: Eli Toledano, Ron Wittenberg
  • Publication number: 20020157657
    Abstract: A method and apparatus for cutting panels or wafers into rectangular shaped die. The apparatus includes a spindle; and a first blade having a first diameter and a second blade having a second diameter smaller that the first diameter each blade mounted to the spindle and spaced apart from one another. The first blade and second blades cut the workpiece based on a direction of movement of said workpiece relative to the first and second blades. The method includes the steps of mounting a first blade having a first diameter and a second blade having a second diameter smaller that the first diameter on a spindle; moving the workpiece relative to the first and second blades; cutting the workpiece along a first direction with the first blade; and cutting the workpiece along a second direction with both the first and second blades simultaneously.
    Type: Application
    Filed: April 25, 2001
    Publication date: October 31, 2002
    Applicant: Kulicke & Soffa Investments Inc.
    Inventor: Eli Toledano