Abstract: A method is provided, wherein a lighting device (200, 300, 400, 500) comprising an at least partly light transmitting envelope (110) and a solid state light source (120) is manufactured. The method comprises arranging (710) an at least partly light transmitting plastic material (140) in a mold (130) having a surface structure (132) arranged on an inner surface portion of the mold and blow molding (720) the plastic material so as to form the envelope. During the blow molding, the surface structure is at least partly transferred to the at least partly light transmitting plastic material, thereby forming an optical structure (150) on a portion of an outer surface of the envelope. The envelope is then removed (730) from the mold and arranged (740) to at least partly enclose the solid state light source. The optical structure may be formed to generate a desired optical effect.

Abstract: A method is provided, wherein a lighting device (200, 300, 400, 500) comprising an at least partly light transmitting envelope (110) and a solid state light source (120) is manufactured. The method comprises arranging (710) an at least partly light transmitting plastic material (140) in a mold (130) having a surface structure (132) arranged on an inner surface portion of the mold and blow molding (720) the plastic material so as to form the envelope. During the blow molding, the surface structure is at least partly transferred to the at least partly light transmitting plastic material, thereby forming an optical structure (150) on a portion of an outer surface of the envelope. The envelope is then removed (730) from the mold and arranged (740) to at least partly enclose the solid state light source. The optical structure may be formed to generate a desired optical effect.

Abstract: A method is provided, wherein a lighting device (200, 300, 400, 500) comprising an at least partly light transmitting envelope (110) and a solid state light source (120) is manufactured. The method comprises arranging (710) an at least partly light transmitting plastic material (140) in a mold (130) having a surface structure (132) arranged on an inner surface portion of the mold and blow molding (720) the plastic material so as to form the envelope. During the blow molding, the surface structure is at least partly transferred to the at least partly light transmitting plastic material, thereby forming an optical structure (150) on a portion of an outer surface of the envelope. The envelope is then removed (730) from the mold and arranged (740) to at least partly enclose the solid state light source. The optical structure may be formed to generate a desired optical effect.

Abstract: A lighting device (100, 200, 300, 400) is disclosed, comprising an at least partly light transmitting envelope (110) arranged to at least partly enclose a light source (120). The envelope comprises a portion (114) that is elastic such that its extension and orientation relative to a nominal optical axis of a base (140) of the lighting device is adjustable so as to allow for light output from the lighting device to be modified. A method for manufacturing such lighting device is also disclosed.

Abstract: A method is provided, wherein a lighting device (200, 300, 400, 500) comprising an at least partly light transmitting envelope (110) and a solid state light source (120) is manufactured. The method comprises arranging (710) an at least partly light transmitting plastic material (140) in a mold (130) having a surface structure (132) arranged on an inner surface portion of the mold and blow molding (720) the plastic material so as to form the envelope. During the blow molding, the surface structure is at least partly transferred to the at least partly light transmitting plastic material, thereby forming an optical structure (150) on a portion of an outer surface of the envelope. The envelope is then removed (730) from the mold and arranged (740) to at least partly enclose the solid state light source. The optical structure may be formed to generate a desired optical effect.

Abstract: A lighting device (100, 200, 300, 400) is disclosed, comprising an at least partly light transmitting envelope (110) arranged to at least partly enclose a light source (120). The envelope comprises a portion (114) that is elastic such that its extension and orientation relative to a nominal optical axis of a base (140) of the lighting device is adjustable so as to allow for light output from the lighting device to be modified. A method for manufacturing such lighting device is also disclosed.

Abstract: A method of manufacturing a thin-film electronic device includes applying a plastic coating to a rigid carrier substrate for forming a plastic substrate. The plastic material has a coefficient of thermal expansion greater in a first direction perpendicular to the substrate plane than in a second direction parallel to the substrate plane. Thin film electronic elements are formed over the plastic substrate and the rigid carrier substrate is released from the plastic substrate by a heating process which expands the plastic substrate preferentially in a direction perpendicular to the substrate plane.

Abstract: A method of manufacturing a thin film electronic device includes applying a plastic coating to a rigid carrier substrate using a wet casting process, the plastic coating forming a plastic substrate and include a transparent plastic material doped with a UV absorbing additive. Thin film electronic elements are formed over the plastic substrate, and the rigid carrier substrate is released from the plastic substrate. This method forms transparent substrate materials suitable for a laser release process, through doping of the plastic material of the substrate with a UV absorber. This UV absorber absorbs in the wavelength of the lift-off laser (for example 308-351 nm, or 355 nm) with a very high absorption.

Abstract: A method of manufacturing a thin- film electronic device comprises applying a plastic coating to a rigid carrier substrate (12) using a wet casting process, the plastic coating forming a plastic substrate (22). The plastic material has a coefficient of thermal expansion greater in a first direction perpendicular to the substrate plane than in a second direction parallel to the substrate plane. Thin film electronic elements are formed over the plastic substrate and the rigid carrier substrate is released from the plastic substrate by a heating process which expands the plastic substrate preferentially in a direction perpendicular to the substrate plane. The anisotropy of the thermal expansion in the plastic substrate of the invention enables the expansion of the substrate during the thermal lift-off process to be in the perpendicular direction. This has been found to aid the lift-off process and also protect the components mounted on the upper surface of the plastic substrate.

Abstract: A method of manufacturing a thin-film electronic device comprises applying a plastic coating to a rigid carrier substrate (12) using a wet casting process, the plastic coating forming a plastic substrate (22). The plastic material has a coefficient of thermal expansion greater in a first direction perpendicular to the substrate plane than in a second direction parallel to the substrate plane. Thin film electronic elements are formed over the plastic substrate and the rigid carrier substrate is released from the plastic substrate by a heating process which expands the plastic substrate preferentially in a direction perpendicular to the substrate plane. The anisotropy of the thermal expansion in the plastic substrate of the invention enables the expansion of the substrate during the thermal lift-off process to be in the perpendicular direction. This has been found to aid the lift-off process and also protect the components mounted on the upper surface of the plastic substrate.

Abstract: A method of manufacturing a thin film electronic device comprises applying a plastic coating to a rigid carrier substrate using a wet casting process, the plastic coating forming a plastic substrate and comprising a transparent plastic material and a UV absorbing additive. Thin film electronic elements are formed over the plastic substrate, and the rigid carrier substrate is released from the plastic substrate. This invention provides a method of making transparent substrate materials suitable for a laser release process, through doping of the plastic material of the substrate with a UV absorber. This UV absorber absorbs in the wavelength the lift-off laser (for example 308-351 nm, or 355 nm) with a very high absorption.

Abstract: An active matrix device has an array of rows and columns of pixels over a common substrate. Each pixel has a row conductor (12), a column conductor (10) and first and second in-plane electrode patterns (36,40). A first insulator portion (30) is disposed between the row conductor (12) and the first electrode pattern (32) or between the column conductor portion (10) and the second electrode pattern (40). The insulator portion (30) and the surrounding electrode pattern (32 or 40) and conductor portion (12 or 10) define a Metal-Insulator-Metal diode device. The invention provides a MIM-diode based active matrix inplane switching active matrix device in which the pixel layout is defined on a single substrate. The device of the invention is compatible with low cost manufacturing processes, such as roll-to-roll manufacturing.

Abstract: An electroluminescent panel comprising: a closed casing; an organic device received in the casing and defining a plurality of pixels; the organic device including an organic luminescent layer between a lower and an upper electrode layer; and a getter means disposed in the casing. The getter means is a high capacity getter means by employing alkaline metals and/or alkaline earth metals in the form of non-oxidic compounds or alloys in which they are dispersed on a molecular scale, whereby they are still active reactants with oxygen, hydrogen and water. Preferably the getter means comprises a getter material selected from the following groups: (a) an alloy of at least one alkaline metal or alkaline earth metal with an other metal; (b) alkaline (earth) metal carbide, alkaline (earth) metal silicide, alkaline (earth) metal nitride; (c) at least one alkaline (earth) metal intercalated in C, Si, Ge, Sn or Pb.

Abstract: A passive matrix in-plane switching bi-stable display (1) has first and second electrodes (20, 30), and pixels (10) associated with intersections of the first electrodes (20) and the second electrodes (30). The display (1) comprises on a same substrate both the first electrodes (20) and, per pixel (10), a first group of electrodes (G1) interleaving with a second group of electrodes (G2). The electrodes of the first and second group (G1, G2) extend in a same first direction, and are displaced with respect to each other in the first direction to obtain in the first direction a first area (A1) where only electrodes of said first group (G1) are present, a second area (A2) where only electrodes of said second group (G2) are present, and a third area (A3) in-between the first and the second area (A1, A2) where both electrodes of said first and second group (G1, G2) are present. Insulating areas (40) are present at least at crossing positions where the second electrodes (30) have to cross the first electrodes (20).

Abstract: The invention relates to a sealing structure (6) suitable for a polymer-based electronic device (1), charaterized in that the sealing structure (6) comprises a first layer (7) of a first dielectric material formed on said device (1) and a second layer (8) of a second dielectric material formed on the first layer (7).

Abstract: The invention relates to a device, such as an electro-luminescent display device, comprising a substrate, first electrodes which are arranged over the substrate, second electrodes which are arranged over the first electrodes and at least one electrically insulating structure which separates two of the second electrodes and is arranged over at least one of the first electrodes. The insulating structure comprises an opening which extends from the top surface of the structure to the first electrode beneath the structure. The invention further relates to a method of manufacturing such a device. In one preferred embodiment, this method involves the use of sacrificial structures with which openings are obtained the upper parts of which extend along the entire length of the respective insulating structures.

Abstract: An electroluminescent device (21) comprises a first (23) and a second (26) electrode layer, at least the second electrode layer (26) being provided in accordance with a desired pattern and one or more functional layers (24, 25R, 25G, 25B), the one or at least one of said functional layers being an electroluminescent layer. In order to pattern the second electrode layer (26) the EL device (21) comprises a relief pattern (27) having one or more overhanging sections (29). The EL device has means for hindering the transport of fluid along a capillary channel (33) formed by an overhanging section (29) and the surface (28a) supporting that section, an example of such means being protrusions (35) which block and/or reroute the capillary channel (33). Thus the transport of fluid by the channels (33) during manufacture of the EL device is hindered and color bleeding between pixels of the EL device and/or leakage current among electrodes of the first electrode layer is prevented.

Abstract: A method is proposed for measuring water permeability of substrates (1). A reactive compound (Ca, Ba) which reacts with a diffusing material, e.g. water, is applied on the substrate and the change in time of transmissivity, reflectivity of the layer is monitored in time.

Abstract: A method of manufacturing an electroluminescent device comprising forming a pattern, depositing a liquid, and processing the liquid to form an electroluminescent region. The pattern includes an overhanging structure with a negatively-sloped section thereunder and a functional region bounded on at least one side by a positively-sloped section. The overhanging structure is on a side of the positively-sloped section that is opposite the functional region. The liquid is suitable for forming a functional layer within the functional region such that the liquid contacts the a positively-sloped surface of the positively-sloped sections. The positively-sloped sections have a shape and size such that at least some of the liquid is prevented from reaching the negatively-sloped section and being taken up by a capillary channel of the negatively-sloped section.

Abstract: A method is proposed for measuring water permeability of substrates (1). A reactive compound (Ca, Ba) which reacts with a diffusing material, e.g. water, is applied on the substrate and the change in time of transmissivity, reflectivity of the layer is monitored in time.