Patents by Inventor Eliav Shaul

Eliav Shaul has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus, method and computer program product for efficient software-defined network accelerated processing using storage devices which are local relative to a host
    Patent number: 11940935
    Abstract: A computerized system operating in conjunction with computerized apparatus and with a fabric target service in data communication with the computerized apparatus, the system comprising functionality residing on the computerized apparatus, and functionality residing on the fabric target service, which, when operating in combination, enable the computerized apparatus to coordinate access to data.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: March 26, 2024
    Assignee: MELLANOX TECHNOLOGIES, LTD.
    Inventors: Eliav Bar-Ilan, Oren Duer, Maxim Gurtovoy, Liran Liss, Aviad Shaul Yehezkel
  • User-defined peripheral-bus device implementation
    Publication number: 20240095205
    Abstract: A system includes a bus interface and circuitry. The bus interface is configured to communicate with an external device over a peripheral bus. The circuitry is configured to support a plurality of widgets that perform primitive operations used in implementing peripheral-bus devices, to receive a user-defined configuration, which specifies a user-defined peripheral-bus device as a configuration of one or more of the widgets, and to implement the user-defined peripheral-bus device toward the external device over the peripheral bus, in accordance with the user-defined configuration.
    Type: Application
    Filed: November 16, 2022
    Publication date: March 21, 2024
    Inventors: Daniel Marcovitch, Liran Liss, Aviad Shaul Yehezkel, Rabia Loulou, Oren Duer, Shahaf Shuler, Chenghuan Jia, Philip Browning Johnson, Gal Shalom, Omri Kahalon, Adi Merav Horowitz, Arpit Jain, Eliav Bar-Ilan, Prateek Srivastava
  • Microelectronic assemblies having front end under embedded radio frequency die
    Patent number: 11424195
    Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a radio frequency (RF) die having a lateral surface area and a plurality of contacts on a face, where the RF die is embedded in the package substrate with the plurality of contacts facing towards the second surface of the package substrate, and an RF front end between the RF die and the first surface of the package substrate, where the RF front end is positioned under the RF die and does not extend beyond the lateral surface area of the RF die.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: August 23, 2022
    Assignee: Intel Corporation
    Inventors: Eliav Shaul, Avi Tsarfati
  • MICROELECTRONIC ASSEMBLIES HAVING FRONT END UNDER EMBEDDED RADIO FREQUENCY DIE
    Publication number: 20190304936
    Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a radio frequency (RF) die having a lateral surface area and a plurality of contacts on a face, where the RF die is embedded in the package substrate with the plurality of contacts facing towards the second surface of the package substrate, and an RF front end between the RF die and the first surface of the package substrate, where the RF front end is positioned under the RF die and does not extend beyond the lateral surface area of the RF die.
    Type: Application
    Filed: April 2, 2018
    Publication date: October 3, 2019
    Applicant: Intel Corporation
    Inventors: Eliav Shaul, Avi Tsarfati