Abstract: A diamond article, for example, a sheet-form diamond tool insert brazable in air. The diamond sheet has a dual layer coating, a WTi bonding layer and a protective braze compatible overcoat, such as a Ag overcoat. The interface between the WTi layer and the diamond substrate includes sufficient metal carbide component to provide adhesion. Once coated with the WTi layer and the protective overcoat, the dual-coated diamond insert may be air brazed to a tool substrate in a manufacturing environment using a standard braze without a vacuum furnace or special atmosphere. A method for manufacturing the diamond insert is also disclosed. The diamond insert is coated and heat treated in an oxygen- and nitrogen-free atmosphere to create metal carbide at the diamond-coating interface.

Abstract: A diamond article, for example, a sheet-form diamond tool insert brazable in air. The diamond sheet has a dual layer coating, a chromium bonding layer and a protective braze compatible overcoat, such as a Ni overcoat. The interface between the Cr layer and the diamond substrate includes sufficient metal carbide component to provide adhesion. Once coated with the Cr layer and the protective overcoat, the dual-coated diamond insert may be air brazed to a tool substrate in a manufacturing environment using a standard braze without a vacuum furnace or special atmosphere. A method for manufacturing the diamond insert comprises the steps of depositing a chromium metal layer on a diamond substrate, depositing a substantially non-oxidizable protective layer on the metal layer and heating the dual-coated diamond article at a temperature for a sufficient time. The diamond insert is coated and heat treated in an oxygen- and nitrogen-free atmosphere to create metal carbide at the diamond-coating interface.

Abstract: A diamond article, for example, a sheet-form diamond tool insert brazable in air. The diamond sheet has a dual layer coating, a WTi bonding layer and a protective braze compatible overcoat, such as a Ag overcoat. The interface between the WTi layer and the diamond substrate includes sufficient metal carbide component to provide adhesion. Once coated with the WTi layer and the protective overcoat, the dual-coated diamond insert may be air brazed to a tool substrate in a manufacturing environment using a standard braze without a vacuum furnace or special atmosphere. A method for manufacturing the diamond insert is also disclosed. The diamond insert is coated and heat treated in an oxygen- and nitrogen-free atmosphere to create metal carbide at the diamond-coating interface.

Abstract: A process for making metallized vias in diamond substrates is disclosed. The process involves laser-drilling a plurality of holes in a CVD diamond substrate and depositing tungsten, or a similar refractory metal, in the holes by low pressure CVD to provide substantially void-free metallized vias. Diamond substrates having metallized vias are also disclosed. The structures are useful for making multichip modules for high clock rate computers.

Abstract: Adherent traces of a carbide-forming conductive metal are produced on a diamond surface, without deposition of carbide in areas to be non-conductive, by depositing an undercoat layer of a non-carbide-forming metal such as palladium, patterning said undercoat layer and then depositing a bond layer of the carbide-forming metal. The undercoat layer and the portion of the bond layer deposited thereon are then removed, typically by etching.

Abstract: A process for making metallized vias in diamond substrates is disclosed. The process involves laser-drilling a plurality of holes in a CVD diamond substrate and depositing tungsten, or a similar refractory metal, in the holes by low pressure CVD to provide substantially void-free metallized vias. Diamond substrates having metallized vias are also disclosed. The structures are useful for making multichip modules for high clock rate computers.

Abstract: An improved method for pretreating a polyimide surface in preparation for an adhesion promotion treatment and subsequent metallization is disclosed, wherein the pretreatment comprises mild etching of the surface, contact of the surface with a basic solution, and contact of the surface with a cationic surfactant which is capable of removing a residual film formed on the surface after the mild etching step. This invention further includes articles such as printed circuit boards, which comprise a polyimide substrate pretreated as described above and then treated with an adhesion promoter, wherein an electrolessly-applied metal layer is disposed on the substrate, and an electrolytically-applied metal layer free of chemical additives is disposed on the electrolessly-applied layer. The article may include an additional electrolytically-applied layer containing chemical additives and disposed on top of the first electrolytic layer.