Abstract: An industrial wedge-type gripper mechanism for gripping or releasing objects that has a housing with a piston of a pneumatic cylinder moveable in the housing in longitudinal direction of the housing and a plurality of gripper jaw holders that slide in the housing in a radial or transverse direction and that support the gripper jaws. The gripper jaw holders have inclined slots, and the piston of the pneumatic cylinder is associated with a member that supports rolling bearings rolling and sliding in the inclined slots so that with reciprocations of the piston the rolling bearings exert a camming or wedging action on the walls of the inclined slots and thus cause the gripper jaw holders and thus the gripper jaws to perform gripping or releasing action on the objects.

Abstract: Proposed is a universal gripping and suction chuck for use as an interchangeable end effector of a robot arm of a robotic station capable of picking up, transporting, and handling objects having colors and outlines. The chuck housing contains elements of a vacuum system for holding the object by vacuum suction force, a vortex system for holding the objects in a non-contact manner in a state of levitation, and a mechanical edge gripper. The vacuum system, the vortex system, and the mechanical edge gripper can be selectively activated by commands from the central processing system that receives a signal recognition signal, object presence/absence signal and/or object approaching signal from respective sensors and depending on the type of the object recognized by the respective sensor. As a result, the chuck can pick up and handle such different objects as solid semiconductor wafer, paper or fabric interleaves, or small-diameter rings.

Abstract: Proposed is a universal gripping and suction chuck for use as an interchangeable end effector of a robot arm of a robotic station capable of picking up, transporting, and handling objects having colors and outlines. The chuck housing contains elements of a vacuum system for holding the object by vacuum suction force, a vortex system for holding the objects in a non-contact manner in a state of levitation, and a mechanical edge gripper. The vacuum system, the vortex system, and the mechanical edge gripper can be selectively activated by commands from the central processing system that receives a signal recognition signal, object presence/absence signal and/or object approaching signal from respective sensors and depending on the type of the object recognized by the respective sensor. As a result, the chuck can pick up and handle such different objects as solid semiconductor wafer, paper or fabric interleaves, or small-diameter rings.

Abstract: Provided is a robotic station with a self-teaching system. Operation of this system is automatically initiated for eliminating an accumulated error upon completion of a given number of processing cycles or expiration of a given time. The teaching system has a stationary tactile sensor and a stationary reference object the coordinates of which are known and stored in the memory of the CPU. The second stationary reference object is used for defining an operational coordinate system. In the teaching operation, the positions of all working tools, objects, and processing units are determined in the operational coordinate system by sequentially seeking and touching the searchable tools, objects and units with a changeable tactile sensor for recording their coordinates in the CPU and for subsequent use of these coordinates in object processing operations.

Abstract: Proposed is a method of teaching an industrial robotic station with elimination of errors of assembling and installation as well as errors accumulated during operation for a predetermined operation time or a number of operation cycles. The method consists of providing a robotic station with a coordinate system fixed relative to the frame and all other stationary components including at least two reference objects, one of which is a tactile sensor and another is a hard body such as a hard spherical ball. A position of the center of the hard precision in the fixed coordinate system of the robotic station is determined via contact with a changeable tactile sensor attached to the coupling of the robot arm and is assumed as center of coordinates of an operative coordinate system which is then used for moving the robot arm to working positions memorized in a CPU and in accordance with a memorized sequence.

Abstract: Leveling and aligning device by which the distance at which a member is supported with respect to a base may be altered and firmly locked in the given adjustment without creating stresses in either the body of the member and the base or the device by itself. The leveling and aligning device allows continuation of the adjustment process even in case of inadvertent disengagement of components of the device.

Abstract: Leveling and aligning device by which the distance at which a member is supported with respect to a base may be altered and firmly locked in the given adjustment without creating any stresses in either the body of the member or the device by itself. The leveling and aligning device provides means allowing continuation of the adjustment process even in case of inadvertent disengagement of components of the device.

Abstract: A wafer gripping mechanism of the invention comprises a thin flat body having one linearly moveable and rotating finger for gripping an edge of the flat object and a pair of soft withdrawable object supporting pads. A distinguishing feature of the mechanism of the invention is that the wafer supporting pads are withdrawable for placing the pads into position where they do not project beyond the outlines of the external surface of the insertable portion of the gripper. The absence of elements projecting from the surface of the gripper portion insertable into narrow spaces with high speed protects the gripping mechanism, wafer, chuck, etc. from damage due to possible collision. All the drive and actuation mechanisms that are used for rotation and axial movement of the gripping finger, as well as for rotation of the withdrawable pads are enclosed in a thin hollow casing made from a thin and light-weight sheet metal.

Abstract: A precision soft-touch gripping mechanism has a mounting plate attached to a robot arm. The plate supports a stepper motor. The output shaft of the stepper motor is connected through a spring to an elongated finger that slides in a central longitudinal slot of the plate and supports a first wafer gripping post, while on the end opposite to the first wafer gripping post the mounting plate pivotally supports two L-shaped fingers with a second and third wafer gripping posts on their respective ends. The mounting plate in combination with the first sliding finger and two pivotal fingers forms the end effector of the robot arm which is thin enough for insertion into a wafer-holding slot of a wafer cassette. The end effector is equipped with a mapping sensor for detecting the presence or absence of the preceding wafer, wafer position sensors for determining positions of the wafer with respect to the end effector, and force sensors for controlling the wafer gripping force.

Abstract: The griping mechanism of the present invention comprises a thin flat body having two linearly moveable side fingers and a pair of rotating and linearly moveable distal fingers. In contrast to gripper of conventional design, the gripping mechanism of the invention is positioned over the object. In spite of an overhead position, the gripper is contamination-free since it has a completely closed design. In the vicinity of the gripping fingers, the mechanism is provided with soft edge-supporting pads having tapered surfaces for self-alignment and centering of the circular objects. The pads also eliminate surface contact between the wafer and the surface of the gripper body. The overhead position of the gripper makes it possible to simplify the construction of a wafer-holding chuck, e.g., on wafer processing stations.

Abstract: A precision soft-touch end effector has a mounting plate attached to a robot arm. The plate supports a stepper motor. The output shaft of the stepper motor is connected through a spring to an elongated finger that slides in a central longitudinal slot of the plate and supports a first wafer gripping post, while on the end opposite to the first wafer gripping post the mounting plate pivotally supports two L-shaped fingers with a second and third wafer gripping posts on their respective ends. The mounting plate in combination with the first sliding finger and two pivotal fingers forms the end effector of the robot arm which is thin enough for insertion into a wafer-holding slot of a wafer cassette. The end effector is equipped with a mapping sensor for detecting the presence or absence of the preceding wafer, wafer position sensors for determining positions of the wafer with respect to the end effector, and force sensors for controlling the wafer gripping force.

Abstract: The mapping sensor system of the invention is intended for use with a mechanical arm of an industrial robot which loads and unloads flat circular objects, such as semiconductor wafers, into and from wafer cassettes on operations of processing the semiconductor wafers in stand-alone or cluster machines used in semiconductor production. The mapping system consists of a light source, a light-receiving element, and a light beam shaper. The light source is installed on the front end of the robot arm and directs the light via the beam shaper to the leading edge of the semiconductor wafer. The beam reflected from the wafer edge is sensed by a light-receiving element, such as a photodiode. The shaper modifies the shape and the cross-section of the beam directed towards the wafer so as to provide reflection from the curvilinear surface of the edge, irrespective of the existence of the notch, most optimum for detection by the photodiodes and without generation of false signals.

Abstract: An apparatus of the invention is intended for multiple identical continuous records of characteristics on the surface of an object, e.g., a semiconductor wafer, after selected stages of manufacture and treatment. The apparatus is provided with a rotary table for rotation of the wafer with a mechanism for installing the wafer in a predetermined initial position for starting measurements from the same point after each selected stage of manufacture or treatment. The measurements are synchronized for all sequential manufacturing stages of the wafer and are carried out with the use of a resonance sensor based on the principles of resonance sensor technology. The recorded information is stored on a memory device, and if the final product has a defect or deviations, the stored information can be easily retrieved for revealing the time, place on the product, and the source of the defect.

Abstract: The invention describes an apparatus for preventing gripping of objects having wrong dimensions or orientation. The apparatus comprises a part handler, e.g., a holder for parts to be treated in a chemical reactor, where the parts has to be transferred from a working position to a temporary storage. The holder may have different shapes, e.g., rectangular, elliptical, or circular, and is provided with positioning openings or recesses for engagement with pins or semispherical elements on the engaging surface of the part handler. The apparatus is provided with at least two through beam optical sensor units with adjustable divergence of the light beams emitted from the light emitting to the light-receiving element. The sensor units are located near the edge area of the holder.

Abstract: An apparatus of the invention is intended for multiple identical continuous records of characteristics on the surface of an object, e.g., a semiconductor wafer, after selected stages of manufacture and treatment. The apparatus is provided with a rotary table for rotation of the wafer with a mechanism for installing the wafer in a predetermined initial position for starting measurements from the same point after each selected stage of manufacture or treatment. The measurements are synchronized for all sequential manufacturing stages of the wafer and are carried out with the use of a resonance sensor based on the principles of resonance sensor technology. The recorded information is stored on a memory device, and if the final product has a defect or deviations, the stored information can be easily retrieved for revealing the time, place on the product, and the source of the defect.

Abstract: A soft-touch gripping mechanism of the invention contains three gripping fingers arranged circumferentially around a circular flat object such as, e.g., a semiconductor wafer. The soft-tough force applied to the wafer from the gripping posts on the ends of the gripping fingers is controlled from a common force measurement sensor, e.g., a special position sensor that consists of a moveable magnetic flag attached to a pusher plate on the end of the output shaft of a linear stepper motor and a sensitive member, e.g. a Hall sensor chip that responds to the position of the magnetic flag. The Hall sensor produces an output voltage signal that is proportion to the position of the flag relative to the Hall sensor chip. The sensor is connected to a controller that also controls operation of the aforementioned linear stepper motor. The soft touch is achieved by transmitting the movement of the pusher to the linear fingers through a spring.

Abstract: The invention relates to an apparatus for measuring thickness and deviations from the thickness of thin conductive coatings on various substrates, e.g., metal coating films in semiconductor wafer or hard drive disks. The thickness films may be as small as fractions of microns. The apparatus consists of an inductive sensor and a proximity sensor, which are rigidly interconnected though a piezo-actuator used for displacements of the inductive sensor with respect to the surface of the object being measured. Based on the results of the operation of the proximity sensor, the inductive sensor is maintained at a constant distance from the controlled surface. Variations in the thickness of the coating film and in the distance between the inductive sensor and the coating film change the current in the inductive coil of the sensor.

Abstract: A precision soft-touch gripping mechanism has a mounting plate attached to a robot arm. The plate supports a stepper motor. The output shaft of the stepper motor is connected through a spring to an elongated finger that slides in a central longitudinal slot of the plate and supports a first wafer gripping post, while on the end opposite to the first wafer gripping post the mounting plate pivotally supports two L-shaped fingers with a second and third wafer gripping posts on their respective ends. The mounting plate in combination with the first sliding finger and two pivotal fingers forms the end effector of the robot arm which is thin enough for insertion into a wafer-holding slot of a wafer cassette. The end effector is equipped with a mapping sensor for detecting the presence or absence of the preceding wafer, wafer position sensors for determining positions of the wafer with respect to the end effector, and force sensors for controlling the wafer gripping force.

Abstract: The invention relates to an apparatus for measuring thickness and deviations from the thickness of thin conductive coatings on various substrates, e.g., metal coating films in semiconductor wafer or hard drive disks. The thickness films may be as small as fractions of microns. The apparatus consists of an inductive sensor and a proximity sensor, which are rigidly interconnected though a piezo-actuator used for displacements of the inductive sensor with respect to the surface of the object being measured. Based on the results of the operation of the proximity sensor, the inductive sensor is maintained at a constant distance from the controlled surface. Variations in the thickness of the coating film and in the distance between the inductive sensor and the coating film change the current in the inductive coil of the sensor.

Abstract: The mapping sensor system of the invention is intended for use with a mechanical arm of an industrial robot which loads and unloads flat circular objects, such as semiconductor wafers, into and from wafer cassettes on operations of processing the semiconductor wafers in stand-alone or cluster machines used in semiconductor production. The mapping system consists of a light source, a light-receiving element, and a light beam shaper. The light source is installed on the front end of the robot arm and directs the light via the beam shaper to the leading edge of the semiconductor wafer. The beam reflected from the wafer edge is sensed by a light-receiving element, such as a photodiode. The shaper modifies the shape and the cross-section of the beam directed towards the wafer so as to provide reflection from the curvilinear surface of the edge, irrespective of the existence of the notch, most optimum for detection by the photodiodes and without generation of false signals.