Abstract: A device includes a syringe, which has a tip, plunger, and barrel containing a fluid. The device also includes a needle electrode coupled to the tip of the syringe, a release component, and a control component configured to receive electrical measurements made by the needle electrode, determine impedance values from the electrical measurements, and identify a target tissue based on the impedance values. In response to the identification, the control component generates instructions to reposition a release component. A method includes receiving electrical measurements from a needle electrode, determining impedance values based on the electrical measurements. A target tissue is identified based on the impedance values, and a release component is repositioned in response.

Abstract: A device includes a syringe, which has a tip, plunger, and barrel containing a fluid. The device also includes a needle electrode coupled to the tip of the syringe, a release component, and a control component configured to receive electrical measurements made by the needle electrode, determine impedance values from the electrical measurements, and identify a target tissue based on the impedance values. In response to the identification, the control component generates instructions to reposition a release component. A method includes receiving electrical measurements from a needle electrode, determining impedance values based on the electrical measurements. A target tissue is identified based on the impedance values, and a release component is repositioned in response.

Abstract: Forming a thermal interface material structure includes forming an assembly that includes a thermal interface material disposed between a first mating surface and a second mating surface. The first mating surface is associated with a module lid, and the second mating surface is associated with a heat sink. Protruding surface features are incorporated onto the first mating surface or the second mating surface. The process also includes compressing the assembly to form a thermal interface material structure. The thermal interface material structure includes the thermal interface material disposed within an interface defined by the first mating surface and the second mating surface. The protruding surface features protrude from the first mating surface or the second mating surface into selected areas of the interface to limit relative movement of the mating surfaces into the selected areas during thermal cycling to reduce thermal interface material migration out of the interface.

Abstract: A device for preventing thermal run-away in a battery. The device includes a main compartment that is divided into a plurality of sub-compartments. A layer of material separates (i) a first sub-compartment containing a first chemical from (ii) a second sub-compartment containing a second chemical. In the event that a thermal run-away event is either detected or predicted, the layer of material degrades/is degraded and allows the chemicals to mix. The chemicals form an endothermic process that cools the battery preventing, or at least delaying, the thermal run-away event.

Abstract: A contained thermal interface material for pluggable applications, structures, and a method for implementing thermal coupling between components with a contained thermal interface material for pluggable applications are provided. A thermal interface material is combined with a metal member providing effective thermal coupling between components for plugging and unplugging thermal management applications.

Abstract: A process of utilizing heat-shielding microcapsules to protect a temperature sensitive component includes applying a shielding layer including heat-shielding microcapsules to a temperature sensitive component disposed on a surface of a printed circuit board. The process also includes performing a processing operation on the printed circuit board according to a set of process parameters. The set of process parameters specify a particular period of time (tL) that a processing temperature (TP) is to be maintained in excess of a liquidous temperature (TL) for solder reflow. During the processing operation, the heat-shielding microcapsules absorb heat to reduce a time above liquidous (TAL) of the temperature sensitive component.

Abstract: A contained thermal interface material for pluggable applications, structures, and a method for implementing thermal coupling between components with a contained thermal interface material for pluggable applications are provided. A thermal interface material is combined with a metal member providing effective thermal coupling between components for plugging and unplugging thermal management applications.

Abstract: Forming a thermal interface material structure includes forming an assembly that includes a thermal interface material disposed between a first mating surface and a second mating surface. The first mating surface is associated with a module lid, and the second mating surface is associated with a heat sink. Protruding surface features are incorporated onto the first mating surface or the second mating surface. The process also includes compressing the assembly to form a thermal interface material structure. The thermal interface material structure includes the thermal interface material disposed within an interface defined by the first mating surface and the second mating surface. The protruding surface features protrude from the first mating surface or the second mating surface into selected areas of the interface to limit relative movement of the mating surfaces into the selected areas during thermal cycling to reduce thermal interface material migration out of the interface.

Abstract: A process of forming a thermal interface material structure includes forming an assembly that includes a thermal interface material disposed between a first mating surface and a second mating surface. The first mating surface is associated with a module lid, and the second mating surface is associated with a heat sink. Protruding surface features are incorporated onto the first mating surface or the second mating surface. The process also includes compressing the assembly to form a thermal interface material structure. The thermal interface material structure includes the thermal interface material disposed within an interface defined by the first mating surface and the second mating surface. The protruding surface features protrude from the first mating surface or the second mating surface into selected areas of the interface to limit relative movement of the mating surfaces into the selected areas during thermal cycling to reduce thermal interface material migration out of the interface.

Abstract: A device for preventing thermal run-away in a battery. The device includes a main compartment that is divided into a plurality of sub-compartments. A layer of material separates (i) a first sub-compartment containing a first chemical from (ii) a second sub-compartment containing a second chemical. In the event that a thermal run-away event is either detected or predicted, the layer of material degrades/is degraded and allows the chemicals to mix. The chemicals form an endothermic process that cools the battery preventing, or at least delaying, the thermal run-away event.

Abstract: A device for preventing thermal run-away in a battery. The device includes a main compartment that is divided into a plurality of sub-compartments. A layer of material separates (i) a first sub-compartment containing a first chemical from (ii) a second sub-compartment containing a second chemical. In the event that a thermal run-away event is either detected or predicted, the layer of material degrades/is degraded and allows the chemicals to mix. The chemicals form an endothermic process that cools the battery, which at least delays the thermal run-away event. The device determines a delay period before thermal runaway is likely to occur and communicates that to a user.

Abstract: A process of forming a thermal interface material structure includes forming an assembly that includes a thermal interface material disposed between a first mating surface and a second mating surface. The first mating surface is associated with a module lid, and the second mating surface is associated with a heat sink. Protruding surface features are incorporated onto the first mating surface or the second mating surface. The process also includes compressing the assembly to form a thermal interface material structure. The thermal interface material structure includes the thermal interface material disposed within an interface defined by the first mating surface and the second mating surface. The protruding surface features protrude from the first mating surface or the second mating surface into selected areas of the interface to limit relative movement of the mating surfaces into the selected areas during thermal cycling to reduce thermal interface material migration out of the interface.